EMI / RFI Shielding Material Industrial Adhesives Datasheets

Electrically Conductive Epoxy -- EPO-TEK® EJ2189
from Epoxy Technology

An electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80 °C, although other heat cures can be used. [See More]

  • Features: Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
ABLESTIK ABLEFILM ECF563
from Henkel Corporation - Industrial

ABLESTIK ABLEFILM ECF563 unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. This adhesive provides RF/EMI shielding in bonding microwave substrates into packages. [See More]

  • Features: Electrically Conductive; EMI/RFI Shielding
  • Thermal Conductivity: 1
  • Type / Form: Sheet or Film
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component