from 3M Industrial Adhesives & Tapes Canada
3M ™ High Tack Pressure Sensitive Adhesive 3794B is a 100% solids thermoplastic, general purpose, high tack, pressure sensitive adhesive that can be spray or bead applied. Sprayable. High tack pressure sensitive adhesive (PSA). 100 percent solids. Woodworking, furniture, automotive,... [See More]
- Industry: Electronics; Military; Construction; OEM or Industrial
- Cure / Technology: Contact or Pressure Sensitive Adhesives
- Chemical System: Block Co-Polymer
- Type / Form: Pellets
- 3M™ Scotch-Weld™ Acrylic Adhesive DP805 Light Yellow, 1.6 fl oz/47 mL, 12 per case -- 62328814355,
- 3M™ Scotch-Weld™ Acrylic Adhesive DP805 Light Yellow, 13.53 fl oz/400 mL, 6 per case -- 62328835301,
- 3M™ Scotch-Weld™ Acrylic Adhesive DP805 Light Yellow, 6.76 fl oz/200 mL, 12 per case -- 62328838305,
from Applied Industrial Technologies
- Industry: Electronics
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Two Component
from Device Technologies, Inc.
The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]
- Industry: Aerospace; Electronics; Sanitary; Military; OEM or Industrial; Telecommunications, IT
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component; Adhesive Tape
from ELANTAS PDG, Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Industry: Aerospace; Electronics; Military; OEM or Industrial
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
Sold as a case (4 Kits/case). OXY-CAST 6850 FTLV with HARDENER XL is a low viscosity, versatile epoxy casting system that exhibits unusually high thermal conductivity and low thermal expansion. Gallon kit. [See More]
- Industry: Electronics; Electric Power
- Cure / Technology: Air Setting / Film Drying; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type / Form: Liquid
from Epoxy Technology
EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]
- Industry: Electronics
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]
- Industry: Electronics; OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]
- Industry: Electronics
- Cure / Technology: Two Component ; Reactive or Moisture Cured
- Chemical System: Acrylic
- Features: Thermally Conductive
from ITW Polymer Technologies - Insulcast Division
INSULBOND 5-171-1 is a clear, flowable epoxy resin adhesive designed for applications that require a high degree of peel strength, flexibility, and ability to bond to varied substrates. Curable at room temperature or mild oven temperatures, INSULBOND 5-171-1 retains its flexibility over a very broad... [See More]
- Industry: Electronics; OEM or Industrial
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Two Component
from Quist Electronics
High bond strength to a variety of surfaces, fiberglass reinforced tape [See More]
- Industry: Electronics; OEM or Industrial; Semiconductors, IC's
- Cure / Technology: Contact or Pressure Sensitive Adhesives
- Chemical System: Acrylic
- Type / Form: Sheet or Film
from R. S. Hughes Company, Inc.
3M EPX DP-460 EG OFFWHT; 37ML DUO-PAK EPXY. [See More]
- Industry: Electronics
- Chemical System: Epoxy
from Wacker Chemical Corp.
ELASTOSIL ® RT 705 f is a flowable, additioon curing, thermally curing, one-component silicone rubber. Special characteristics. Ready-to-use, one-component. Flowable. High extrusion rate. Fast curing at high temperatures. Good heat stability. Excellent primerless adhesion to many substrates. [See More]
- Industry: Electronics
- Cure / Technology: Thermoset; Single Component
- Chemical System: Elastomeric; Silicone
- Viscosity: 20000 to 40000
from 3M Electronics Markets Materials Division
3M ™ Thermally Conductive Interface Pad 5589H is a thermally conductive acrylic elastomer based interface pad. It has very high thermal conductivity, good electrical insulation properties and is ideally suited for applications that require non-silicone properties. 2.0 W/mK [See More]
- Industry: Electronics
- Cure / Technology: Contact or Pressure Sensitive Adhesives
- Chemical System: Acrylic
- Type / Form: Sheet or Film
from Anti-Seize Technology
Most versatile instant adhesive, fast overall cure speed, regular viscosity [See More]
- Industry: Electronics; OEM or Industrial
- Cure / Technology: Air Setting / Film Drying
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Bayer MaterialScience LLC
Baytec ENC-5003 is a low-functionality polymeric. diphenylmethane diisocyanate (PMDI) useful in. combination with polyols in the production of cast. urethanes for encapsulation of electrical components. It is also useful in adhesive applications. calling for urethane bonding agents. As with any. [See More]
- Industry: Electronics; Adhesive Applications
- Cure / Technology: Thermoplastic / Hot Melt; Two Component
- Chemical System: PMDI
- Type / Form: Liquid
from Dielectric Polymers, Inc.
Mounting nameplates, signs, graphic panels, and decorative trim [See More]
- Industry: Automotive; Electronics; OEM or Industrial
- Composition: Unfilled
- Chemical System: Acrylic
- Cure / Technology: Contact or Pressure Sensitive Adhesives
from Henkel Corporation - Electronics
Designed for high speed printing and dispensing [See More]
- Industry: Electronics
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Koford Engineering, LLC
E-109 is a high performance silica filled single component adhesive which cure in 5 minutes or less withexcellent shear strength in combination with use temperature of 200°C. Has very low outgassing during curemaking it especially suitable for use in switches, sensors and other electronic... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Substrate Compatibility: Electronics
from Materion Corporation
Silvertech PT-1 ™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be... [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Features: Electrically Conductive
from Novagard Solutions
Non-corrosive, single component oxime silicon sealant and/or adhesive [See More]
- Industry: Electronics; Electric Power; Optical; Photonics; OEM or Industrial
- Composition: Unfilled
- Chemical System: Elastomeric; Silicone
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
- Composition: Unfilled
- Type / Form: Liquid
from Scapa Group plc
U691 [See More]
- Industry: Electronics
- Chemical System: Acrylic
from Shin-Etsu Silicones of America
Excellent adhesion to many substrates [See More]
- Industry: Electronics; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Type / Form: Gel
from SuperLogics, Inc.
3000 °F high purity, rapid curing alumina adhesive - 4 oz. bottle [See More]
- Industry: Electronics; Electric Power; OEM or Industrial
- Composition: Unfilled
- Chemical System: Alumina; Ceramic
- Cure / Technology: Air Setting / Film Drying
