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Chemical additives and agents include a wide range of materials added to polymer resins, paints and coatings, or adhesives to modify specific processing or end-use properties.
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Cleaning agents and surface treatments includes liquid cleaners, degreasers, strippers, passivators, etchants, solutions and additives for cleaning and surface preparation.
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Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components.
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Conformal coatings encapsulate circuit boards and their electronic components in order to prevent the ingress of moisture, fungus, dust and other environmental contaminants.
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Electrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables. They also prevent unwanted current flow or leakage.
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Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
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Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
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Epoxy adhesives are chemical compounds for joining components. They require clean surfaces and are valued for their toughness and resistance to chemical and environmental damage.
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Finishing compounds are used to improve surface finish or flatness. They often consist of fine abrasives in slurry, bar, powder or paste forms.
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Glass materials have a random, liquid like (non-crystalline) molecular structure. They are heated to a temperature sufficient to produce a completely fused melt.
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Industrial adhesives are organic or inorganic chemical compounds for joining components. This category covers all adhesive types.
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Industrial coatings are thin films deposited upon materials to add or enhance desired properties, such as color, conductivity, corrosion resistance, etc.
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Industrial sealants are liquid or viscous compounds used between surfaces to contain fluids, prevent leaks, and prevent infiltration of unwanted material. They may also include compounds for filling gaps or seams.
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Plating and anodizing chemicals and supplies consist of metal salts, anodes and other consumables for the electro-deposition or electroplating of metal films or anodized layer formation.
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Resins and compounds are pellets, liquid resins, bulk molding compounds, or other unfinished materials that are ready for shape fabrication or bond formation.
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Semiconductor wet process equipment performs a variety of wet processing applications including etching, washing, chemical mechanical polishing (CMP), and spin coating in semiconductor or microelectronics manufacturing.
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Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
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