Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Sealant
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Permabond 798 Cyanoacrylate -- 798 1LB BOTTLE
from Ellsworth Adhesives

Permabond 798 provides extremely fast cure independent of gap. Particularly well-suited for use on porous substrates, since it fixtures before wicking into the surface pores. 1 pound bottle. [See More]

  • Features: Non-corrosive
  • Cure / Technology: Single Component; Reactive or Moisture Cured
  • Chemical System: Cyanoacrylate
  • Type / Form: Liquid
Abrasion Resistant UV Curable Coating System -- UV11-3
from Master Bond, Inc.

Master Bond UV14-3 is a new one component, flexible, UV curable polymer system for bonding, sealing and coating with the convenient feature of being readily removable by most conventional solvents. It is a 100% reactive, moderate viscosity liquid at ambient temperatures which does not contain any... [See More]

  • Features: High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
RTV-1 Silicone Rubber / Adhesive and Sealant -- ELASTOSIL® N 2199
from Wacker Chemical Corp.

ELASTOSIL ® N2199 is a one-part, nonslumping paste that cures at room temperature to a permanently flexible silicone rubber on exposure to atmospheric moisture. Special features. neutral curing system (alkoxy). solvent-free. non-slump. excellent unprimed adhesion to many plastic, metal, glass,... [See More]

  • Features: Non-corrosive; Sealant
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Chemical System: Elastomeric; Silicone
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Textiles or Fabrics
Thermal Interface Materials -- DTIM Series
from Device Technologies, Inc.

The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]

  • Features: Flexible; Flame Retardant; Non-corrosive; Thermally Conductive
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component; Adhesive Tape
AFFINITY GA Polyolefin Plastomers -- AFFINITY™ GA 1900
from Dow Elastomers

When it comes to packaging and molded products, customers demand high performance goods, while you need cost effective and easy to process components. AFFINITY ™ Polyolefin Plastomers can help you address this need. AFFINITY offers excellent adhesion at high and low temperatures, outstanding... [See More]

  • Features: Flexible; Laminaes; Non-corrosive
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyolefin
  • Cure / Technology: Thermoplastic / Hot Melt; Two Component  
PERMABOND 2010
from Glotrax Polymers Inc.

Non-drip rheology formula, excellent for use on porous surfaces, high viscosity, fast cure. Applications include bonding most metals, plastics, and rubber and for use on vertical applications. Fixture time 30 minutes, cull cure time 4 hours, shear strength 2000 psi. [See More]

  • Features: Non-corrosive
  • Composition: Unfilled
  • Chemical System: Cyanoacrylate
  • Cure / Technology: Air Setting / Film Drying; Single Component; Reactive or Moisture Cured
Electrically Conductive Adhesive -- 5420
from Henkel Corporation - Electronics

For bonding temperature sensitive components [See More]

  • Features: Electrically Conductive; Encapsulant, Potting Compound; Non-corrosive; Sealant
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Silicone Sealant -- RTV 400-100
from Novagard Solutions

Non-corrosive, single component oxime silicon sealant and/or adhesive [See More]

  • Features: High Dielectric; Non-corrosive; Sealant; UL Rating
  • Composition: Unfilled
  • Chemical System: Elastomeric; Silicone
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing