from BJB Enterprises, Inc.
Resists moisture absorption. Very easy to use. Cures at room temperature. Highly resilient, tough, stretchy and tack free. Quick demold time, low viscosity [See More]
- Industry: Aerospace; Automotive; Laminating; Marine; Repair or Construction; OEM or Industrial
- Chemical System: Polyurethane
- Type: CastingResin
- Filler: Unfilled
from Master Bond, Inc.
Two comp. epoxy chemical resistant, MIL-A-81236 (OS), MMM-A-134-Type I [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Military; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
- Chemical System: Epoxy
- Type: Thermally cured; CastingResin
- Form / Shape: Liquid
from Wacker Chemical Corp.
ELASTOSIL ® Solar 2202 A/B is a pourable, addition-curing, RTV-2 silicone rubber thatvulcanizes at room temperature to yield a very soft silicone gel. Special features. two-part, 1:1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear vulcanisate. [See More]
- Industry: Electronics; Energy Conversion (Battery / Fuel Cell); Laminating
- Filler: Unfilled
- Chemical System: Silicone
- Form / Shape: Liquid
from Dampney Company, Inc.
Creates a chemically cross-linked dual-polymer system [See More]
- Industry: Laminating
- Chemical System: Polyurethane
- Type: FilmGrade
- Filler: Unfilled
from Gelest, Inc.
Viscosity: 3 cSt. - 3500 cSt., used textile finishes, release coatings [See More]
- Industry: Automotive; Laminating
- Chemical System: Silicone
- Type: Thermally cured
- Filler: Unfilled
from Integument Technologies, Inc.
Suitable for a wide variety of industrial and technological applications [See More]
- Industry: Aerospace; Laminating
- Chemical System: Fluoropolymer
- Type: Thermoplastic
- Filler: Unfilled
from Solvay Advanced Polymers
KetaSpire KT-820 CF30 is a low flow, 30% carbon fiber reinforced grade of polyetheretherketone (PEEK). Carbonfiber reinforcement of KetaSpire PEEK provides the maximum levels of mechanical properties at temperatures approaching 300 °C, and the lowest coefficient of linear thermal expansion... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
- Chemical System: PEEK
- Type: Thermoplastic; ExtrusionGrade; MoldingCompound
- Filler: Carbon or Graphite
