Reference Articles 1 - 64 of 64
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Tg - Glass Transition Temperature for Epoxies
From: Epoxy TechnologyDescription: The Glass Transition Temperature (Tg) is one of the most important properties of any epoxy and is the temperature region where the polymer transitions from a hard, glassy material to a soft, rubbery ...
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Silicone Based Insulation Mateiral for HIgh Speed/Voltage Rotating Machines
From: Arlon LLCDescription: This paper introduces the key requirements for resin rich electrical insulation materials for rotating machinery. The key requirements, or stresses that insulation are subject to, are summarized as ...
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Using Mold Release Agents with Epoxy Adhesives
From: Epoxy TechnologyDescription: Epoxy adhesives are universally known for their high strength and toughness in bonding a wide variety of substrates found in semiconductor and electronics assembly. Although an epoxies inherent nature ...
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Electronic Enclosures - Closing the Door on Sealing Problems
From: Elasto Proxy Inc.Description: Some manufacturers of electronic cabinets use off-the-shelf weatherstripping to seal gaps between the housing and door. Often, these weatherstrip materials are just fillers that form a static seal. ...
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PYROID HT Pyrolytic Graphite Thermal Management Material Heat Sink Application
Description: A major avionics customer with a high power load application was experiencing elevated temperatures (>150 oC) and non uniform heat distribution in the base of an existing aluminum heat sink. As a ...
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Reflectance Characteristics of Accuflect Light Reflecting Ceramic
From: Accuratus CorporationDescription: Discussion of the reflectance of Accuflect light reflecting ceramic from the near ultraviolet to the short wave infrared. ...
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Epoxy and Silicone Interactions
From: Epoxy TechnologyDescription: Epoxy adhesives are a great choice for many applications for their excellent adhesion, chemical and temperature resistance, as well as many other attributes. When selecting an epoxy for a specific ...
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Adding Solder to a NanoBond® Assembly
From: Indium CorporationDescription: One of the biggest misconceptions about NanoFoil® is that it is a form of solder. While it may contain a solder coating if specified (usually tin), it is really a heat source. ...
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Epoxy Adhesive Applications Guide
From: Epoxy TechnologyDescription: This guide is an educational tool designed to assist adhesive users in gaining a more thorough understanding of adhesive properties and testing. ...
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Solder Reflow Information
From: Skyworks Solutions, Inc.Description: Assembly of a surface mount device depends on many process material and equipment parameters. Two of the most common processes used are infrared (IR) and convection reflow. Skyworks products come in ...
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Highly Conductive Insulation for Large, High-Speed Machines
From: Arlon LLCDescription: Silicone-impregnated fiberglass insulation has long been used as stator-coil electrical-insulation for low-voltage, direct current, traction motors. Silicone-based insulation is particularly suited ...
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Silicone Rubber Thermal Interface Materials: Applications and Performance Considerations
From: Arlon LLCDescription: Simple composits of silicone rubber, extending filler, and fiberglass offer an attractive combination of thermal, physical, and electric properties that make these materials an ideal choice for use as ...
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Void Reduction during Low Pressure Lamination of Electronic Assemblies
From: Arlon LLCDescription: Void content at the interface of the bonding adhesive and rigid substrate of an electronic assembly can affect critical performance metrics such as thermal transfer, bond strength, and stress ...
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B-stage Epoxy
From: Epoxy TechnologyDescription: B-staged epoxy resin is a descriptive term used to define a one component epoxy system, using a latent (low reactivity) curing agent. This unique product can be partially cured (sometimes referred to ...
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How to Reduce Voiding in Components with Large Pads
From: Indium CorporationDescription: As the electronics industry moves toward miniaturization and multifunction, smaller components with more functions, such as quad-flat no-leads (QFNs) and LGAs, are increasingly used in a variety of ...
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Continuous Improvement of Material Characterization Methodology through Gage Repeatability and Reproducibility Studies
From: Skyworks Solutions, Inc.Description: Reliable metrology data such as layer thickness and composition measured by X-ray diffraction (XRD), sheet resistance measured by Eddy current, and qualitative pHEMT epi parameters measured by ...
