Fast Cure Industrial Adhesive -- FCA10
from Acoustiblok, Inc.

FCA10 Fast Cure Industrial Adhesive is not a contact cement - It is waterproof and will bond Acoustiblok ® to itself, wood, metal, and most other surfaces. Acoustiblok must be held in place while curing. Very fast cure time, varying with temperature and humidity. Due to the unique properties of... [See More]

  • Substrate Compatibility: Composites; Metal; Wood; Dissimilar Substrates; Acoustiblok
  • Type / Form: Gel
  • Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
  • Industry: Construction; Soundproofing
Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Substrate Compatibility: Metal; Used with Isobar® Heat Pipe
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Features: Thermally Conductive
3M™ Super 77™ Spray Adhesive -- 00-021200-21210-9 [00-021200-21210-9 from 3M]
from Applied Industrial Technologies

24 oz: Spray Adhesive; Covers 220 sq ft; 10-30 Min Dry Time; Attaches Foils, Carpeting, Lightweight Foams, Paper, Cardboard, Felt, and Cloth to painted or unpainted Metals, Wood and Hardboard [See More]

  • Substrate Compatibility: Metal; Paper or Paperboard; Wood; Foil, Carpet, Foam, Felt
  • Cure / Technology: Single Component
200C Series, Type 201C -- item-1252
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)

Aron Alpha 200C Series is fast setting formula with large gap filling capability for bonding elastomers, metal and plastic. Ideal for substrates that do to mate flush or have slight inconsistencies in surface fit. [See More]

  • Substrate Compatibility: Metal; Plastic; Rubber or Elastomer
  • Cure / Technology: Single Component; Reactive or Moisture Cured
  • Chemical System: Cyanoacrylate
  • Type / Form: Liquid
General Purpose Spray Adhesive - Low VOC -- Nashua® 398 Spray Adhesive
from Berry Plastics Corporation - Engineered Materials Division

Nashua Tapes Products 398 Spray Adhesive. GENERAL PURPOSE SPRAY ADHESIVE - LOW VOC. Aggressive spray adhesive designed for temporary and permanent bonding. (Net weight 12 oz. NT WT, 17 Fluid oz.) Meets FDA requirements for indirect food packaging when used in accordance with 21 CFR 175.105. [See More]

  • Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood
  • Composition: Unfilled
  • Chemical System: Elastomeric
  • Cure / Technology: Air Setting / Film Drying; Single Component
3M™ Thermally Conductive Tape -- 8810 [8810 from 3M Electronics Design & Manufacturing]
from bisco industries

3M ™ Thermally Conductive Adhesive Transfer Tapes 8805, 8810, 8815 and 8820 are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes). • These tapes are tacky pressure... [See More]

  • Substrate Compatibility: Metal
  • Composition: Filled
  • Chemical System: Acrylic
  • Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
BETAMATE™ 1021 One-Part, High Performance, Heat Curing, Fracture-Toughened Epoxy Adhesive
from Dow Automotive Systems

BETAMATE 1021 is a one-part, high performance, heat curing, fracture-toughened epoxy adhesive. It is capable of bonding oily galvanized steel and cold rolled steel and provides excellent long term durability. It also has good impact-peel strength as measured by ISO 11343. [See More]

  • Substrate Compatibility: Metal
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Aron Alpha 201Cyanoacrylate 20GR -- AA-490 [CA6201 1 LB from Resinlab]
from Ellsworth Adhesives

Aron Alpha 201Cyanoacrylate is an extremely light viscosity, strong bond adhesive commonly used in the dental industry. Fast bonding. 20 gram. [See More]

  • Substrate Compatibility: Metal; Plastic; Rubber or Elastomer
  • Cure / Technology: Single Component; Reactive or Moisture Cured
  • Chemical System: Cyanoacrylate
  • Type / Form: Liquid
Electrical -- 377H
from Epoxy Technology

EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Construction Adhesive,10.1 Oz,Off-White -- 4FCC7 [1210760 from Henkel Corporation]
from Grainger Industrial Supply

Construction Adhesive, Latex, Off-White, Size 10.1 Oz., Application Time 20 Min, Functional Cure 24 Hours, Coverage 31 Linear Ft @ 1/4 In Bead, Flash Point Greater Than 200 F, Operating Temp. Range Up To 120F, Temp. Range Up To 120F, VOC Content 2 g/L, Adheres To Most Surfaces Such As Concrete,... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Wood
  • Use Temperature: 120
  • Features: Sealant
Hapweld™ 1384 A/B Performance Structural Adhesive System -- 1384 A/B
from Hapco, Inc.

