Ceramic / Glass Industrial Adhesives Datasheets

Fluon® Perfluoro Adhesive -- EA-2000
from AGC Chemicals Americas, Inc.

Fluon ® PFA EA-2000, is an Perfluoro resin which has been functionalized to include an adhesive group within the polymer backbone. The perfluoro backbone gives the material excellent electrical characteristics, and heat and chemical resistance, while the adhesive functionality facilitates... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Glass Cloth, Polyimide, Various Metals
  • Type / Form: Pellets
  • Chemical System: PFA
  • Features: Laminaes
2 Ton®Clear Epoxy -- 14310 [14310 from ITW Devcon]
from Applied Industrial Technologies

x [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000
from Epoxy Technology

A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy making it... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Frekote 44-NC Mold Release Agent
from Henkel Corporation - Industrial

Known as FREKOTE 44 NC ). Frekote ® 44-NC ™ should be your first choice release agent where a non-transferring release is necessary. This semi-permanent, non-migratory release system chemically bonds to the mold surface to form a micro thin film which is stable at temperatures exceeding... [See More]

  • Substrate Compatibility: Ceramic, Glass; Plastic
  • Use Temperature: 59 to 140
  • Type / Form: Liquid
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
High Thermally Conductive Paste -- OMEGATHERM® OT-201 Series
from OMEGA Engineering, Inc.

OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
  • Cure / Technology: Air Setting / Film Drying; Single Component
  • Chemical System: Silicone
  • Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
RP 1000 Cyanoacrylate Adhesive -- Style 9740
from Phelps Industrial Products, LLC

Pheps Style 9740 is an RP 1000 Adhesive. This Cyanoacrylate adhesive needs only drops to develop a very strong bond between metals, ceramics, plastics and rubber. Water does not affect this adhesive's bond. Care should be taken to ensure surfaces are clean, and dry; use solvent if necessary. Apply... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer; Dissimilar Substrates
  • Cure / Technology: Air Setting / Film Drying
  • Chemical System: Cyanoacrylate
  • Type / Form: Liquid
Flowable, One-component Silicone Rubber -- ELASTOSIL® E 41
from Wacker Chemical Corp.

ELASTOSIL ® E41 is a flowable, one-component silicone rubber with very good mechanical properties, which cures at room temperature under the influence of atmospheric moisture. Special features. acetic acid-curing system. flowable. contains toluene as a solvent. excellent primerless adhesion to... [See More]

  • Substrate Compatibility: Ceramic, Glass (optional feature); Concrete, Masonry (optional feature); Composites (optional feature); Metal (optional feature); Paper or Paperboard (optional feature); Plastic (optional feature); Porous Surfaces (optional feature); Rubber or Elastomer (optional feature); Textiles or Fabrics (optional feature); Wood (optional feature)
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Chemical System: Elastomeric; Silicone
  • Type / Form: Gel
3M™ Hi-Tack 76 Classic Spray Adhesive Original Formula
from 3M Aerospace and Aircraft Maintenance Division

Quick-tacking, fast strength buildup. Aerosol, for bonding hard to hold materials like polyethylene and polypropylene. SBR rubber, fabric and felt. This product can effectively bond many hard to hold materials such as polyethylene. It can bond rubber, fabric, felt, cardboard, cork, foil, and many... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Air Setting / Film Drying; Single Component
  • Features: Solvent Based
Conap™ Industrial Adhesive -- CONAP® AD-1147
from ACCRAbond, Inc.

CONAP ® AD-1146 and AD-1147 are high strength adhesives for bonding liquid urethanes to various substrates during the curing process. These systems are a stable solution of polymers in a solvent blend which requires heat to effect cure. An extensive evaluation program has shown AD-1146 and... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Textiles or Fabrics; Wood
  • Cure / Technology: Single Component
Heavy Duty Adhesive -- C8190
from Aervoe Industries Incorporated

Objects are repositionable, conical mist spray pattern, fast drying [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Wood; Leather
  • Cure / Technology: Air Setting / Film Drying; Single Component
  • Chemical System: Acetone, Heptane
  • Features: Solvent Based
1 Minute™ Fast Curing Epoxy Gel -- 14277 [14277 from ITW Devcon]
from All-Spec Industries

" This item can not be exported outside the United States" [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type / Form: Gel
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Adhesive Paste
from Atlas Minerals and Chemicals, Inc.

Color: White (16 oz. Set or 2-quart, 1-gallon, 5-gallon Unit) [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Tubing, Instruments, Fixtures
  • Industry: Construction
  • Cure / Technology: Two Component  
  • Use Temperature: ? to 125
Bookbinding and Graphic Arts Hot Melt -- W251
from Cattie Adhesive Solutions

Hot Melts & Water-Based Adhesives for BOOKBINDING & GRAPHIC ARTS. Cattie Adhesive Solutions offers a Complete line of high quality Hot Melts, Low Temperature Hot Melts and Water-Based Adhesives for BOOKBINDING & GRAPHIC ARTS applications. For more info, Please call one of our Adhesive... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood
  • Cure / Technology: Thermoplastic / Hot Melt
  • Composition: Unfilled
  • Type / Form: Pellets
Superglue
from DME Company

Superglue. Instantly bonds glass, metals, plastics, & rubber. Bonds close-fitting parts in seconds. Works on clean surfaces of aluminum, copper, brass, steel, vinyl, PVC, polyester, nylon, fiberglass & wood. #49403 Super Glue. Instant Bond. 3 gram bottle. Ethyl grade. Bonds close fitting... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer; Dissimilar Substrates
  • Cure / Technology: Air Setting / Film Drying
  • Chemical System: Cyanoacrylate
  • Type / Form: Liquid
Dow Corning® 7091 Adhesive/Sealant
from Dow Corning Automotive Solutions