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Effects of Electron Radiation Generated during E-beam Evaporation on a beam Evaporation on a
From: Skyworks Solutions, Inc.Description: In compound semiconductor manufacturing, metallized wafers are put through a wet strip process in Nmethyl pyrrolidone (NMP) to dissolve the photoresist, liftoff the unwanted metals, and to form the ...
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Electron Radiation as an Indicator of Gold Nodule Defect during E-beam Evaporation
From: Skyworks Solutions, Inc.Description: Gold (Au) nodule defects are a common problem during metal deposition by evaporation. Small Au spheres, often referred to as spits in the semiconductor industry, can be ejected from the molten source ...
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Improving Organizational Performance Through Goal Deployment
From: Skyworks Solutions, Inc.Description: Exceptional performance of a manufacturing facility doesn't just happen. It requires effective management of all the various factors, constraints and resources. One important aspect of management is ...
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Interlevel Dielectric Processes Using PECVD Silicon Nitride, Polyimide, and Polybenzoxazole for GaAs HBT Technology
From: Skyworks Solutions, Inc.Description: Multiple factors need to be considered when selecting an interlevel dielectric material for GaAs semiconductor device fabrication including what the electrical, mechanical, chemical, thermal, and cost ...
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Plating Showerhead System for Improved Backside Wafer Plating
From: Skyworks Solutions, Inc.Description: Plating thickness uniformity can become increasingly difficult to control when migrating from four inch to six inch wafers, especially when plating through-wafer vias with non-cyanide gold bath ...
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Six-Sigma Methodologies Support Back-End Yield and Quality Metrics Improvement
From: Skyworks Solutions, Inc.Description: Six-sigma methodologies lead to understanding of root causes of yield loss in the back-end process. A datadriven decision making process is used to allocate resources and to optimize process flows. As ...
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Take Another Look
From: Skyworks Solutions, Inc.Description: THE USE OF several strategies to monitor and improve the overall effectiveness of a quality management system is included in ISO 9001, paragraph 8, "Measurement Analysis and Improvement."1 Two of ...
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Web-Based Business Intelligence for Semiconductor Manufacturing
From: Skyworks Solutions, Inc.Description: Business Intelligence (BI) is a relatively new concept that has received a tremendous amount of coverage in recent manufacturing publications. The use of an integrated knowledge base in establishing ...
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Understanding Mechanical Properties of Epoxies for Modeling, Finite Element Analysis (FEA)
From: Epoxy TechnologyDescription: The unique molecular structure of epoxy allows for a large variety of mechanical properties through varying formulations. ...
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Understanding Optical Properties for Epoxy Applications
From: Epoxy TechnologyDescription: Optical or unfilled epoxy adhesives are commonly used for adhering various substrates, encapsulating components and providing protective coatings in several optical applications. ...
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Voiding Control for QFN Assembly
From: Indium CorporationDescription: Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size, such as a near die-sized ...
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Solder Powder: IPC
From: Indium CorporationDescription: Solder powder particle size and shape impacts the functionality of solder paste in many ways: printing/dispensing/dipping; solderballing; graping; voiding; tack and so on. For this reason, I just ...
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Static Electricity and Ways to Prevent it
From: Adchem CorporationDescription: As users and converters of pressure sensitive tapes, we need to understand static electricity: where it develops, the dangers associated with it, and, of course, ways to control it. Static electricity ...
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Availability of Indium and Gallium
From: Indium CorporationDescription: During 2010, Indium production continued steadily at a rate of about 500 metric tonnes (mt) per year. Production could have been expanded, had there been a need for higher quantities. ...
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Humidity and Solder Paste - Avoid Issues
From: Indium CorporationDescription: As a rule, solder pastes and solder flux (tacky flux), be they no-clean (rosin/resin based) or water washable, do not react well to moisture. ...
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Using UV Blocking to Prevent Skin & Eye Damage from Entertainment or Medical Lighting
From: Abrisa TechnologiesDescription: Throughout the past few decades, it has been established that people are being damaged by ultraviolet light from the sun, and so we are being encouraged by the medical industry to take protective ...
