Ceramic Thin Film Substrates -- ADS-996
from CoorsTek

Transportation. CoorsTek offers a line of special ceramics that take advantage of higher dielectric properties, such as GPS and microwave applications. These applications are becoming more extensively used in the transportation industry for location and guidance systems. Through CoorsTek, California... [See More]

  • Material Type: Alumina
  • Shape / Form: WaferSubstrate; Custom Shape
  • Composition: 99.6% Alumina
  • Thermal Conductivity: 26.6
Alumina 94% Machined Components
from Insaco, Inc.

Alumina (Al2O3) is one of the most widely specified, general-purpose technical ceramics. All aluminas are very hard and wear resistant, with high compressive strength even against extreme temperatures and corrosive environments. Aluminas are also excellent electrical insulators and are gas tight. [See More]

  • Material Type: Alumina; SpecialtyMaterial
  • Max Use Temperature: 1700
  • Shape / Form: Tube (optional feature); WaferSubstrate (optional feature); Hollow Stock (Tube, Pipe, Column) (optional feature); Plate / Board (optional feature); Custom Shape
  • Thermal Conductivity: 18
Enhanced Hexoloy® SA -- Silicon Carbide
from Saint-Gobain Ceramics - Hexoloy® Products

Enhanced Hexoloy ® SA exhibits reduced micro-porosity, which results in increased flexural strength and a higher Weibull modulus. It is well suited for use in critical applications. [See More]

  • Material Type: Carbide Material; Silicon Carbide
  • MOR / Flexural Strength: 62076
  • Shape / Form: Custom Shape
  • Compressive Strength: 565644