Electrical -- E2001
from Epoxy Technology

EPO-TEK ® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. [See More]

  • Industry: Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
  • Chemical System: Epoxy
  • Type: Thermally cured; CastingResin
  • Filler: Metal or MIM
EP2177M-1
from Master Bond, Inc.

Two comp. epoxy chemical resistant, MIL-A-81236 (OS), MMM-A-134-Type I [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Military; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy
  • Type: Thermally cured; CastingResin
  • Form / Shape: Liquid
VICTREX® PEEK Polymer -- 150CA30
from Victrex plc.

Carbon fibre reinforced grade based on different viscosities [See More]

  • Industry: Aerospace; Automotive; Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging; Energy,Textile, Industrial,Food, Oil/Gas
  • Chemical System: PEEK
  • Type: Thermoplastic; MoldingCompound
  • Filler: Carbon or Graphite
FEP -- 3M™ Dyneon™ FEP 6301
from 3M Advanced Materials Division

3M ™ FEP (a polymer of tetrafluoro-ethylene and hexafluoropropylene) offers excellent chemical inertness, heat and weather resistance, exceptional electrical properties, toughness and durability. FEP is used by a variety of industries including telecommunications, wire and cable, semiconductor... [See More]

  • Industry: Electronics; Electrical Power or High Voltage; Marine; Sanitary; OEM or Industrial; Semiconductors or IC Packaging; Stress Crack Resistant Tube
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic; ExtrusionGrade; MoldingCompound
  • Filler: Unfilled
3M™ Organic Electronics -- L-20856
from 3M Electronics Design & Manufacturing

3M ™ Organic Electronics provides new materials to build next generation electronics and photonics devices. With a focus on organic semiconductors and dielectrics, these materials will enable the creation of products for: Organic Thin Film Transistors (TFT) – notably for radio frequency... [See More]

  • Industry: Semiconductors or IC Packaging
  • Filler: Aramid
  • Type: Thermoplastic
  • Form / Shape: Pellets
Potting, Encapsulant Elastomer -- Bluesil™ Esa 7252 QC A/B
from Bluestar Silicones USA Corp.

Potting, encapsulant elastomer. Properties. Viscosity 3500. Hardness Sha 48. Description. a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL ™ ESA 7252 QC A & B is supplied as a viscous liquid which... [See More]

  • Industry: Aerospace; Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Chemical System: Silicone
  • Form / Shape: Liquid
Therma-Tech™ -- LC-5000C TC
from PolyOne Corporation

Heat transfer and cooling capabilities of metal [See More]

  • Industry: Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
  • Chemical System: Polyamide
  • Type: Thermoplastic; MoldingCompound
  • Features: Thermally Conductive
Specialty Conducting Polymers -- 4001
from Rieke Metals, Inc.

Poly(3-butylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 80% and 90% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
AvaSpire® Modified PAEK -- AV-621 GF30 BG20
from Solvay Advanced Polymers

AvaSpire AV-621 GF30 is a 30% glass fiber reinforced version of AvaSpire AV-621. This formulation offers better dimensional stability and lower warpage than 30% glass reinforced PEEK. This resin retains most of the desirable ultra-performance attributes of glass reinforced PEEK, including chemical... [See More]

  • Industry: Aerospace; Automotive; Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging; Chemical Processing, Oil And Gas
  • Chemical System: PEEK
  • Type: Thermoplastic; MoldingCompound
  • Form / Shape: Pellets
Super Engineering Plastic Materials
from Toray Industries (America), Inc.

Toyo Plastic Seiko Co., Ltd. is manufacturing and marketing materials for cut and shaved processing (rods, boards and sheets) made of super engineering plastics (such as PAI, PEEK and PPS) with excellent resistance to heat, chemicals and wear. The materials are widely used in areas such as... [See More]

  • Industry: Sanitary; Semiconductors or IC Packaging
  • Type: Thermoplastic; MoldingCompound
Isolast® Fab Range™ -- J9610
from Trelleborg Sealing Solutions

Hardness of 75 ± 5 Shore A, black, long term low compression set [See More]

  • Industry: Semiconductors or IC Packaging
  • Use Temperature: -13 to 455
  • Filler: Unfilled
  • Tensile (Break): 2002