Military / Government (MIL-SPEC / GG) Industrial Adhesives Datasheets

609™ Retaining Compound -- 60921 [60921 from Henkel Corporation - Industrial]
from Applied Industrial Technologies

10 mL Bottle; Green; Low Viscosity Retaining Compound That Bonds Rigid Metal Assemblies; Ideal for Gap Distances Up to .005" Diameter; Fixtures in 10 min; Easily Joins Dissimilar Metals [See More]

  • Industry: Aerospace; Automotive; Electronics; Marine; Sanitary; Military; Optical; Photonics; OEM or Industrial
  • Cure / Technology: Anaerobic; Thermoplastic / Hot Melt; Single Component
  • Chemical System: Acrylic
  • Type / Form: Liquid
Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Aerospace; Electronics; Military; OEM or Industrial
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Cyanoacrylate Instant Adhesive -- 90-004461
from Ellsworth Adhesives

Sold as pack (40/pack). FUSION 395 is a single component, general industrial grade cyanoacrylate adhesive. 1 ounce bottle. [See More]

  • Industry: Military; OEM or Industrial; General Purpose
  • Cure / Technology: Air Setting / Film Drying; Single Component
  • Chemical System: Cyanoacrylate
  • Type / Form: Liquid
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000-MP
from Epoxy Technology

A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Designed specifically to meet the requirements pertaining to the... [See More]

  • Industry: Electronics; Military; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
3M™ Scotch-Weld™ Epoxy Adhesive 2214 Hi-Temp New Formula Gray, 5 Gallon, 1 per case -- 2214 [2214 from 3M Industrial Adhesives and Tapes]
from Heilind Electronics, Inc.

3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 Hi-Temp New Formula is a gray, rigid, aluminum filled, one-part epoxy adhesive. Cures in 60 minutes at 250 Degrees F/121 Degrees C. Highest temperature resistance. Heat cure. improved performance at lower temperatures. General industrial, sporting... [See More]

  • Industry: Electronics; Military; OEM or Industrial
  • Substrate Compatibility: Metal
  • Chemical System: Epoxy
  • Viscosity: 1.00E6
LOCTITE ABLESTIK 8175 (Known as Ablebond 8175) -- 8799472418817
from Henkel Corporation - Electronics

(Known as Ablebond 8175 ). LOCTITE ABLESTIK 8175 is an electrically conductive adhesive for solder replacement and microelectronic interconnect applications. [See More]

  • Industry: Electronics; Military
  • Viscosity: 55000
Key #510-LV Low Viscosity Grout & Binder Resin
from Key Resin Company

KEY RESIN #510-CV is a multi-purpose paste consistency epoxy binder used for various KEY COVE BASE SYSTEMS, and as a general purpose spackle or filler compound. This all purpose epoxy resin has excellent thixotropic properties compared to other epoxy formulations, making it ideal for use on vertical... [See More]

  • Industry: Military; OEM or Industrial
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Substrate Compatibility: Concrete, Masonry
Dimensionally Stable, One Component UV Curable Adhesive -- UV10TK
from Master Bond, Inc.

Master Bond Polymer UV10TK40 is a unique single component, ultra violet curing, ultra violet stable, modified epoxy resin. This product offer the good adhesion, low shrinkage, and good chemical and water resin resistance associated with epoxy systems in general. UV10TK40 cures tack free in the... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Features: High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
352 Adhesive 3524150ml Bottle -- 35241 [35241 from Henkel Corporation - Industrial]
from All-Spec Industries

-65 °F to 300 °F [See More]

  • Industry: Military; OEM or Industrial
  • Composition: Unfilled
  • Chemical System: Acrylic
  • Cure / Technology: UV or Radiation Cured; Single Component
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Construction; OEM or Industrial; Tooling; Speakers
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Industry: Aerospace; Automotive; Electronics; Military; Construction; OEM or Industrial; Electronic Encapsulants
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Epoxy Mini Six-Pack -- 0700-5035
from KITCO Fiber Optics

Cures in <15min at 90 °C, conveniently packaged in six 1 gram packages [See More]

  • Industry: Military
  • Cure / Technology: Two Component  
  • Composition: Unfilled
High Speed Epoxy Adhesive -- ANE-57103
from Protavic America, Inc.

ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals and engineered plastics. Proven applications are bonding MRI magnets under full load,... [See More]

  • Industry: Automotive; Electronics; Electric Power; Sanitary; Military; OEM or Industrial; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component