Electrical -- P10
from Epoxy Technology

A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging. [See More]

  • Features: Electrically Conductive; Thermal Insulation
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
INSULCAST 771 One Component, Rigid, Heat Cure Epoxy System
from ITW Polymer Technologies - Insulcast Division

INSULCAST 771 is a clear, one-component, rigid, heat cure epoxy system which exhibits high heat resistance. [See More]

  • Features: Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Abrasion Resistant UV Curable Coating System -- UV11-3
from Master Bond, Inc.

Master Bond UV14-3 is a new one component, flexible, UV curable polymer system for bonding, sealing and coating with the convenient feature of being readily removable by most conventional solvents. It is a 100% reactive, moderate viscosity liquid at ambient temperatures which does not contain any... [See More]

  • Features: High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
Scotch-Grip Rubber and Gasket Adhesive -- 1300 [1300 from 3M]
from R. S. Hughes Company, Inc.

The most versatile of the rubber and gasket adhesives [See More]

  • Features: Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Polychloroprene
  • Cure / Technology: Air Setting / Film Drying; Single Component
Kapton Polymide Amber Masking Discs -- KD250-K [KP00250 from Shercon, Inc.]
from All-Spec Industries

x [See More]

  • Features: High Dielectric; Thermal Insulation
  • Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
  • Chemical System: Polyamide; Silicone
  • Type / Form: Sheet or Film
Dureflex® Aromatic Polyether Grade -- X2103
from Bayer MaterialScience LLC

X2103 is an aromatic polyether polyurethane film/sheeting product specially formulated with a non-halogenated fire retardant. As a polyether TPU, it exhibits excellent hydrolysis and fungus resistance, and therefore is recommended for applications that have continuous exposure to water and high... [See More]

  • Features: Flame Retardant; Laminaes; Sealant; Thermal Insulation (optional feature); UL Rating; Anti-static, ESD
  • Type / Form: Sheet or Film
  • Chemical System: Polyether; Polyurethane
  • Substrate Compatibility: Textiles or Fabrics
Epoxy Adhesive & Potting Compound -- 10-3009
from Epoxies Etc...

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
GSP 1339-1
from GS Polymers, Inc.

Two part, 4:1 flowable, chemical & thermal resistance [See More]

  • Features: Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chipbonder® Surface Mount Adhesive -- 3607
from Henkel Corporation - Electronics

Designed for high speed printing and dispensing [See More]

  • Features: Thermal Insulation
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Features: Encapsulant, Potting Compound; Laminaes; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component
High Temperature Adhesive
from Refractory Specialties Incorporated

Materials with altered viscosity for your specific applications available upon request. For more information on High Temperature Adhesives, contact us and a representative will answer any questions you have. [See More]

  • Features: High Dielectric; Thermal Insulation; Water Based 
  • Cure / Technology: Air Setting / Film Drying
  • Chemical System: Al2O3, SiO3, Na2O, MgO, Fe2O3, TiO2
  • Industry: High Temperatures