Aerospace Industrial Adhesives Datasheets

609™ Retaining Compound -- 60921 [60921 from Henkel Corporation - Industrial]
from Applied Industrial Technologies

10 mL Bottle; Green; Low Viscosity Retaining Compound That Bonds Rigid Metal Assemblies; Ideal for Gap Distances Up to .005" Diameter; Fixtures in 10 min; Easily Joins Dissimilar Metals [See More]

  • Industry: Aerospace; Automotive; Electronics; Marine; Sanitary; Military; Optical; Photonics; OEM or Industrial
  • Cure / Technology: Anaerobic; Thermoplastic / Hot Melt; Single Component
  • Chemical System: Acrylic
  • Type / Form: Liquid
Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Industry: Aerospace; Automotive; Electric Power; Marine; OEM or Industrial
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Electrically Conductive, Flexible Epoxy -- EPO-TEK® H20E-PFC
from Epoxy Technology

EPO-TEK ® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method. [See More]

  • Industry: Aerospace; Electronics; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Custom Epoxy Resin
from Gabriel Performance Products, LLC

Specialty Chemicals. Specialized Focus. Specialty chemicals are what we do and who we are, which has made us a leader in performing complex organic synthesis to provide the highest quality products to meet your exacting custom manufacturing requirements. Need to scale up from lab to pilot to larger... [See More]

  • Industry: Aerospace; Automotive; Sanitary; Petrochemical, Personal Care, Chemical
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
Acid Resistant, Two Component Epoxy -- EP21AR
from Master Bond, Inc.

Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Construction; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
3M™ Fastbond™ Contact Adhesive -- 2000NF
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Fastbond ™ Contact Adhesive 2000NF Blue is a water-dispersed, high solids, activated adhesive. Provides immediate bonding and handling strength bonds flexible polyurethane and latex foams, plastic laminate, wood, plywood, without forced drying equipment. [See More]

  • Industry: Aerospace; OEM or Industrial
  • Cure / Technology: Two Component  ; Contact or Pressure Sensitive Adhesives
  • Chemical System: Elastomeric
  • Type / Form: Liquid
Carton Adhesive -- 876
from Aervoe Industries Incorporated

Strong, flexible, waterproof, permanent/temporary bonds, won't bleed, stain [See More]

  • Industry: Aerospace; Automotive; Asbestos Abatement
  • Features: Laminaes
  • Cure / Technology: Air Setting / Film Drying; Single Component
  • Substrate Compatibility: Metal; Plastic; Porous Surfaces; Carpet, Wallpaper, Upholstery, Leather
Double/Bubble® Epoxy Adhesive -- 4007 [4007 from Royal Adhesives and Sealants LLC]
from All-Spec Industries

"//www.youtube.com/watch?v=wvxiOBwXWF4"" > Hardman Double/Bubble Epoxy Demonstration" [See More]

  • Industry: Aerospace; Automotive; Marine
  • Cure / Technology: Air Setting / Film Drying; Two Component  
  • Chemical System: Epoxy
  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
Pyro-Weld™ -- 657-FST
from Aremco Products, Inc.

Curing takes place at room temperature in 30-45 minutes [See More]

  • Industry: Aerospace; Automotive; Construction
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Room Temperature Vulcanizing or Curing
Electrically Insulating Epoxy Adhesive -- 50-3122
from Epoxies Etc...

50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205 °C. 50-3122 is... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
MAGNOBOND 6398
from Glotrax Polymers Inc.

Magnobond 6398, Parts A & B is a two component thixotropic paste epoxy system designed for bonding metals and composite structures. Magnobond 6398 has good properties at high and low temperatures using a room temperature cure. Applications include insertion filling, composite repair manfacture, and... [See More]

  • Industry: Aerospace; Automotive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Air Setting / Film Drying; Thermoset; Two Component  
Cylinlock® -- 822
from Hernon Manufacturing, Inc.

Cylinlock ® Retaining Compounds are highly engineered, 100% active, high strength anaerobic liquids that cure to a. tough plastic when air is excluded. The plastic shim formed when Cylinlock ® cures fills the voids present in even the. best shrink or press fits. These compounds also find... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Tooling
  • Composition: Unfilled
  • Chemical System: Dimethacrylate Ester; Acrylic
  • Cure / Technology: Anaerobic; Thermoset; Single Component; Room Temperature Vulcanizing or Curing
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Industry: Aerospace; Automotive; Electronics; Military; Construction; OEM or Industrial; Electronic Encapsulants
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Epoxy-Lock®
from ND Industries, Inc.

Meets IFI 125 & 525 standards, exceptional locking power [See More]

  • Industry: Aerospace; Automotive; Marine; Construction; OEM or Industrial
  • Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
KE 3498 RTV
from Shin-Etsu Silicones of America

Good for insulating power and control cable connections [See More]

  • Industry: Aerospace; Automotive; OEM or Industrial
  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Type / Form: Liquid