from Acrolab Ltd.
Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]
- Features: Thermally Conductive
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Substrate Compatibility: Metal; Used with Isobar® Heat Pipe
from Device Technologies, Inc.
The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]
- Features: Flexible; Flame Retardant; Non-corrosive; Thermally Conductive
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component; Adhesive Tape
from Ellsworth Adhesives
Two part room-temperature or fast thermal cure silicone elastomer, variety of thermal conductivities; resists humidity and other harsh environments; good dielectric properties; self-priming adhesion; low stress. Documentation: Dow Corning MSDS/TDS [See More]
- Features: Thermally Conductive
- Thermal Conductivity: 0.8500
- Chemical System: Silicone
- Tensile (Break): 850
from Epoxy Technology
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]
- Features: Thermally Conductive
- Cure / Technology: Two Component ; Reactive or Moisture Cured
- Chemical System: Acrylic
- Industry: Electronics
from ITW Polymer Technologies - Insulcast Division
Castable Epoxy Heat Sink, UL recognized under file E86165 & meets the flammability requirement of 94 V-0. INSULCAST 140 FR is an epoxy casting system with high thermal conductivity. This system, when cured with INSULCURE 11B, also provides Class F operating properties. [See More]
- Features: Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Laminaes; Sealant; Thermally Conductive; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Two Component
from OMEGA Engineering, Inc.
Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component (optional feature); Single Component (optional feature)
- Chemical System: Ceramic
- Type / Form: Liquid (optional feature); Powder (optional feature)
from Quist Electronics
High bond strength to a variety of surfaces, fiberglass reinforced tape [See More]
- Features: Flame Retardant; Thermally Conductive; UL Rating
- Cure / Technology: Contact or Pressure Sensitive Adhesives
- Chemical System: Acrylic
- Type / Form: Sheet or Film
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Features: High Dielectric; Flame Retardant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Ceramic
- Cure / Technology: Air Setting / Film Drying; Single Component
from Wacker Chemical Corp.
SEMICOSIL ® 971 TC is a non-slump, thermally curable, addition-curing, one part silicone adhesive with excellent thermal conductivity. Special characteristics. Ready-to-use, one-part system. High thermal conductivity. Thixotropic. Rapid heat cure. Primerless adhesion to many substrates. [See More]
- Features: High Dielectric; Thermally Conductive
- Cure / Technology: Thermoset; Single Component
- Chemical System: Silicone
- Industry: Electronics
from 3M Electronics Markets Materials Division
3M ™ Thermally Conductive Interface Pad 5589H is a thermally conductive acrylic elastomer based interface pad. It has very high thermal conductivity, good electrical insulation properties and is ideally suited for applications that require non-silicone properties. 2.0 W/mK [See More]
- Features: Thermally Conductive; UL Rating
- Cure / Technology: Contact or Pressure Sensitive Adhesives
- Chemical System: Acrylic
- Type / Form: Sheet or Film
from Henkel Corporation - Electronics
Ease-of-use, thermal conductivity [See More]
- Features: High Dielectric; Thermally Conductive
- Composition: Filled
- Chemical System: Acrylic
- Cure / Technology: Thermoset; Single Component
from Protavic America, Inc.
The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]
- Features: Flexible; Electrically Conductive; Laminaes; Thermally Conductive
- Composition: Unfilled
- Chemical System: Hybrid
- Cure / Technology: Thermoset; Single Component
