CKT has designed the CKT2170 Series specifically for high-volume interconnection testing of high-density printed wiring devices such as ceramic substrates, chip-carriers, multi-chip modules, liquid crystal displays, etc. A system for testing chip-carriers is illustrated above.

The CKT2170 Series systems are turn-key systems consisting of either a manual or automatic product handler, probing heads and integrated CKT2175 test electronics. The mechanical portions of the systems will generally be customized according to product form factors, test throughput requirements, test point density and alignment requirements. The CKT2175 test electronics are the standard electronics, with the form-factor of the switching cards is customized in order to fit a specific packaging requirement.