Thermal Compound / Interface EMI and RFI Shielding Datasheets

Electrical -- 430
from Epoxy Technology

A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]

  • Type / Form: Adhesive; Thermally Conductive or Thermal Interface Material
  • Features: Electrically Conductive
  • Use Temperature: -67 to 662
Flame Resistant, Two Component Epoxy -- EP21FRLVSP
from Master Bond, Inc.

Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]

  • Type / Form: Adhesive; Encapsulant; Sealant or Gap Filling Compound; Thermally Conductive or Thermal Interface Material
  • Features: Anti-static / ESD Control; Dielectric or Electrically Insulating; Electrically Conductive
  • Use Temperature: -60 to 300
MG Absorption Sheet -- MG-03A Series

Noise absorption sheet composed of heat-resistant rubber mixed with highly permeable metal magnetic material. Can be used and shows effectiveness in high-temperature environment up to 150 °C; in-vehicle equipment or periphery if CPU in electronics. Neither chlorine (C1) - nor bromine (Br) -... [See More]

  • Type / Form: Stock Shape or Fabricated Part; Thermally Conductive or Thermal Interface Material
  • Use Temperature: -40 to 302
  • Material System: Elastomer / Rubber