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BGA Switch-A-Pitch™ Adapters
from Aries Electronics, Inc.

FEATURES. Reduce high-density interconnect (HDI) construction by adapting smaller pitch devices to larger footprints. Convert 0.4mm and 0.5mm pitch footprints to 1mm or 1.27mm pitch (Please contact factory for other pitch requirements). Enable the use of standard line and trace spacing. Eliminate... [See More]

  • Contact Plating: None
  • Mounting: SMT
  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
MC-27 [MC-27 from Components Corporation]
from bisco industries

The MC-27 fuse clip provides a rugged, economical and reliable method for the termination of fuses on printed circuit boards. Formed from the highest quality beryllium copper alloy, the MC-27 series is superior in spring quality to its stamped counterparts at less cost. Unlike traditional... [See More]

  • Contact Plating: None
  • RoHS Compliant: RoHS Compliant
  • Product Type: Pin Probes
  • Mounting: Through-Hole
PCB Kay Micro Pin -- 1218
from Keystone Electronics Corp.

Precision engineered and manufactured. Space saving design for high density packaging. Micro pins are available in .017 (.43) to .080 (2.03) diameters. Ideal for mating with our standard line of micro jacks. Available for press-fit, swage or solder mounting. Custom micro pins manufactured to your... [See More]

  • Contact Plating: None
  • RoHS Compliant: RoHS Compliant
  • Product Type: PCB Pins
  • Mounting: Press-fit / Solderless Technology
MC-27
from Components Corporation

The MC-27 fuse clip provides a rugged, economical and reliable method for the termination of fuses on printed circuit boards. Formed from the highest quality beryllium copper alloy, the MC-27 series is superior in spring quality to its stamped counterparts at less cost. Unlike traditional... [See More]

  • Contact Plating: None
  • RoHS Compliant: RoHS Compliant
  • Product Type: Pin Probes
  • Mounting: Through-Hole