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Crydom Heat Sinks -- HS053
from Carlton-Bates Company

Up to 90A Usage Rated Heat Sink that offers excellent thermal management and are matched to the load current rating of a variety of Crydom relays. [See More]

  • Device: Passive Heat Sink
Heatsink -- K1 / 100
from Comus International

Thermal resistance versus Heatsink and nr. of Solid State Relays. 1 phase. 1 SSR. (K/W). 1 phase. 2 SSR. (K/W). 1 phase. 3 SSR. (K/W). 1 reversing or. 3 phase SSR. (K/W). Weight. (gr). K1 / 100. 3.5. 6.0. 170. K2 / 100. 2.5. 4.0. 2.5. 400. K3 / 160. .9. 1.7. 2.5. .8. 1100. K4 / 160L. .3. .55. .85. [See More]

  • Device: Passive Heat Sink
  • W: 1.68
  • L: 3
  • H: 1.3
Ceramic Heat Sinks And Electrical Insulators -- ThermTile™
from CoorsTek

Optimize Component Life and Performance. A natural choice for both electrical insulation and heat diffusion, our ThermTile ™ ceramic tiles and films serve the power generation industry and are used to lower the power chip's operating temperature by dissipating heat build-up. These sinks and... [See More]

  • Device: Passive Heat Sink
  • Material: Ceramic
  • H: 0.1000
Thermal - Heat Sinks -- 1-1542002-1-ND [1-1542002-1 from TE Connectivity]
from Digi-Key Corporation

HEAT SINK BGA 37.5MM 2FIN RADIAL [See More]

  • Device: Passive Heat Sink
  • Material: Aluminum
  • Mounting: Clips
Copper Heatsink
from Mersen

An all copper Fabfin ® heatsink provides maximum forced air cooling performance. The fabrication process is the same as that for an aluminum Fabfin ® heatsink and is offered on MF and AF fin spacing (3.43 mm and 5.49 mm respectively). While copper provides outstanding performance, the... [See More]

  • Device: Passive Heat Sink
  • Heat sink Fin Style:: Bonded
Heat Sink -- 1802890000
from Molex

Heat Sink for LED Array Holders with 40.00mm Screw Centers, 80.00mm Diameter, 40.00mm, Pre-drilled, Black Anodized Finish [See More]

  • Device: Passive Heat Sink
Board Level Heat Sinks For TO-220 & TO-218 & Multiwatt Components -- 253 Series
from Ohmite Manufacturing Co.

board level heatsink. Designed for TO-220 and TO-218 devices. Slim profile with integrated clip [See More]

  • Device: Passive Heat Sink
  • W: 25.4
  • L: 31
  • H: 22.86
TE Connectivity 1-1542001-2 Heat Sink Assemblies -- 1-1542001-2 [1-1542001-2 from TE Connectivity]
from Powell Electronics, Inc.

Heat Sink; BGA; Package Size = 27 [1.064] mm [in]; For Use With BGA Semiconductor Packages; Power Air Velocity Thermal Resistance; [See More]

  • Device: Passive Heat Sink
  • H: 12.7
  • W: 34.95
  • Heat sink Fin Style:: Pin Fin 1
CNC Machining Heat Sinks
from Rego Electronics Inc.

Copper and aluminum are the two popular NC heat sink materials. Simple to complex manufacturing of many types of custom or prototype heat sinks is our specialty. Heat sinks can be machined from billet or existing extrusion profiles as well as existing forging / die casting / stamping / skived molds. [See More]

  • Device: Passive Heat Sink
  • Heat sink Fin Style:: Straight
ADL855PC-SPREADER2
from ADL Embedded Solutions

The two piece Heat Sink Solution was developed to offer a low cost high performance solution to customers that have the physical envelope for this implementation. [See More]

  • Device: Passive Heat Sink
  • Mounting: Chassis-Mounted
  • Heat sink Fin Style:: Heat Spreader
186-250mm Heatsink -- 990502
from Airflow/Y.S. Tech, Inc.

YS TECH offers fabrication services for heat sinks both domestic and off shore. Our strength lies in custom heat sinks and value adding, we offer pin fins, extrusions, skived fins, high aspect ratio and fan sinks [See More]

  • Device: Passive Heat Sink
  • Heat sink Fin Style:: Straight
  • Weight: 1506
HT-HB 1/2 Brick Heat Sink Series -- HT-HB-L025
from Broadband TelCom Power, Inc.

Longitudinal fin orientation [See More]

  • Device: Passive Heat Sink
  • W: 60.96
  • L: 58
  • H: 6.35
Smart-CLIP™ Heatsink 21 mm Clip -- CGTT21-1FIN
from Cooliance

Radial fin style provides unique cooling solutions, RoHS compliant [See More]

  • Device: Passive Heat Sink
  • H: 6.48
  • L: 35
  • Heat sink Fin Style:: Radial Fin
ThermaCool Heat Sinks
from Ecopower, Inc.

ThermaCool ™ Heat Sinks have been sized for each of our standard products and to accommodate a range of desired operating conditions. Proper heat sink sizing is determined by a number of factors, including those listed below: Power Dissipated (Watts) - Determined by the light engine part... [See More]

  • Device: Passive Heat Sink
  • H: 0.0381
  • W: 0.0635
  • Heat sink Fin Style:: Straight
1800063
from Farnell Europe

PYROLYT GRAPHITE INTERFACE SHEET PGS [See More]

  • Device: Passive Heat Sink
  • W: 12
  • L: 18
  • H: 0.0700
HT011340
from Heat Technology, Inc.

HT011340 [See More]

  • Device: Passive Heat Sink
  • W: 33.78
  • L: 35
  • H: 10.16
HE-54 -- 479445 [HE-54 from Crydom Corporation]
from Jameco Electronics

Designed for excellent thermal management [See More]

  • Device: Passive Heat Sink
  • W: 140
  • L: 67
  • H: 121
PRV-1060X-01
from Parvus Corporation

5" Width accommodates most PC/104 and EBX enclosures [See More]

  • Device: Passive Heat Sink
  • W: 119
  • L: 140
  • H: 33.53
Cross Cut -- CC-.1.100X.1.100X.250-PIN-AL-BLK
from PENCOM

7 x 8 fin pattern, increased heat transfer, black anodized [See More]

  • Device: Passive Heat Sink
  • W: 27.94
  • L: 28
  • H: 6.35
COOLER MASTER Hyper Z600 RR-600-LBU1-GP CPU Cooler -- RR-600-LBU1-GP
from Pixel USA

COOLER MASTER Hyper Z600 RR-600-LBU1-GP CPU Cooler [See More]

  • Device: Passive Heat Sink
  • W: 127
  • L: 127
  • H: 160
2028
from RO Associates, Inc.

Heatsinks designed for modules, thermal pad preinstalled [See More]

  • Device: Passive Heat Sink; Active Heat Sink (optional feature)
  • W: 57.91
  • L: 61
  • H: 6.1
Heatsink -- C 3
from Semikron, Inc.

Features. Intended for stud mounted devices. Available in various lengths. Several devices can be mounted on a single heatsink [See More]

  • Device: Passive Heat Sink
  • H: 60
  • L: 40
  • Heat sink Fin Style:: Straight