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LuxVu Transparent Window Heaters (.pdf)
From: Abrisa TechnologiesDescription: LuxVu Transparent Heater Windows mitigate the adverse effect of cold weather on the functionality and visi-bility of outdoor security cameras. Environmental concerns are regularly an issue when ...
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How to Protect Museum Quality Artwork with UV Blocking Glass (.pdf)
From: Abrisa TechnologiesDescription: This Tech Notes explains what UV blocking glass is, and how it interacts with UV light to act as a protectant. ...
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Index Matching Gel and Mechanical Fiber Splice Technology for Last Mile FTTH (.pdf)
From: Nye Lubricants, Inc.Description: Index matching gel (IMG) is a fundamental fiber to the home (FTTH) component for meeting the immediate needs of both last mile build out and long-term network operations. IMG is a "light bridge" in ...
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Optical Gels: A Light Bridge to the Future (.pdf)
From: Nye Lubricants, Inc.Description: Design engineers throughout the photonics industry are discovering something that 3M, Lucent Technologies, and other manufacturers of fiber optic splices learned in the 1980s: Index- matching gels are ...
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Seeing the Light (.pdf)
From: Nye Lubricants, Inc.Description: When reflection and refraction threaten to compromise light-based technologies, index-matching optical gels and fluids can help the light get through. ...
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Conversion in Aguai (.pdf)
From: Nye Lubricants, Inc.Description: Claudio Olivio Mattiazzi, the maintenance supervisor at Ibéria Industria de Embalagens Ltda, was caught between the proverbial rock and hard place. He saw the advantages of converting bearing ...
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The Role of Bearing & Scan Mechanism Life Testing in Flight Qualification of the MODIS Instrument (.pdf)
From: Nye Lubricants, Inc.Description: This paper describes the results of accelerated and operational life tests on bearings for the Moderate Resolution Imaging Spectroradiometer (MODIS). It also describes the post test analysis of the ...
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3M Novec™ Electronic Coating EGC-1700 (.pdf)
From: JARO Corp.Description: 3M™ Novec™ Electronic Coating EGC-1700 is a clear, low viscosity solution of a fluorochemical acrylate polymer coating carried in a hydrofluoroether solvent. The solvent is nonflammable, ...
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Wafer & Substrate Bumping with Solder Paste
From: Indium CorporationDescription: This week's topic is both wafer bumping and substrate bumping with solder paste, and the issue of powder size. I've recently been dealing with some issues from customers who are concerned with the ...
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Heat Sink Design - Aluminum Extrusions (.pdf)
From: Thermshield, LLCDescription: The purpose of this technical brief is to give the new designer or engineer the basics in the limitations of designing an aluminum extrusion. Extrusions are 2 dimension shapes that can be fabricated ...
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Eliminate Lead-free Wave Soldering
From: Indium CorporationDescription: The advent of lead-free soldering presents many manufacturers with the need to wave solder using lead-free alloys. These alloys melt and are soldered at temperatures well above conventional SnPb ...
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Hernon Supertacker Used in UConn Application
Description: Hernon® Supertacker® adhesives has become involved in the development of the GlueX photon beam line at the University of Connecticut. The GlueX project is intended to quantify understanding ...
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A Compact Ultrasonic Transducer using the Active Piezoceramic Material as an Electronic Carrier (.pdf)
From: Epoxy TechnologyDescription: The integration of sensor and electronics is important to reduce size, cost and power consumption for a measurement system. Sensors based on piezoelectric ceramic materials traditionally have a low ...
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Epoxies for OptoElectronic Packaging: Applications and Material Properties (.pdf)
From: Epoxy TechnologyDescription: Epoxies are used in the packaging and assembly of three opto-electronic devices, including Fiber Optics, LEDs, and LCDss. In fiber optics, you need epoxy for the cable and for the opto-packaging. The ...
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Luxeon Emitter Assembly Information (.pdf)
From: Epoxy TechnologyDescription: Luxeon Emitters dissipate approximately 1W of thermal energy and therefore heatsinking and thermal design is critical when using Luxeon Emitters to create Power Light Sources. ...
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P-45: Assembly of an XGA 0.9" LCoS Display using Inorganic Alignment Layers for VAN LC (.pdf)
From: Epoxy TechnologyDescription: An assembly process for LCoS microdisplays using inorganic alignment layers has been developed. The specific problems emerging when using this approach were identified and solved. This enables the ...
