Reactive / Moisture Cured Industrial Adhesives Datasheets

380™Black Max®Instant Adhesive -- 38004 [38004 from Henkel Corporation - Industrial]
from Applied Industrial Technologies

x [See More]

  • Cure / Technology: Single Component; Reactive or Moisture Cured
  • Type / Form: Liquid
  • Chemical System: Cyanoacrylate
  • Substrate Compatibility: Metal; Plastic; Rubber or Elastomer
Biocompatible One Component LED Curable System -- LED403Med
from Master Bond, Inc.

Master Bond LED403Med is a very special, one part LED curable system that can be used as an adhesive, sealant, coating and encapsulation system. It requires no mixing and has excellent dimensional stability, electrical insulation and chemical resistance. LED403Med withstands sterilization, including... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
  • Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Specially Formulated, Moisture Curing Adhesive / Sealant -- PC® 99 2K
from Pittsburgh Corning (FOAMGLAS® insulation)

A specially formulated, moisture curing adhesive / sealant designed for a wide array of applications. It is ideally suited for applications where instantaneous vertical holding strength is required. PC ® 99 Adhesive / Sealant does not shrink upon curing, offers joint movement in excess of 25% in... [See More]

  • Cure / Technology: Reactive or Moisture Cured
  • Substrate Compatibility: Porous Surfaces; Nonporous, Itself
  • Features: Sealant
  • Industry: Insulation Systems
Electrically Conductive Adhesive -- SEMICOSIL® 979 EC
from Wacker Chemical Corp.

SEMICOSIL ® 979 EC is a RTV-1 amine cure silicone rubber that cures on contact with moisture in the air. Special features. Low volume resistivity. Thixotropic paste. Solvated. Excellent adhesion to many substrates. Application. SEMICOSIL ® 979 EC is an electrically conductive adhesive for... [See More]

  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Features: Electrically Conductive
  • Chemical System: Elastomeric; Silicone
  • Industry: Electronics
3M™ Scotch-Weld™ Polyurethane Reactive Adhesive -- TE031 White/Off-White
from 3M Aerospace and Aircraft Maintenance Division

One-component, 100% Solids, Polyurethane Reactive Adhesive for Bonding Various Substrates. It can be used in the woodworking, laminating and plastic component assembly markets. [See More]

  • Cure / Technology: Single Component; Reactive or Moisture Cured
  • Substrate Compatibility: Plastic
  • Chemical System: Polyurethane
  • Industry: Aerospace; OEM or Industrial
One component moisture cure urethane -- 10-2000
from Epoxies Etc...

10-2000 is a one component, moisture curing polyurethane adhesive designed for bonding. and laminating. It may also be used to impregnate glass cloth and create a pipe repair. system. FEATURES: • Solvent Free. • No Mixing Required. • Resists Moisture, Solvents and Heat. • High... [See More]

  • Cure / Technology: Single Component; Reactive or Moisture Cured
  • Features: Laminaes
  • Chemical System: Polyurethane
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
PERMABOND 2010
from Glotrax Polymers Inc.

Non-drip rheology formula, excellent for use on porous surfaces, high viscosity, fast cure. Applications include bonding most metals, plastics, and rubber and for use on vertical applications. Fixture time 30 minutes, cull cure time 4 hours, shear strength 2000 psi. [See More]

  • Cure / Technology: Air Setting / Film Drying; Single Component; Reactive or Moisture Cured
  • Composition: Unfilled
  • Chemical System: Cyanoacrylate
  • Type / Form: Liquid
GSP AD 204-3
from GS Polymers, Inc.

One part, flowable adhesive, moisture cure at room temperature [See More]

  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Wood; Dissimilar Substrates; Non-Porous Substrates
Flocksil® 1503 D
from Henkel Corporation - Automotive

Moisture sensitive, no dilution necessary, flocking rubber adhesive [See More]

  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured
  • Composition: Unfilled
  • Chemical System: Polyurethane
  • Type / Form: Liquid
Instantbond™ -- 110
from Hernon Manufacturing, Inc.

Classic cyanoacrylates are represented by the ethyl and methyl chemistries. Generally, the methyls offer better bond strengths on metals, the ethyls providing better strengths on everything else. Substrate selection and bond line configuration directly influence adhesive performance. [See More]

  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Chemical System: Methyl Cyanoacrylate; Cyanoacrylate
  • Type / Form: Liquid
Dissipator® Adhesive -- Grade 745
from Hi-Tech Seals, Inc.

HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]

  • Cure / Technology: Two Component  ; Reactive or Moisture Cured
  • Features: Thermally Conductive
  • Chemical System: Acrylic
  • Industry: Electronics