Electrical -- 377H
from Epoxy Technology

EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]

  • Features: Electrically Conductive; EMI/RFI Shielding
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
Sil-Pad® Shield [Sil-Pad® Shield from Bergquist Company (The)]
from Quist Electronics

Bonded laminate, copper shield between layers or Sil-Pad [See More]

  • Features: High Dielectric; EMI/RFI Shielding; Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Elastomeric
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic