Aerospace Industrial Adhesives Datasheets

609™ Retaining Compound -- 60921 [60921 from Henkel Corporation - Industrial]
from Applied Industrial Technologies

10 mL Bottle; Green; Low Viscosity Retaining Compound That Bonds Rigid Metal Assemblies; Ideal for Gap Distances Up to .005" Diameter; Fixtures in 10 min; Easily Joins Dissimilar Metals [See More]

  • Industry: Aerospace; Automotive; Electronics; Marine; Sanitary; Military; Optical; Photonics; OEM or Industrial
  • Cure / Technology: Anaerobic; Thermoplastic / Hot Melt; Single Component
  • Chemical System: Acrylic
  • Type / Form: Liquid
Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Industry: Aerospace; Automotive; Electric Power; Marine; OEM or Industrial
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Electrically Conductive, Flexible Epoxy -- EPO-TEK® H20E-PFC
from Epoxy Technology

EPO-TEK ® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method. [See More]

  • Industry: Aerospace; Electronics; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Custom Epoxy Resin
from Gabriel Performance Products, LLC

Specialty Chemicals. Specialized Focus. Specialty chemicals are what we do and who we are, which has made us a leader in performing complex organic synthesis to provide the highest quality products to meet your exacting custom manufacturing requirements. Need to scale up from lab to pilot to larger... [See More]

  • Industry: Aerospace; Automotive; Sanitary; Petrochemical, Personal Care, Chemical
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
3M™ Fastbond™ Contact Adhesive -- 2000NF
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Fastbond ™ Contact Adhesive 2000NF Blue is a water-dispersed, high solids, activated adhesive. Provides immediate bonding and handling strength bonds flexible polyurethane and latex foams, plastic laminate, wood, plywood, without forced drying equipment. [See More]

  • Industry: Aerospace; OEM or Industrial
  • Cure / Technology: Two Component  ; Contact or Pressure Sensitive Adhesives
  • Chemical System: Elastomeric
  • Type / Form: Liquid
Carton Adhesive -- 876
from Aervoe Industries Incorporated

Strong, flexible, waterproof, permanent/temporary bonds, won't bleed, stain [See More]

  • Industry: Aerospace; Automotive; Asbestos Abatement
  • Features: Laminaes
  • Cure / Technology: Air Setting / Film Drying; Single Component
  • Substrate Compatibility: Metal; Plastic; Porous Surfaces; Carpet, Wallpaper, Upholstery, Leather
Double/Bubble® Epoxy Adhesive -- 4007 [4007 from Royal Adhesives and Sealants LLC]
from All-Spec Industries

"//www.youtube.com/watch?v=wvxiOBwXWF4"" > Hardman Double/Bubble Epoxy Demonstration" [See More]

  • Industry: Aerospace; Automotive; Marine
  • Cure / Technology: Air Setting / Film Drying; Two Component  
  • Chemical System: Epoxy
  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
Pyro-Weld™ -- 657-FST
from Aremco Products, Inc.

Curing takes place at room temperature in 30-45 minutes [See More]

  • Industry: Aerospace; Automotive; Construction
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Room Temperature Vulcanizing or Curing
Electrically Insulating Epoxy Adhesive -- 50-3122
from Epoxies Etc...

50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205 °C. 50-3122 is... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
MAGNOBOND 6398
from Glotrax Polymers Inc.

Magnobond 6398, Parts A & B is a two component thixotropic paste epoxy system designed for bonding metals and composite structures. Magnobond 6398 has good properties at high and low temperatures using a room temperature cure. Applications include insertion filling, composite repair manfacture, and... [See More]

  • Industry: Aerospace; Automotive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Air Setting / Film Drying; Thermoset; Two Component  
Cylinlock® -- 822
from Hernon Manufacturing, Inc.

Cylinlock ® Retaining Compounds are highly engineered, 100% active, high strength anaerobic liquids that cure to a. tough plastic when air is excluded. The plastic shim formed when Cylinlock ® cures fills the voids present in even the. best shrink or press fits. These compounds also find... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Tooling
  • Composition: Unfilled
  • Chemical System: Dimethacrylate Ester; Acrylic
  • Cure / Technology: Anaerobic; Thermoset; Single Component; Room Temperature Vulcanizing or Curing
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Industry: Aerospace; Automotive; Electronics; Military; Construction; OEM or Industrial; Electronic Encapsulants
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Epoxy-Lock®
from ND Industries, Inc.

Meets IFI 125 & 525 standards, exceptional locking power [See More]

  • Industry: Aerospace; Automotive; Marine; Construction; OEM or Industrial
  • Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
KE 3498 RTV
from Shin-Etsu Silicones of America

Good for insulating power and control cable connections [See More]

  • Industry: Aerospace; Automotive; OEM or Industrial
  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Type / Form: Liquid