Features. One-component adhesive/sealant. Cures at room temperature when exposed to moisture in the air. Alkoxy cure system. Non-sag, paste consistency. Easy to apply. Cures to a tough, flexible rubber. Excellent adhesion to many substrates. Stable and flexible from -40 °C (-40 °F) to +180... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Elastomeric; Silicone
  • Features: Sealant
AMPLIFY TY Functional Polymer -- AMPLIFY™ TY 1052H
from Dow Elastomers

These polymers are specially formulated as packaging tie layers, providing excellent adhesion to a variety of substrates, and enable the combination of performance properties necessary for demanding food and other specialty packaging applications. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Rubber or Elastomer
  • Composition: Unfilled
  • Chemical System: Elastomeric; Maleic Anhydride Grafted Polymer
  • Cure / Technology: Thermoplastic / Hot Melt; Two Component  
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
EverGuard® H20 Bonding Adhesive
from GAF

EverGuard ® H20 Bonding Adhesive. Description. Water-based rubberized adhesive for PVC-based and TPO-based membranes. Benefit/Application. Two-surface contact adhesive applied to both underside of smooth surfaced membrane and substrate surface. Suitable for roofing and flashing membranes,... [See More]

  • Substrate Compatibility: Ceramic, Glass; Plastic
  • Type / Form: Liquid
  • Chemical System: Elastomeric
  • Features: Water Based 
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Hapweld™ 36 A/B Performance Structural Adhesive System -- 36 A/B
from Hapco, Inc.

A two part, non-shrinking, 100% solids, amber clear, polymer adhesive which cures at room temperature. It is a flowable polymer adhesive which forms permanent structural bonds between similar and dissimilar materials. Once hardened, HAPWELD ™ 36 A/B resists moisture, water, solvents,... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Textiles or Fabrics; Wood
  • Type / Form: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Viscosity: 30000
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Porous Surfaces; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Modified Acrylic; Acrylic
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Instantbond™ Adhesive -- Grade 110
from Hi-Tech Seals, Inc.

Classic cyanoacrylates are represented by the ethyl and methyl chemistries. Generally, the methyls offer better bond strengths on metals, the ethyls providing better strengths on everything else. Substrate selection and bond line configuration directly influence adhesive performance. [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Rubber or Elastomer; Textiles or Fabrics
  • Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Cyanoacrylate
  • Type / Form: Liquid
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
FiberSure™ 100 Fiber Optic Adhesive -- 0700-3810
from KITCO Fiber Optics

Specially formulated for fiber optic cable, quick adhesion, repeatable [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Anaerobic; Two Component  
  • Composition: Unfilled
  • Industry: Military
Epoxy Adhesive -- E103
from Koford Engineering, LLC

E-103 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Suitable for bonding metal, high temperature plastics, and ceramics where the maximum durability... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Use Temperature: 257 to 356
Vibra-Tite® Cyanoacrylates
from ND Industries, Inc.

Cyanoacrylates (also known as superglues) are single-part clear instant adhesives that rapidly polymerize at room temperature and develop strength extremely fast (fixture 0 to 60 seconds). They are initiated by moisture on the parts surface or by accelerators. Uses: Circuit board wires. Ceramic,... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Textiles or Fabrics
  • Cure / Technology: Air Setting / Film Drying; Single Component
  • Chemical System: Acrylic
  • Type / Form: Liquid
Silicone Sealant -- RTV 400-100
from Novagard Solutions

Non-corrosive, single component oxime silicon sealant and/or adhesive [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Elastomeric; Silicone
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Composition: Unfilled
  • Type / Form: Liquid
Adhesive Paste -- No. 19
from Sauereisen, Inc.

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Porous Surfaces; Textiles or Fabrics; Wood; Dissimilar Substrates; Cork, Felt
  • Composition: Unfilled
  • Chemical System: Ceramic
  • Cure / Technology: Air Setting / Film Drying; Single Component
FE 61
from Shin-Etsu Silicones of America

Fast cure replacement for silicone RTVs [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Type / Form: Liquid
3M™ Scotch-Weld Epoxy Adhesive DP100
from Total Plastics, Inc.

Clear. A very clear, two-part adhesive for bonding a variety of materials. 1.7 oz. tube. Bonds ceramics, wood and many metals and plastics. Available Sizes. 1.7 oz. tube [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
.75oz. Glue Pen Gorilla Glue Quick Cure -- 39039
from U.S. Plastic Corporation

Eight times faster than Gorilla glues original formula. Gorilla glue quick cure is perfect for quick repairs and projects that do not need long repositioning time but require gorilla tough strength. Plus, it dries white, making it the perfect adhesive for many craft applications, woodworking... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Wood; Foam, Stone
  • Composition: Unfilled
  • Chemical System: Polyurethane
  • Cure / Technology: Air Setting / Film Drying; Single Component
HCC Concentrate
from Westech Aerosol Corporation

WT-HCC canister is based on the Westech's popular HSC-13 adhesive. It is supplied in a pressurized canister without hydrocarbon propellants so that it can be used with standard pneumatic spray equipment. This permits more flexibility in spray patterns from narrow to broad, fine to coarse pattern as... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Textiles or Fabrics; Wood; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Elastomeric
  • Cure / Technology: Air Setting / Film Drying; Contact or Pressure Sensitive Adhesives; Single Component