A 100% solids room temperature curing polymer adhesive system ideally suited to be used as a bond between similar and dissimilar substrates. May be used as an all-purpose, room-curing, polymer adhesive, particularly because of its excellent handling properties. It also provides the ideal mix ratio... [See More]

  • Substrate Compatibility: Metal; Plastic
  • Type / Form: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Viscosity: 25000 to 30000
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
High Thermally Conductive Paste -- OMEGATHERM® OT-201 Series
from OMEGA Engineering, Inc.

OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
  • Cure / Technology: Air Setting / Film Drying; Single Component
  • Chemical System: Silicone
  • Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
One Part Acetoxy Cure Silicone Adhesive / Sealant -- PC® RTV 450 Silicone Adhesive
from Pittsburgh Corning (FOAMGLAS® insulation)

A one part acetoxy cure silicone adhesive / sealant formulated for use at high temperatures. It is particularly suited for use in conjunction with insulations which require adhering or sealing to itself or hot surfaces. It cures to an elastomeric solid at room temperatures. VOC Compliant. Meets the... [See More]

  • Substrate Compatibility: Metal; Asphalt
  • Cure / Technology: Single Component; Acetoxy
  • Chemical System: Silicone
  • Industry: Insulation Systems
Adhesive Remover [Adhesive Remover from 3M]
from R. S. Hughes Company, Inc.

High strength, fast, contact-type adhesive, 1 to 2 minute dry time [See More]

  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Porous Surfaces; Wood
  • Type / Form: Liquid
  • Cure / Technology: Air Setting / Film Drying
3M™ FoamFast 74 Spray Adhesive
from Total Plastics, Inc.

Orange. For bonding flexible urethane or latex foam together or to many other materials like wood, metal, and non-vinyl plastics. Available Sizes. 24 fl. oz. spray [See More]

  • Substrate Compatibility: Metal; Plastic; Wood
  • Type / Form: Liquid
.75oz. Glue Pen Gorilla Glue Quick Cure -- 39039
from U.S. Plastic Corporation

Eight times faster than Gorilla glues original formula. Gorilla glue quick cure is perfect for quick repairs and projects that do not need long repositioning time but require gorilla tough strength. Plus, it dries white, making it the perfect adhesive for many craft applications, woodworking... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Wood; Foam, Stone
  • Composition: Unfilled
  • Chemical System: Polyurethane
  • Cure / Technology: Air Setting / Film Drying; Single Component
Adhesive -- ELASTOSIL® RT 705
from Wacker Chemical Corp.

ELASTOSIL ® RT 705 is a self-levelling, thixotropic, addition-cross-linking, thermal-curing, one-component silicone rubber. Special features. ready-to-use, one-component. self-levelling. high extrusion rate. fast curing at high temperatures. good heat stability. excellent primerless adhesion to... [See More]

  • Substrate Compatibility: Metal
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Elastomeric; Silicone
  • Type / Form: Liquid
3M™ Fastbond™ Contact Adhesive -- 2000NF
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Fastbond ™ Contact Adhesive 2000NF Blue is a water-dispersed, high solids, activated adhesive. Provides immediate bonding and handling strength bonds flexible polyurethane and latex foams, plastic laminate, wood, plywood, without forced drying equipment. [See More]

  • Substrate Compatibility: Metal; Plastic; Porous Surfaces; Wood
  • Cure / Technology: Two Component  ; Contact or Pressure Sensitive Adhesives
  • Chemical System: Elastomeric
  • Type / Form: Liquid
3M™ Plastic Bonding Adhesive -- 2665
from 3M Electronics Design & Manufacturing

3M ™ Plastic Bonding Adhesive 2665 is a one-component, moisture curing, urethane adhesive that is applied warm. A low viscosity adhesive with a long open time and is ideal for bonding plastics. Yields thin glue lines when used with appropriate equipment. [See More]

  • Substrate Compatibility: Metal; Plastic
  • Cure / Technology: Single Component; Reactive or Moisture Cured
  • Chemical System: Polyurethane
  • Type / Form: Liquid
3M™ Fastbond™ 49
from 3M Fire Protection

