Thermal / Heat Insulating Industrial Adhesives Datasheets

Aron Alpha Type 401EX, Series 400EX - Thermal, Impact Resistance, Slow Setting Time Ethyl -- AA872
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)

Aron Alpha 400EX Series. Aron Alpha 400EX Series is suitable for vibrating areas such as motors and bearings. Featured characteristics are heat resistance up to + 250 °F and impact resistance. The fast curing speed lends itself to high speed assembly processes where handling strength is... [See More]

  • Features: Thermal Insulation
  • Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Cyanoacrylate
  • Type / Form: Liquid
Electrical -- P10
from Epoxy Technology

A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging. [See More]

  • Features: Electrically Conductive; Thermal Insulation
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Abrasion Resistant UV Curable Coating System -- UV11-3
from Master Bond, Inc.

Master Bond UV14-3 is a new one component, flexible, UV curable polymer system for bonding, sealing and coating with the convenient feature of being readily removable by most conventional solvents. It is a 100% reactive, moderate viscosity liquid at ambient temperatures which does not contain any... [See More]

  • Features: High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
Scotch-Grip Rubber and Gasket Adhesive -- 1300 [1300 from 3M]
from R. S. Hughes Company, Inc.

The most versatile of the rubber and gasket adhesives [See More]

  • Features: Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Polychloroprene
  • Cure / Technology: Air Setting / Film Drying; Single Component
Kapton Polymide Amber Masking Discs -- KD250-K [KP00250 from Shercon, Inc.]
from All-Spec Industries

x [See More]

  • Features: High Dielectric; Thermal Insulation
  • Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
  • Chemical System: Polyamide; Silicone
  • Type / Form: Sheet or Film
Dureflex® Aromatic Polyether Grade -- X2103
from Covestro LLC

X2103 is an aromatic polyether polyurethane film/sheeting product specially formulated with a non-halogenated fire retardant. As a polyether TPU, it exhibits excellent hydrolysis and fungus resistance, and therefore is recommended for applications that have continuous exposure to water and high... [See More]

  • Features: Flame Retardant; Laminaes; Sealant; Thermal Insulation (optional feature); UL Rating; Anti-static, ESD
  • Type / Form: Sheet or Film
  • Chemical System: Polyether; Polyurethane
  • Substrate Compatibility: Textiles or Fabrics
Epoxy Adhesive & Potting Compound -- 10-3009
from Epoxies Etc...

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
GSP 1339-1
from GS Polymers, Inc.

Two part, 4:1 flowable, chemical & thermal resistance [See More]

  • Features: Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
INSULCAST 771 One Component, Rigid, Heat Cure Epoxy System
from ITW Polymer Technologies - Insulcast Division

INSULCAST 771 is a clear, one-component, rigid, heat cure epoxy system which exhibits high heat resistance. [See More]

  • Features: Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Features: Encapsulant, Potting Compound; Laminaes; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component
High Temperature Adhesive
from Refractory Specialties Incorporated

Materials with altered viscosity for your specific applications available upon request. For more information on High Temperature Adhesives, contact us and a representative will answer any questions you have. [See More]

  • Features: High Dielectric; Thermal Insulation; Water Based 
  • Cure / Technology: Air Setting / Film Drying
  • Chemical System: Al2O3, SiO3, Na2O, MgO, Fe2O3, TiO2
  • Industry: High Temperatures