Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Features: Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Substrate Compatibility: Metal; Used with Isobar® Heat Pipe
3M™ Thermally Conductive Tape -- 8810 [8810 from 3M Electronics Design & Manufacturing]
from bisco industries

3M ™ Thermally Conductive Adhesive Transfer Tapes 8805, 8810, 8815 and 8820 are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes). • These tapes are tacky pressure... [See More]

  • Features: Thermally Conductive; UL Rating
  • Composition: Filled
  • Chemical System: Acrylic
  • Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
Dow Corning 3-6605 Encapsulant Gray 13.6kg Kit -- 3-6605 COND ELAST 13.6KG
from Ellsworth Adhesives

Two part room-temperature or fast thermal cure silicone elastomer, variety of thermal conductivities; resists humidity and other harsh environments; good dielectric properties; self-priming adhesion; low stress. Documentation: Dow Corning MSDS/TDS [See More]

  • Features: Thermally Conductive
  • Thermal Conductivity: 0.8500
  • Chemical System: Silicone
  • Tensile (Break): 850
Electrical -- 430
from Epoxy Technology

A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]

  • Features: Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Flame Resistant, Two Component Epoxy -- EP21FRLVSP
from Master Bond, Inc.

Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]

  • Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Laminaes; Sealant; Thermally Conductive; Anti-static, ESD
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermally Conductive
  • Cure / Technology: Air Setting / Film Drying; Two Component   (optional feature); Single Component (optional feature)
  • Chemical System: Ceramic
  • Type / Form: Liquid (optional feature); Powder (optional feature)
Thermally Conductive Adhesive -- SEMICOSIL® 971 TC
from Wacker Chemical Corp.

SEMICOSIL ® 971 TC is a non-slump, thermally curable, addition-curing, one part silicone adhesive with excellent thermal conductivity. Special characteristics. Ready-to-use, one-part system. High thermal conductivity. Thixotropic. Rapid heat cure. Primerless adhesion to many substrates. [See More]

  • Features: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Silicone
  • Industry: Electronics
3M™ Acrylic Thermal Interface Pad -- 5589H
from 3M Electronics Design & Manufacturing

3M ™ Thermally Conductive Interface Pad 5589H is a thermally conductive acrylic elastomer based interface pad. It has very high thermal conductivity, good electrical insulation properties and is ideally suited for applications that require non-silicone properties. 2.0 W/mK [See More]

  • Features: Thermally Conductive; UL Rating
  • Cure / Technology: Contact or Pressure Sensitive Adhesives
  • Chemical System: Acrylic
  • Type / Form: Sheet or Film
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Features: Electrically Conductive; Thermally Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
55 Shore D polyurethane adhesive -- 10-2055
from Epoxies Etc...

The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]

  • Features: Flexible; Thermally Conductive
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane
  • Substrate Compatibility: Metal; Plastic
Thermal Management Adhesive -- 315
from Henkel Corporation - Electronics

Ease-of-use, thermal conductivity [See More]

  • Features: High Dielectric; Thermally Conductive
  • Composition: Filled
  • Chemical System: Acrylic
  • Cure / Technology: Thermoset; Single Component
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Features: High Dielectric; Non-corrosive; Phase Change; Sealant; Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Modified Acrylic; Acrylic
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Dissipator® Adhesive -- Grade 745
from Hi-Tech Seals, Inc.

HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]

  • Features: Thermally Conductive
  • Cure / Technology: Two Component  ; Reactive or Moisture Cured
  • Chemical System: Acrylic
  • Industry: Electronics
Conductive Hybrid Adhesive -- ACH-20120
from Protavic America, Inc.

The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]

  • Features: Flexible; Electrically Conductive; Laminaes; Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Hybrid
  • Cure / Technology: Thermoset; Single Component