from CoorsTek
Plastic Tubes and Rods. Engineered and Advanced Materials. CoorsTek offers a line of high-performance plastic semi-finished products in addition to our proprietary materials. These materials are used in diverse applications but primary emphasis is placed on wear, chemical compatibility, extreme... [See More]
- Industry: Aerospace; Marine; Sanitary; Military; OEM or Industrial; Semiconductors or IC Packaging
- Chemical System: Fluoropolymer; Polyethylene
- Type: Thermoplastic
- Filler: Glass or FRP; Metal or MIM; Carbon or Graphite
from Epoxy Technology
EPO-TEK ® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. [See More]
- Industry: Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
- Chemical System: Epoxy
- Type: Thermally cured; CastingResin
- Filler: Metal or MIM
from Master Bond, Inc.
Two comp. epoxy chemical resistant, MIL-A-81236 (OS), MMM-A-134-Type I [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Military; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
- Chemical System: Epoxy
- Type: Thermally cured; CastingResin
- Form / Shape: Liquid
from Victrex plc.
Carbon fibre reinforced grade based on different viscosities [See More]
- Industry: Aerospace; Automotive; Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging; Energy,Textile, Industrial,Food, Oil/Gas
- Chemical System: PEEK
- Type: Thermoplastic; MoldingCompound
- Filler: Carbon or Graphite
from 3M Electronics Markets Materials Division
3M ™ Organic Electronics provides new materials to build next generation electronics and photonics devices. With a focus on organic semiconductors and dielectrics, these materials will enable the creation of products for: Organic Thin Film Transistors (TFT) – notably for radio frequency... [See More]
- Industry: Semiconductors or IC Packaging
- Filler: Aramid
- Type: Thermoplastic
- Form / Shape: Pellets
from Rieke Metals, Inc.
Poly(3-butylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 80% and 90% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Filler: Unfilled
- Type: Thermoplastic
- Form / Shape: Liquid
from Solvay Advanced Polymers
AvaSpire AV-621 GF30 is a 30% glass fiber reinforced version of AvaSpire AV-621. This formulation offers better dimensional stability and lower warpage than 30% glass reinforced PEEK. This resin retains most of the desirable ultra-performance attributes of glass reinforced PEEK, including chemical... [See More]
- Industry: Aerospace; Automotive; Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging; Chemical Processing, Oil And Gas
- Chemical System: PEEK
- Type: Thermoplastic; MoldingCompound
- Form / Shape: Pellets
