Semiconductors / IC Packaging Industrial Adhesives Datasheets

Black, Single Component, Low Halogen, Electrically Insulating Die Attach Adhesive -- EPO-TEK® TJ1104-LH
from Epoxy Technology

A black, single component, low halogen, electrically insulating die attach adhesive with extended pot life. [See More]

  • Industry: Electronics; Photonics; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Aremco-Bond™ -- 860
from Aremco Products, Inc.

Exceptional mechanical and thermal properties [See More]

  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
604057 [CW2400 from Circuit Works]
from Farnell Europe

ADHESIVE, SILVER EPOXY, CONDUCTIVE [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Epoxy
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Composition: Unfilled
  • Type / Form: Liquid