Non-Drip, Polysulfide Based Two Component Adhesive -- EP21TPND
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]

  • Chemical System: Polyphenylene Sulfide; Epoxy; Polyurethane
  • Cure / Technology: Two Component  
  • Composition: Filled
  • Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Thermally Conductive; Anti-static, ESD