thicknessCONTROL RTP 8302 Inline Profilometer
from Micro-Epsilon

The modularly designed C-frame based sys- tems of the RTP8302 family are convincing due to their flexibility and performance in the rubber processing industry. Applying them in extruder lines or measuring rooms provides reliable measurement results in high precision and thus creates the basis for... [See More]

  • Measurement Capability: Defects, dimples or film residues; Thickness
  • Diameter / Width: 17.72
  • Technology: Optical / Laser
  • Accuracy: ±5µm
thicknessCONTROL RTP 8302 Inline Profilometer
from Micro-Epsilon Group

The modularly designed C-frame based sys- tems of the RTP8302 family are convincing due to their flexibility and performance in the rubber processing industry. Applying them in extruder lines or measuring rooms provides reliable measurement results in high precision and thus creates the basis for... [See More]

  • Measurement Capability: Defects, dimples or film residues; Thickness
  • Diameter / Width: 17.72
  • Technology: Optical / Laser
  • Accuracy: ±5µm
MicroTrak II Laser Displacement Sensors -- LTC-025-02
from MTI Instruments Inc.

High Speed Laser Sensor utilizing the Latest CMOS / CCD Technology. The Microtrak II features state-of-the-art CMOS laser triangulation technology for precise measurements of displacement, position, vibration and thickness. Unaffected by surface texture, color or stray light, the Microtrak II Laser... [See More]

  • Measurement Capability: Spacing; Waviness; Defects, dimples or film residues; Flatness; Lay / Pattern; Step Height; Thickness; Warp / Bow
  • Specific Parameters / Measurements: Maximum Peak Height; Maximum Valley Depth; Total Profile Depth or Height
  • Technology: Optical / Laser
  • Standards Compliance: ISO / EN
Crosscheck™ Laser Profile Sensor -- CC3000-100
from Bytewise Measurement Systems

Use CrossCheck for faster startups and changeovers while reducing product scrap and rework. Easily diagnose root causes of product variation to improve dimensional quality and operator variability, enabling 100% product certification. [See More]

  • Measurement Capability: 2D / Line Profile; Area or three dimensional profile; Flatness; Step Height; Thickness; Warp / Bow
  • Specific Parameters / Measurements: Average Peak Height; Maximum Valley Depth; Peak Count
  • Technology: Optical / Laser
  • Lateral Resolution: 0.0012
3D Optical Profiler -- NewView™ 600s
from Zygo Corporation

Fast 3D noncontact profilometer, manual benchtop unit [See More]

  • Measurement Capability: 2D / Line Profile; Area or three dimensional profile; Roughness; Spacing; Waviness; Hybrid Parameters; Defects, dimples or film residues; Flatness; Lay / Pattern; Step Height; Thickness; Warp / Bow
  • Specific Parameters / Measurements: Roughness Average; RMS Roughness ; Mean Peak to Valley Height or roughness depth; Maximum Peak Height; Average Peak Height; Maximum Valley Depth; Total Roughness Height; Total Profile Depth or Height; Base Roughness Depth; Maximum Roughness Depth; Ten Point Height; Skewness; Kurtosis; Waviness Average; Waviness Height; Peak Count; Peak Spacing Average; Core Roughness Depth; Bearing or Relative Material Ratio; SlopeRa (Δa); SlopeRMS (Δa); Swedish Height (H), Peak Density, Summit Spacing & Density, 3D Surface Visualization
  • Technology: Optical / Laser
  • Standards Compliance: ASME; ISO / EN; DIN; JIS