Electronics Industrial Adhesives Datasheets

Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Industry: Electronics; OEM or Industrial; Heat Transfer Systems
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Features: Thermally Conductive
Fluon® Perfluoro Adhesive -- EA-2000
from AGC Chemicals Americas, Inc.

Fluon ® PFA EA-2000, is an Perfluoro resin which has been functionalized to include an adhesive group within the polymer backbone. The perfluoro backbone gives the material excellent electrical characteristics, and heat and chemical resistance, while the adhesive functionality facilitates... [See More]

  • Industry: Electronics; PBCs, Heat-resistant Insulating Tape, Heat-resistant Laminated Tubing, Interposers, Steel Plate Laminates
  • Type / Form: Pellets
  • Chemical System: PFA
  • Features: Laminaes
Surface Mount Adhesives -- Epibond® 7275
from Alpha

Epibond ® 7275-Series surface mount adhesives offer excellent performance for all SMT surface mount printing print and dispensing applications. Consistent high-dot profile and fast curing. Room temperature stability, 6-month room temperature shelf life. Non slumping and non stringing. Dispense,... [See More]

  • Industry: Electronics
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type / Form: Gel
2 Ton®Clear Epoxy -- 14310 [14310 from ITW Devcon]
from Applied Industrial Technologies

x [See More]

  • Industry: Electronics
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
Aron Alpha Type 212Z, Series 200Z - Ultra Fast Setting, Ethyl -- AA783
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)

Aron Alpha 200Z Series. Aron Alpha 200Z Series is engineered for tough-to-bond situations. Ultra fast setting formula excellent for challenging low surface energy substrates. [See More]

  • Industry: Electronics
  • Cure / Technology: Single Component
  • Chemical System: Cyanoacrylate
  • Type / Form: Liquid
Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Aerospace; Electronics; Military; OEM or Industrial
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000
from Epoxy Technology

A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy making it... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
3M™ Scotch-Weld™ Epoxy Adhesive 2214 Hi-Temp New Formula Gray, 5 Gallon, 1 per case -- 2214 [2214 from 3M Industrial Adhesives and Tapes]
from Heilind Electronics, Inc.

3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 Hi-Temp New Formula is a gray, rigid, aluminum filled, one-part epoxy adhesive. Cures in 60 minutes at 250 Degrees F/121 Degrees C. Highest temperature resistance. Heat cure. improved performance at lower temperatures. General industrial, sporting... [See More]

  • Industry: Electronics; Military; OEM or Industrial
  • Substrate Compatibility: Metal
  • Chemical System: Epoxy
  • Viscosity: 1.00E6
ABLEBOND 8008NC -- 8802604974081
from Henkel Corporation - Electronics

ABLEBOND 8008NC is a non-conductive snap cure adhesive utilizing wafer backside coating technology. [See More]

  • Industry: Electronics
  • Thermal Conductivity: 0.5000
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
3M EPX DP-460 EG OFFWHT; 37ML DUO-PAK EPXY -- 048011-65138
from R. S. Hughes Company, Inc.

3M EPX DP-460 EG OFFWHT; 37ML DUO-PAK EPXY. [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
Electrically Conductive Adhesive -- SEMICOSIL® 979 EC
from Wacker Chemical Corp.

SEMICOSIL ® 979 EC is a RTV-1 amine cure silicone rubber that cures on contact with moisture in the air. Special features. Low volume resistivity. Thixotropic paste. Solvated. Excellent adhesion to many substrates. Application. SEMICOSIL ® 979 EC is an electrically conductive adhesive for... [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Chemical System: Elastomeric; Silicone
  • Features: Electrically Conductive
20419 [20419 from Henkel Corporation - Industrial]
from All-Spec Industries

Tak Pak instant adhesive 444 for PCB assembly and repair [See More]

  • Industry: Electronics
  • Cure / Technology: Air Setting / Film Drying
  • Composition: Unfilled
  • Type / Form: Liquid
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Industry: Electronics; OEM or Industrial
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Jewelry
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Hapflex™ 1000 Series High Performance Hybrid Elastomeric Polymer Alloy -- 1021
from Hapco, Inc.

HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]

  • Industry: Electronics; OEM or Industrial; Tooling
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Cylinlock® -- 822
from Hernon Manufacturing, Inc.

Cylinlock ® Retaining Compounds are highly engineered, 100% active, high strength anaerobic liquids that cure to a. tough plastic when air is excluded. The plastic shim formed when Cylinlock ® cures fills the voids present in even the. best shrink or press fits. These compounds also find... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Tooling
  • Composition: Unfilled
  • Chemical System: Dimethacrylate Ester; Acrylic
  • Cure / Technology: Anaerobic; Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Dissipator® Adhesive -- Grade 745
from Hi-Tech Seals, Inc.

HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]

  • Industry: Electronics
  • Cure / Technology: Two Component  ; Reactive or Moisture Cured
  • Chemical System: Acrylic
  • Features: Thermally Conductive
INSULBOND 5-171-1 Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 5-171-1 is a clear, flowable epoxy resin adhesive designed for applications that require a high degree of peel strength, flexibility, and ability to bond to varied substrates. Curable at room temperature or mild oven temperatures, INSULBOND 5-171-1 retains its flexibility over a very broad... [See More]

  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type / Form: Liquid
Epoxy Adhesive -- E109
from Koford Engineering, LLC

E-109 is a high performance silica filled single component adhesive which cure in 5 minutes or less withexcellent shear strength in combination with use temperature of 200°C. Has very low outgassing during curemaking it especially suitable for use in switches, sensors and other electronic... [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Substrate Compatibility: Electronics
Engineered Materials -- Silvertech PT 1 Epoxy
from Materion Corporation

Silvertech PT-1 ™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be... [See More]

  • Industry: Electronics
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Features: Electrically Conductive
Silicone Sealant -- RTV 400-100
from Novagard Solutions

Non-corrosive, single component oxime silicon sealant and/or adhesive [See More]

  • Industry: Electronics; Electric Power; Optical; Photonics; OEM or Industrial
  • Composition: Unfilled
  • Chemical System: Elastomeric; Silicone
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Composition: Unfilled
  • Type / Form: Liquid
KE 441
from Shin-Etsu Silicones of America

Excellent adhesion to many substrates [See More]

  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Type / Form: Gel