from Master Bond, Inc.
Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]
- Chemical System: Polyphenylene Sulfide; Epoxy; Polyurethane
- Cure / Technology: Two Component
- Composition: Filled
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Thermally Conductive; Anti-static, ESD