Thermal / Heat Insulating Industrial Adhesives Datasheets

Aron Alpha Type 401EX, Series 400EX - Thermal, Impact Resistance, Slow Setting Time Ethyl -- AA872
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)

Aron Alpha 400EX Series. Aron Alpha 400EX Series is suitable for vibrating areas such as motors and bearings. Featured characteristics are heat resistance up to + 250 °F and impact resistance. The fast curing speed lends itself to high speed assembly processes where handling strength is... [See More]

  • Features: Thermal Insulation
  • Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Cyanoacrylate
  • Type / Form: Liquid
Electrically Insulative Epoxy -- EPO-TEK® OD1001
from Epoxy Technology

A single component, thermally and electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, several weeks of pot life and low modulus are a few of it traits. It is particularly suitable for bonding, sealing and potting ferrite cores in power device... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Dimensionally Stable, One Component UV Curable Adhesive -- UV10TK
from Master Bond, Inc.

Master Bond Polymer UV10TK40 is a unique single component, ultra violet curing, ultra violet stable, modified epoxy resin. This product offer the good adhesion, low shrinkage, and good chemical and water resin resistance associated with epoxy systems in general. UV10TK40 cures tack free in the... [See More]

  • Features: High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
Scotch-Grip Rubber and Gasket Adhesive -- 1300 [1300 from 3M]
from R. S. Hughes Company, Inc.

The most versatile of the rubber and gasket adhesives [See More]

  • Features: Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Polychloroprene
  • Cure / Technology: Air Setting / Film Drying; Single Component
Kapton Polymide Amber Masking Discs -- KD250-K [KP00250 from Shercon, Inc.]
from All-Spec Industries

x [See More]

  • Features: High Dielectric; Thermal Insulation
  • Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
  • Chemical System: Polyamide; Silicone
  • Type / Form: Sheet or Film
Epoxy Adhesive & Potting Compound -- 10-3009
from Epoxies Etc...

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
GSP 1339-1
from GS Polymers, Inc.

Two part, 4:1 flowable, chemical & thermal resistance [See More]

  • Features: Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
INSULCAST 771 One Component, Rigid, Heat Cure Epoxy System
from ITW Polymer Technologies - Insulcast Division

INSULCAST 771 is a clear, one-component, rigid, heat cure epoxy system which exhibits high heat resistance. [See More]

  • Features: Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Features: Encapsulant, Potting Compound; Laminaes; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component