Fluon® E-Series Aqueous Dispersion Grade PTFE -- AD208E
from AGC Chemicals Americas, Inc.

Highly cost-effective materials, Fluon ® PTFE (Polytetrafluoroethylene) Resins are the most widely used fluoropolymers found in many areas of modern life. Resin properties keep insulation thickness to a minimum while tolerating a wider range of temperatures (-180 °C to 260 °C) than other... [See More]

  • Features: Thermal Insulation
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Filler: Unfilled
Thermal -- H55
from Epoxy Technology

A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications. [See More]

  • Features: Thermal Insulation
  • Chemical System: Epoxy
  • Type: Thermally cured; CastingResin
  • Filler: Unfilled
INSULCAST 771 One Component, Rigid, Heat Cure Epoxy System
from ITW Polymer Technologies - Insulcast Division

INSULCAST 771 is a clear, one-component, rigid, heat cure epoxy system which exhibits high heat resistance. [See More]

  • Features: Thermal Insulation
  • Chemical System: Epoxy
  • Type: Thermally cured; CastingResin
  • Filler: Unfilled
EP30-1
from Master Bond, Inc.

Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This... [See More]

  • Features: Thermal Insulation
  • Chemical System: Epoxy
  • Type: Thermally cured; Optical; CastingResin
  • Form / Shape: Liquid
3M™ Fire Barrier Composite Sheets -- CS-195+
from 3M Fire Protection

Intumescent, lightweight, just cut and form to fit, easy to install [See More]

  • Features: UL; Thermal Insulation; Flame Retardant
  • Industry: Repair or Construction; Blank Openings, Multiple Cable
  • Filler: Unfilled
  • Tensile (Break): 94
Glass Reinforced -- Ultramid® B3EG10 BK00564
from BASF USA Corporation

A 50% fiberglass reinforced injection molding PA6 compound [See More]

  • Features: Thermal Insulation
  • Chemical System: Polyamide
  • Type: Thermoplastic; Thermally cured
  • Filler: Glass or FRP
Baytec® ENC -- BAYTEC ENC-30P
from Bayer MaterialScience LLC

Baytec ENC-30P is a 300-molecular-weight polypropylene. oxide-based triol. This triol is typically used in. the production of insulation subjected to high thermal. load, e.g., pin insulators. As with any product, use of. Baytec ENC-30P polyol in a given application must. be tested (including field... [See More]

  • Features: Thermal Insulation
  • Chemical System: Polyurethane
  • Type: MoldingCompound
  • Form / Shape: Liquid; Pellets
Circuit Board Protection -- 5071
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Features: Thermal Insulation
  • Chemical System: Silicone
  • Type: Thermally cured
  • Filler: Unfilled
Meldin® Polyimide Material -- 2001
from Saint-Gobain Performance Plastics - High Performance Seals, Polymer Components and Springs

This material is best suited for thermal and electrical insulation and radiation resistance. Meldin 2001 has the highest compressive properties of any material in the series. [See More]

  • Features: Thermal Insulation
  • Chemical System: Polyimide or Bismaleimide (BMI)
  • Type: Thermally cured
  • Filler: Unfilled