from Epoxy Technology
A single component, solvent containing, low viscosity polyimide designed for high temperature applications found in semiconductor, hybrid, optical, and medical devices. It is used mostly as a coating and dielectric layer. [See More]
- Chemical System: Epoxy; Polyimide or Bismaleimide (BMI)
- Form / Shape: Liquid
- Type: Thermally cured; Optical; CastingResin
- Industry: Electronics; Electrical Power or High Voltage
from SABIC
#65279;The new Extem* Resin portfolio of amorphous thermoplastic polyimide (TPI) and polyetherimide (PEI) resins offers a powerful combination of outstanding elevated thermal resistance up to 311 °C Tg; high strength, stiffness, and creep performance up to 230 °C, broad chemical resistance... [See More]
- Chemical System: Polyetherimide; Polyimide or Bismaleimide (BMI)
- Filler: Unfilled
- Type: Thermoplastic; MoldingCompound
- Form / Shape: Pellets
from Saint-Gobain Oil & Gas
This material is best suited for thermal and electrical insulation and radiation resistance. Meldin 2001 has the highest compressive properties of any material in the series. [See More]
- Chemical System: Polyimide or Bismaleimide (BMI)
- Filler: Unfilled
- Type: Thermally cured
- Industry: OEM or Industrial
from Gelest, Inc.
Forms high strength high oxygen and water transport rate films [See More]
- Chemical System: Silicone; Polyimide or Bismaleimide (BMI)
- Filler: Unfilled
- Type: Thermoplastic; Optical; CastingResin
- Form / Shape: Liquid
