Military, Defense & Aerospace Epoxy Compound -- INSTAbond® M810
from ACCRAbond, Inc.

INSTAbond ® M810 -- a two-part epoxy compound that is used in potting, casting, encapsulation, adhesive and coatings applications. Key benefits include excellent adhesion, good water resistance, good toughness and flexibility. Certified to Mil-A-81236 Type 1 & Type 2. [See More]

  • Features: Encapsulant, Potting Compound
  • Chemical System: Epoxy
5-Minute® Epoxy -- 14200 [14200 from ITW Devcon]
from Applied Industrial Technologies

15 oz Tube; A Rapid-Curing, General Purpose Adhesive/Encapsulant [See More]

  • Features: Encapsulant, Potting Compound
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Type / Form: Liquid
VORANOL™ -- 220-260
from Dow Polyurethanes

Dow provides a wide variety of VORANOL* polyether polyols. with an extensive selection of performance and processing attrib-. utes. Designed to meet your needs, this large family of polyols. is sure to provide the balance of properties needed within rigid. and molded foam and isocyanate product... [See More]

  • Features: Encapsulant, Potting Compound; Sealant; Water Based 
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Polyether Polyol; Polyurethane
  • Type / Form: Gel
Dow Corning Encapsulant Q3-3600 A/B Encapsulant Gray 4kg Kit -- Q3-3600 A/B ENCAP 4KG KIT
from Ellsworth Adhesives

Two-part, grey encapsulant with a 1:1 ratio. Can be heat cured, has excellent flow, is self-priming, thermally conductive, and has a low viscosity. Other sizes available. Documentation: Dow Corning MSDS/TDS [See More]

  • Features: Encapsulant, Potting Compound; Thermally Conductive
  • Tensile (Break): 957
  • Thermal Conductivity: 0.7700
  • Elongation: 0.6
Electrially Insulative Epoxy -- OD1001
from Epoxy Technology

A single component, thermally and electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, several weeks of pot life and low modulus are a few of it traits. It is particularly suitable for bonding, sealing and potting ferrite cores in power device... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Haprez™ 3742 General Purpose Epoxy Laminating Binder System -- 3742
from Hapco, Inc.

An economical, general purpose, epoxy laminating and binder system. A clear amber, general purpose system that can be used with a variety of fillers for virtually all room temperature casting and laminating applications. As a laminating system, the extremely low viscosity of HAPREZ ™ 3742... [See More]

  • Features: Encapsulant, Potting Compound; Laminaes
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type / Form: Liquid
INSULCAST 116 FR Room Temperature Cure, Equal Ratio Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Features: Encapsulant, Potting Compound
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Fast Curing, One Component Silicone -- MS711
from Master Bond, Inc.

Master Sil 711 is a ready-to use, exceptionally fast curing, one component high performance silicone elastomer compound for bonding, sealing, protective coatings and formed-in-place gaskets. This compound is self leveling and can be readily applied to various surfaces. It cures at ambient... [See More]

  • Features: Encapsulant, Potting Compound; Sealant
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermally Conductive
  • Cure / Technology: Air Setting / Film Drying; Two Component   (optional feature); Single Component (optional feature)
  • Chemical System: Ceramic
  • Type / Form: Liquid (optional feature); Powder (optional feature)
LOCTITE 5088 300ML CRTG; FLOWABLE UV SILICONE -- 079340-17614
from R. S. Hughes Company, Inc.

LOCTITE 5088 300ML CRTG; FLOWABLE UV SILICONE. [See More]

  • Features: Encapsulant, Potting Compound
  • Chemical System: Silicone
RTV-1 Silicone Rubber / Adehesive -- ELASTOSIL® N 2010
from Wacker Chemical Corp.

ELASTOSIL ® N2010 is a self-leveling, one-component silicone sealant, which cures at room temperature under the influence of moisture. Special features. neutral curing system (alkoxy). translucent. sprayable. flowable. primerless adhesion to many substrates. solvent free. Application. [See More]

  • Features: Encapsulant, Potting Compound; Leveling Filling; Sealant
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Chemical System: Elastomeric; Silicone
  • Type / Form: Liquid
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Features: Encapsulant, Potting Compound
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Features: Encapsulant, Potting Compound
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Circuit Board Protection -- ES6010
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Features: Encapsulant, Potting Compound; Flame Retardant; UL Rating
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Tuffbond™ -- 305
from Hernon Manufacturing, Inc.

Tuffbond „ ¢ epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Phase Change; Sealant
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Silicone Sealant -- RTV 500-100
from Novagard Solutions

Non-corrosive, single component alkoxy cure silicone sealant/adhesive [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; UL Rating
  • Composition: Unfilled
  • Chemical System: Elastomeric; Silicone
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Features: Encapsulant, Potting Compound; Laminaes; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component