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Reliability and Degradation of Organic Light Emitting Devices (.pdf)
From: Epoxy TechnologyDescription: Since efficient green electroluminescence ~EL! from an organic light emitting device (OLED) was first reported, there has been considerable interest in utilizing OLEDs for full color flat panel ...
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Compatibility of Medical Devices and Materials with low-Temperature Hydrogen Peroxide Gas Plasma (.pdf)
From: Epoxy TechnologyDescription: Manufacturers can draw from a broad spectrum of techniques to sterilize and disinfect medical devices, and new physical and chemical processes continue to be developed. A leading reason for this ...
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Preventing Adhesive Resin Bleed in Microelectronics Assembly through Gas Plasma Technology (.pdf)
From: Epoxy TechnologyDescription: Screen print patterning is an attractive alternative to traditional semiconductor photo-lithography. Our work compared the pattern resolution and mechanical resistance of screen-printed polymers ...
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The Resurgence of LCOS Displays (.pdf)
From: Epoxy TechnologyDescription: After more than a decade of R&D and limited commercialization, liquid-crystal-on-silicon (LCOS) technology is fast becoming a compelling display-technology option for applications that require ...
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Fabricating Large Arrays of Microwells with Arbitrary Dimensions and Filling Them Using Discontinuous Dewetting (.pdf)
From: Epoxy TechnologyDescription: This paper describes the fabrication of large (up to 45 cm2) arrays of microwells, with volumes as small as 13 fL/well and densities as high as 107 wells/cm2. ...
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Optically Bonding Electronic Displays
From: Dontech IncorporatedDescription: Over-frame bonding - uses the original metal frame of the LCD for mechanical support. A sealant is used to prevent ingress of the bonding adhesives into the display electronics. The cover glass rests ...
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Eliminating Solder Paste Hang-Up on Squeegee Blades (.pdf)
From: Indium CorporationDescription: Paste hang up is when solder paste adheres to the squeegee blade after lift-up from stencil. ...
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Optimizing Reflow (.pdf)
From: Indium CorporationDescription: A typical reflow profile consists of four stages: preheat, soak or dryout, reflow, and cooling. Understanding these four stages is essential when designing an effective thermal profile. ...
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Soft Solder Die-Attach (.pdf)
From: Indium CorporationDescription: Power semiconductor devices are ubiquitous in electronic equipment running over 10Watts. These power devices convert AC to DC, and vice versa; regulate voltage; switch high currents on and off; and ...
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Thermal Interface Materials (.pdf)
From: Indium CorporationDescription: Thermal Interface Materials (TIMs) are used to efficiently transmit heat from an area of high thermal energy to an area of lower thermal energy. These materials are often used to conduct heat away ...
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Variables of Pin Transfer (.pdf)
From: Indium CorporationDescription: Pin transfer is a way of selectively depositing a semi-solid or liquid material (like a solder paste or ball-attach flux) onto a substrate. It is commonly used to apply flux to BGA (ball-grid-array) ...
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Eliminating Flux Residue in OPTO-Electronic Packages (.pdf)
From: Indium CorporationDescription: With the advent of opto-electronic hermetic packages, it has become necessary to significantly reduce, if not eliminate, foreign materials that can cause reliability problems on the optical components ...
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Fluxless Soldering (.pdf)
From: Indium CorporationDescription: Some applications are very sensitive to the use of a flux due to the post reflow residue that may be present. Also, flux may be a problem in a vacuum environment or in an application in which it must ...
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Indium Thermal Interface Materials (.pdf)
From: Indium CorporationDescription: Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it ...
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Preform Packaging Guide (.pdf)
From: Indium CorporationDescription: Packaging is a key element in the design of a solder preform. With the proper packaging, preforms can be efficiently introduced into any manufacturing process. It is also essential to the protection ...
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Color Stability of Transparent High Heat Polycarbonate in Automobile Lens Applications (.pdf)
From: SABICDescription: Novel and versatile developments in automotive lighting applications demand new material solutions to meet industry requirements. Color stability of a new transparent high heat polycarbonate copolymer ...
