Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Features: High Dielectric; UL Rating
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Dymax UV Curing Adhesive -- 9-911-REV. A 1 LITER BTL
from Ellsworth Adhesives

Multi-Cure Dymax 9-911 Rev. A is a high tensile strength material that is especially well suited for fast fixturing, structural wire tacking, and component ruggedization. [See More]

  • Features: High Dielectric
  • Composition: Unfilled
  • Chemical System: Acrylic
  • Cure / Technology: UV or Radiation Cured; Single Component
Electrically Insulative and Thermally Conductive Epoxy -- TD1001
from Epoxy Technology

Product Description: EPO-TEK ® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK ® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and low modulus are a few... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermally Conductive
  • Cure / Technology: Air Setting / Film Drying; Two Component   (optional feature); Single Component (optional feature)
  • Chemical System: Ceramic
  • Type / Form: Liquid (optional feature); Powder (optional feature)
RTV-1 Silicone Rubber / Adhesive -- ELASTOSIL® Solar 1100
from Wacker Chemical Corp.

ELASTOSIL ® Solar 1100 is a non-slump, one-part silicone rubber that cures at room temperature under the influence of atmospheric moisture. Special features. neutral curing system (alkoxy). primerless adhesion to many substrates. long-term stability against weathering, moisture and UV radiation. [See More]

  • Features: High Dielectric; Sealant
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Chemical System: Elastomeric; Silicone
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Kapton Polymide Amber Masking Discs -- KD250-K [KP00250 from Shercon, Inc.]
from All-Spec Industries

x [See More]

  • Features: High Dielectric; Thermal Insulation
  • Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
  • Chemical System: Polyamide; Silicone
  • Type / Form: Sheet or Film
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Baytec® ENC -- BAYTEC ENC 5003
from Bayer MaterialScience LLC

Baytec ENC-5003 is a low-functionality polymeric. diphenylmethane diisocyanate (PMDI) useful in. combination with polyols in the production of cast. urethanes for encapsulation of electrical components. It is also useful in adhesive applications. calling for urethane bonding agents. As with any. [See More]

  • Features: High Dielectric
  • Cure / Technology: Thermoplastic / Hot Melt; Two Component  
  • Chemical System: PMDI
  • Type / Form: Liquid
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Features: High Dielectric
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Hysol® Die Attach Adhesive -- QMI 282HT
from Henkel Corporation - Electronics

Withstands polymer decomposition during reflow [See More]

  • Features: High Dielectric
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component
Cylinlock® -- 822
from Hernon Manufacturing, Inc.

Cylinlock ® Retaining Compounds are highly engineered, 100% active, high strength anaerobic liquids that cure to a. tough plastic when air is excluded. The plastic shim formed when Cylinlock ® cures fills the voids present in even the. best shrink or press fits. These compounds also find... [See More]

  • Features: High Dielectric; Non-corrosive; Phase Change; Sealant; Thermal Insulation; Threadlocker or Retainer
  • Composition: Unfilled
  • Chemical System: Dimethacrylate Ester; Acrylic
  • Cure / Technology: Anaerobic; Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Silicone Sealant -- RTV 400-100
from Novagard Solutions

Non-corrosive, single component oxime silicon sealant and/or adhesive [See More]

  • Features: High Dielectric; Non-corrosive; Sealant; UL Rating
  • Composition: Unfilled
  • Chemical System: Elastomeric; Silicone
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Epoxy Adhesive -- ANE-20904
from Protavic America, Inc.

Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]

  • Features: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
High Temperature Adhesive
from Refractory Specialties Incorporated

Materials with altered viscosity for your specific applications available upon request. For more information on High Temperature Adhesives, contact us and a representative will answer any questions you have. [See More]

  • Features: High Dielectric; Thermal Insulation; Water Based 
  • Cure / Technology: Air Setting / Film Drying
  • Chemical System: Al2O3, SiO3, Na2O, MgO, Fe2O3, TiO2
  • Industry: High Temperatures
Sensors, Adhesives and Epoxies -- TC-ADH-940HT-1
from SuperLogics, Inc.

2800 °F continuous service fast set alumina adhesive - 4 oz [See More]

  • Features: High Dielectric
  • Composition: Unfilled
  • Chemical System: Alumina; Ceramic
  • Cure / Technology: Air Setting / Film Drying