3M™ High Tack Pressure Sensitive Adhesive 3794B Light Tan, 16 loaves, 34 Pounds per case Bulk -- 62379466303
from 3M Industrial Adhesives & Tapes Canada

3M ™ High Tack Pressure Sensitive Adhesive 3794B is a 100% solids thermoplastic, general purpose, high tack, pressure sensitive adhesive that can be spray or bead applied. Sprayable. High tack pressure sensitive adhesive (PSA). 100 percent solids. Woodworking, furniture, automotive,... [See More]

  • Industry: Electronics; Military; Construction; OEM or Industrial
  • Cure / Technology: Contact or Pressure Sensitive Adhesives
  • Chemical System: Block Co-Polymer
  • Type / Form: Pellets
2 Ton®Clear Epoxy -- 14310 [14310 from ITW Devcon]
from Applied Industrial Technologies

x [See More]

  • Industry: Electronics
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
Thermal Interface Materials -- DTIM Series
from Device Technologies, Inc.

The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]

  • Industry: Aerospace; Electronics; Sanitary; Military; OEM or Industrial; Telecommunications, IT
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component; Adhesive Tape
Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Aerospace; Electronics; Military; OEM or Industrial
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
FTLV with HARDENER Casting System Kit -- 90-004074
from Ellsworth Adhesives

Sold as a case (4 Kits/case). OXY-CAST 6850 FTLV with HARDENER XL is a low viscosity, versatile epoxy casting system that exhibits unusually high thermal conductivity and low thermal expansion. Gallon kit. [See More]

  • Industry: Electronics; Electric Power
  • Cure / Technology: Air Setting / Film Drying; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type / Form: Liquid
Electrially Insulative Epoxy -- OD1001
from Epoxy Technology

A single component, thermally and electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, several weeks of pot life and low modulus are a few of it traits. It is particularly suitable for bonding, sealing and potting ferrite cores in power device... [See More]

  • Industry: Electronics; Optical; Photonics; Semiconductors, IC's
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermal Insulation
Hapflex™ 1000 Series High Performance Hybrid Elastomeric Polymer Alloy -- 1021
from Hapco, Inc.

HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]

  • Industry: Electronics; OEM or Industrial; Tooling
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
INSULBOND 5-171-1 Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 5-171-1 is a clear, flowable epoxy resin adhesive designed for applications that require a high degree of peel strength, flexibility, and ability to bond to varied substrates. Curable at room temperature or mild oven temperatures, INSULBOND 5-171-1 retains its flexibility over a very broad... [See More]

  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type / Form: Liquid
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
3M EPX DP-460 EG OFFWHT; 37ML DUO-PAK EPXY -- 048011-65138
from R. S. Hughes Company, Inc.

3M EPX DP-460 EG OFFWHT; 37ML DUO-PAK EPXY. [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
Adhesive -- ELASTOSIL® RT 705 F
from Wacker Chemical Corp.

ELASTOSIL ® RT 705 f is a flowable, additioon curing, thermally curing, one-component silicone rubber. Special characteristics. Ready-to-use, one-component. Flowable. High extrusion rate. Fast curing at high temperatures. Good heat stability. Excellent primerless adhesion to many substrates. [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Elastomeric; Silicone
  • Viscosity: 20000 to 40000
3M™ Acrylic Thermal Interface Pad -- 5589H
from 3M Electronics Design & Manufacturing

3M ™ Thermally Conductive Interface Pad 5589H is a thermally conductive acrylic elastomer based interface pad. It has very high thermal conductivity, good electrical insulation properties and is ideally suited for applications that require non-silicone properties. 2.0 W/mK [See More]

  • Industry: Electronics
  • Cure / Technology: Contact or Pressure Sensitive Adhesives
  • Chemical System: Acrylic
  • Type / Form: Sheet or Film
20419 [20419 from Henkel Corporation]
from All-Spec Industries

Tak Pak instant adhesive 444 for PCB assembly and repair [See More]

  • Industry: Electronics
  • Cure / Technology: Air Setting / Film Drying
  • Composition: Unfilled
  • Type / Form: Liquid
CA-020 Instant Adhesive
from Anti-Seize Technology

Most versatile instant adhesive, fast overall cure speed, regular viscosity [See More]

  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Air Setting / Film Drying
  • Chemical System: Cyanoacrylate
  • Type / Form: Liquid
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Industry: Electronics; OEM or Industrial
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Baytec® ENC -- BAYTEC ENC 5003
from Bayer MaterialScience LLC

Baytec ENC-5003 is a low-functionality polymeric. diphenylmethane diisocyanate (PMDI) useful in. combination with polyols in the production of cast. urethanes for encapsulation of electrical components. It is also useful in adhesive applications. calling for urethane bonding agents. As with any. [See More]

  • Industry: Electronics; Adhesive Applications
  • Cure / Technology: Thermoplastic / Hot Melt; Two Component  
  • Chemical System: PMDI
  • Type / Form: Liquid
Double Liner Tape -- NT-101W76PLE
from Dielectric Polymers, Inc.

Mounting nameplates, signs, graphic panels, and decorative trim [See More]

  • Industry: Automotive; Electronics; OEM or Industrial
  • Composition: Unfilled
  • Chemical System: Acrylic
  • Cure / Technology: Contact or Pressure Sensitive Adhesives
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Jewelry
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chipbonder® Surface Mount Adhesive -- 3607
from Henkel Corporation - Electronics

Designed for high speed printing and dispensing [See More]

  • Industry: Electronics
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Cylinlock® -- 822
from Hernon Manufacturing, Inc.

Cylinlock ® Retaining Compounds are highly engineered, 100% active, high strength anaerobic liquids that cure to a. tough plastic when air is excluded. The plastic shim formed when Cylinlock ® cures fills the voids present in even the. best shrink or press fits. These compounds also find... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Tooling
  • Composition: Unfilled
  • Chemical System: Dimethacrylate Ester; Acrylic
  • Cure / Technology: Anaerobic; Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Epoxy Adhesive -- E109
from Koford Engineering, LLC

E-109 is a high performance silica filled single component adhesive which cure in 5 minutes or less withexcellent shear strength in combination with use temperature of 200°C. Has very low outgassing during curemaking it especially suitable for use in switches, sensors and other electronic... [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Substrate Compatibility: Electronics
Engineered Materials -- Silvertech PT 1 Epoxy
from Materion Corporation

Silvertech PT-1 ™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be... [See More]

  • Industry: Electronics
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Features: Electrically Conductive
Silicone Sealant -- RTV 400-100
from Novagard Solutions

Non-corrosive, single component oxime silicon sealant and/or adhesive [See More]

  • Industry: Electronics; Electric Power; Optical; Photonics; OEM or Industrial
  • Composition: Unfilled
  • Chemical System: Elastomeric; Silicone
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Composition: Unfilled
  • Type / Form: Liquid
U691
from Scapa Group plc

U691 [See More]

  • Industry: Electronics
  • Chemical System: Acrylic
KE 441
from Shin-Etsu Silicones of America

Excellent adhesion to many substrates [See More]

  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Type / Form: Gel
Sensors, Adhesives and Epoxies -- TC-ADH-989S
from SuperLogics, Inc.

3000 °F high purity, rapid curing alumina adhesive - 4 oz. bottle [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial
  • Composition: Unfilled
  • Chemical System: Alumina; Ceramic
  • Cure / Technology: Air Setting / Film Drying