Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Industry: Electronics; OEM or Industrial; Heat Transfer Systems
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Features: Thermally Conductive
2 Ton®Clear Epoxy -- 14310 [14310 from ITW Devcon]
from Applied Industrial Technologies

x [See More]

  • Industry: Electronics
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
3M™ Thermally Conductive Tape -- 8810 [8810 from 3M Electronics Design & Manufacturing]
from bisco industries

3M ™ Thermally Conductive Adhesive Transfer Tapes 8805, 8810, 8815 and 8820 are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes). • These tapes are tacky pressure... [See More]

  • Industry: Electronics
  • Composition: Filled
  • Chemical System: Acrylic
  • Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Aerospace; Electronics; Military; OEM or Industrial
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
FTLV with HARDENER Casting System Kit -- 90-004074
from Ellsworth Adhesives

Sold as a case (4 Kits/case). OXY-CAST 6850 FTLV with HARDENER XL is a low viscosity, versatile epoxy casting system that exhibits unusually high thermal conductivity and low thermal expansion. Gallon kit. [See More]

  • Industry: Electronics; Electric Power
  • Cure / Technology: Air Setting / Film Drying; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type / Form: Liquid
Electrical -- 377H
from Epoxy Technology

EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Hapflex™ 1000 Series High Performance Hybrid Elastomeric Polymer Alloy -- 1021
from Hapco, Inc.

HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]

  • Industry: Electronics; OEM or Industrial; Tooling
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
INSULBOND 5-171-1 Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 5-171-1 is a clear, flowable epoxy resin adhesive designed for applications that require a high degree of peel strength, flexibility, and ability to bond to varied substrates. Curable at room temperature or mild oven temperatures, INSULBOND 5-171-1 retains its flexibility over a very broad... [See More]

  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type / Form: Liquid
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
3M EPX DP-460 EG OFFWHT; 37ML DUO-PAK EPXY -- 048011-65138
from R. S. Hughes Company, Inc.

3M EPX DP-460 EG OFFWHT; 37ML DUO-PAK EPXY. [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
Adhesive -- ELASTOSIL® RT 705 F
from Wacker Chemical Corp.

ELASTOSIL ® RT 705 f is a flowable, additioon curing, thermally curing, one-component silicone rubber. Special characteristics. Ready-to-use, one-component. Flowable. High extrusion rate. Fast curing at high temperatures. Good heat stability. Excellent primerless adhesion to many substrates. [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Elastomeric; Silicone
  • Viscosity: 20000 to 40000
3M™ Permanent Label Adhesive -- 100 High-Temp. Acrylic
from 3M Electronics Design & Manufacturing

In most cases, when you send a label into the elements, you hope it will hold up and look good for years to come. Temperature extremes, moisture, and sunlight can all take their toll. Legibility may be critical. Look to 3M for label solutions that last. [See More]

  • Industry: Electronics; Labels
  • Composition: Unfilled
  • Chemical System: Acrylic
  • Cure / Technology: Single Component
20419 [20419 from Henkel Corporation]
from All-Spec Industries

Tak Pak instant adhesive 444 for PCB assembly and repair [See More]

  • Industry: Electronics
  • Cure / Technology: Air Setting / Film Drying
  • Composition: Unfilled
  • Type / Form: Liquid
CA-020 Instant Adhesive
from Anti-Seize Technology

Most versatile instant adhesive, fast overall cure speed, regular viscosity [See More]

  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Air Setting / Film Drying
  • Chemical System: Cyanoacrylate
  • Type / Form: Liquid
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Industry: Electronics; OEM or Industrial
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Baytec® ENC -- BAYTEC ENC 5003
from Bayer MaterialScience LLC

Baytec ENC-5003 is a low-functionality polymeric. diphenylmethane diisocyanate (PMDI) useful in. combination with polyols in the production of cast. urethanes for encapsulation of electrical components. It is also useful in adhesive applications. calling for urethane bonding agents. As with any. [See More]

  • Industry: Electronics; Adhesive Applications
  • Cure / Technology: Thermoplastic / Hot Melt; Two Component  
  • Chemical System: PMDI
  • Type / Form: Liquid
Double Liner Tape -- NT-101W76PLE
from Dielectric Polymers, Inc.

Mounting nameplates, signs, graphic panels, and decorative trim [See More]

  • Industry: Automotive; Electronics; OEM or Industrial
  • Composition: Unfilled
  • Chemical System: Acrylic
  • Cure / Technology: Contact or Pressure Sensitive Adhesives
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Jewelry
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chipbonder® Surface Mount Adhesive -- 3607
from Henkel Corporation - Electronics

Designed for high speed printing and dispensing [See More]

  • Industry: Electronics
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Cylinlock® -- 822
from Hernon Manufacturing, Inc.

Cylinlock ® Retaining Compounds are highly engineered, 100% active, high strength anaerobic liquids that cure to a. tough plastic when air is excluded. The plastic shim formed when Cylinlock ® cures fills the voids present in even the. best shrink or press fits. These compounds also find... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Tooling
  • Composition: Unfilled
  • Chemical System: Dimethacrylate Ester; Acrylic
  • Cure / Technology: Anaerobic; Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Dissipator® -- Grade 745
from Hi-Tech Seals, Inc.

HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]

  • Industry: Electronics
  • Cure / Technology: Two Component  ; Reactive or Moisture Cured
  • Chemical System: Acrylic
  • Features: Thermally Conductive
Epoxy Adhesive -- E109
from Koford Engineering, LLC

E-109 is a high performance silica filled single component adhesive which cure in 5 minutes or less withexcellent shear strength in combination with use temperature of 200°C. Has very low outgassing during curemaking it especially suitable for use in switches, sensors and other electronic... [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Substrate Compatibility: Electronics
Engineered Materials -- Silvertech PT 1 Epoxy
from Materion Corporation

Silvertech PT-1 ™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be... [See More]

  • Industry: Electronics
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Features: Electrically Conductive
Silicone Sealant -- RTV 400-100
from Novagard Solutions

Non-corrosive, single component oxime silicon sealant and/or adhesive [See More]

  • Industry: Electronics; Electric Power; Optical; Photonics; OEM or Industrial
  • Composition: Unfilled
  • Chemical System: Elastomeric; Silicone
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Composition: Unfilled
  • Type / Form: Liquid
U691
from Scapa Group plc

U691 [See More]

  • Industry: Electronics
  • Chemical System: Acrylic
KE 441
from Shin-Etsu Silicones of America

Excellent adhesion to many substrates [See More]

  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Type / Form: Gel
Sensors, Adhesives and Epoxies -- TC-ADH-989S
from SuperLogics, Inc.

3000 °F high purity, rapid curing alumina adhesive - 4 oz. bottle [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial
  • Composition: Unfilled
  • Chemical System: Alumina; Ceramic
  • Cure / Technology: Air Setting / Film Drying