High solids, fast tacking, pressure sensitive adhesive [See More]

  • Substrate Compatibility: Metal; Paper or Paperboard; Textiles or Fabrics; Fiberglass Insulation, Shoddy
  • Type / Form: Liquid
  • Cure / Technology: Air Setting / Film Drying; Single Component
  • Features: Water Based 
Carton Adhesive -- 876
from Aervoe Industries Incorporated

Strong, flexible, waterproof, permanent/temporary bonds, won't bleed, stain [See More]

  • Substrate Compatibility: Metal; Plastic; Porous Surfaces; Carpet, Wallpaper, Upholstery, Leather
  • Features: Laminaes
  • Cure / Technology: Air Setting / Film Drying; Single Component
  • Industry: Aerospace; Automotive; Asbestos Abatement
Dynacoat Multifill Putty
from AkzoNobel N.V.

Perfect filling on zinc, aluminum and steel [See More]

  • Substrate Compatibility: Metal
  • Features: Leveling Filling
1 Minute™ Fast Curing Epoxy Gel -- 14277 [14277 from ITW Devcon]
from All-Spec Industries

" This item can not be exported outside the United States" [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type / Form: Gel
AST-RTV™
from Anti-Seize Technology

Resists chemicals, temperature extremes, weather, vibration, moisture [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Cure / Technology: Air Setting / Film Drying
  • Chemical System: Silicone
  • Features: Sealant
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Adhesive Paste
from Atlas Minerals and Chemicals, Inc.

Color: White (16 oz. Set or 2-quart, 1-gallon, 5-gallon Unit) [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Tubing, Instruments, Fixtures
  • Industry: Construction
  • Cure / Technology: Two Component  
  • Use Temperature: ? to 125
Bookbinding and Graphic Arts Hot Melt -- W251
from Cattie Adhesive Solutions

Hot Melts & Water-Based Adhesives for BOOKBINDING & GRAPHIC ARTS. Cattie Adhesive Solutions offers a Complete line of high quality Hot Melts, Low Temperature Hot Melts and Water-Based Adhesives for BOOKBINDING & GRAPHIC ARTS applications. For more info, Please call one of our Adhesive... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood
  • Cure / Technology: Thermoplastic / Hot Melt
  • Composition: Unfilled
  • Type / Form: Pellets
Hardman<reg> Epoxy and Urethane Ad -- GO-08778-02
from Cole-Parmer

Epoxy,quick-set, 10/pk. Complete selection of epoxies for all your maintenance needs. Single-use adhesives are perfect for quick repair jobs. Applications: Wood, metal, glass, stone, concrete, and leather. Model: 4001-BG10. Manufacturer number: 4001-BG10. Temperature range (*F): -20 to 180 &176;F. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood; Leather
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Use Temperature: -20 to 180
Fast Steel Epoxy Putty -- PTY204
from Dawg, Inc.

Epoxy Putty is designed for a specific type of application. All Epoxy Putty compounds can be drilled, tapped, filed, machined, screwed, sawed, sanded, or painted. Epoxy putty sticks are 7" in length . Fast Steel Steel Epoxy Putty - Rebuild engine parts, mufflers, radiators, metal tools-patch ducts... [See More]

  • Substrate Compatibility: Metal
  • Chemical System: Epoxy
Double Liner Tape -- NT-101W76PLE
from Dielectric Polymers, Inc.

Mounting nameplates, signs, graphic panels, and decorative trim [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Paper or Paperboard; Plastic; Rubber or Elastomer; Wood; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Acrylic
  • Cure / Technology: Contact or Pressure Sensitive Adhesives
AMPLIFY TY Functional Polymer -- AMPLIFY™ TY 1052H
from Dow Elastomers

These polymers are specially formulated as packaging tie layers, providing excellent adhesion to a variety of substrates, and enable the combination of performance properties necessary for demanding food and other specialty packaging applications. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Rubber or Elastomer
  • Composition: Unfilled
  • Chemical System: Elastomeric; Maleic Anhydride Grafted Polymer
  • Cure / Technology: Thermoplastic / Hot Melt; Two Component  
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
PERMA-LOK ® HL126
from Glotrax Polymers Inc.

Wicking grade threadlocker. High strength, low viscosity penetrating formula. No dis-assembly necessary for application. Fixture time of 15 minutes with a full cure time of 24 hours. Torque strength 75 in-lb break, 300 in-lb prevail. Shear strength 1500 psi. [See More]

  • Substrate Compatibility: Metal
  • Composition: Unfilled
  • Chemical System: Acrylic
  • Cure / Technology: Anaerobic; Single Component; Room Temperature Vulcanizing or Curing
Speedline RTV Adhesive/Sealant -- 73-20 Silicone [73-20 Silicone from Speedline Corporation]
from GLT Products (Great Lakes Textiles, Inc.)

Non-slumping paste suitable for overhead or vertical surfaces [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer; Wood
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Air Setting / Film Drying; Thermoset; Two Component  ; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
GSP 1414
from GS Polymers, Inc.

Two part, 1:4, temperatures to 230 °F, good hydrolytic stability, FDA [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates; Variety
  • Composition: Unfilled
  • Chemical System: Elastomeric; Epoxy; Polyurethane
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Hysol® Die Attach Adhesive -- KO0125
from Henkel Corporation - Electronics

Withstands polymer decomposition during reflow [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Cu, Pd, Ag, and Au Plating
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Cylinlock® -- 822
from Hernon Manufacturing, Inc.

Cylinlock ® Retaining Compounds are highly engineered, 100% active, high strength anaerobic liquids that cure to a. tough plastic when air is excluded. The plastic shim formed when Cylinlock ® cures fills the voids present in even the. best shrink or press fits. These compounds also find... [See More]

  • Substrate Compatibility: Metal; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Dimethacrylate Ester; Acrylic
  • Cure / Technology: Anaerobic; Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Cylinlock® Adhesive -- Grade 822
from Hi-Tech Seals, Inc.

Assembly of cylindrical parts, such as rotors, gears, bushings, collars and bearings, can be effectively and reliably accomplished with HERNON ® ’s line of Cylinlock ® Retaining Compounds. Cylinlock ® high strength products eliminate the need for mechanical methods of assembly... [See More]

  • Substrate Compatibility: Metal; Plastic
  • Cure / Technology: Single Component
  • Chemical System: Acrylic
  • Type / Form: Liquid
FiberSure™ 100 Fiber Optic Adhesive -- 0700-3810
from KITCO Fiber Optics

Specially formulated for fiber optic cable, quick adhesion, repeatable [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Anaerobic; Two Component  
  • Composition: Unfilled
  • Industry: Military
Epoxy Adhesive -- E103
from Koford Engineering, LLC

E-103 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Suitable for bonding metal, high temperature plastics, and ceramics where the maximum durability... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Use Temperature: 257 to 356
Epoxy-Lock®
from ND Industries, Inc.

Meets IFI 125 & 525 standards, exceptional locking power [See More]

  • Substrate Compatibility: Metal
  • Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
Silicone Sealant -- RTV 400-100
from Novagard Solutions

Non-corrosive, single component oxime silicon sealant and/or adhesive [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Elastomeric; Silicone
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Composition: Unfilled
  • Type / Form: Liquid
108738 [230054 from Henkel Corporation]
from RS Components, Ltd.

Product Category:Adhesive; Primary Application Category:Wood, Rigid Plastic, GRP, Ceramics and Sheet Metal; Material:Acrylic; Pack Size:1kit; Application:Metals; Ceramics; Wood; GRP; Rigid Plastics [See More]

  • Substrate Compatibility: Metal; Plastic; Wood
  • Chemical System: Acrylic
FE 61
from Shin-Etsu Silicones of America

Fast cure replacement for silicone RTVs [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Type / Form: Liquid
Sensors, Adhesives and Epoxies -- TC-ADH-940HT-1
from SuperLogics, Inc.

2800 °F continuous service fast set alumina adhesive - 4 oz [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal
  • Composition: Unfilled
  • Chemical System: Alumina; Ceramic
  • Cure / Technology: Air Setting / Film Drying
HCC Concentrate
from Westech Aerosol Corporation

WT-HCC canister is based on the Westech's popular HSC-13 adhesive. It is supplied in a pressurized canister without hydrocarbon propellants so that it can be used with standard pneumatic spray equipment. This permits more flexibility in spray patterns from narrow to broad, fine to coarse pattern as... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Textiles or Fabrics; Wood; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Elastomeric
  • Cure / Technology: Air Setting / Film Drying; Contact or Pressure Sensitive Adhesives; Single Component