from Comus International
Thermal resistance versus Heatsink and nr. of Solid State Relays. 1 phase. 1 SSR. (K/W). 1 phase. 2 SSR. (K/W). 1 phase. 3 SSR. (K/W). 1 reversing or. 3 phase SSR. (K/W). Weight. (gr). K1 / 100. 3.5. 6.0. 170. K2 / 100. 2.5. 4.0. 2.5. 400. K3 / 160. .9. 1.7. 2.5. .8. 1100. K4 / 160L. .3. .55. .85. [See More]
- Device: Passive Heat Sink
- W: 1.68
- L: 3
- H: 1.3
from CoorsTek
Optimize Component Life and Performance. A natural choice for both electrical insulation and heat diffusion, our ThermTile ™ ceramic tiles and films serve the power generation industry and are used to lower the power chip's operating temperature by dissipating heat build-up. These sinks and... [See More]
- Device: Passive Heat Sink
- Material: Ceramic
- H: 0.1000
from Digi-Key Corporation
HEAT SINK BGA 37.5MM 2FIN RADIAL [See More]
- Device: Passive Heat Sink
- Material: Aluminum
- Mounting: Clips
from Molex
Heat Sink for LED Array Holders with 40.00mm Screw Centers, 80.00mm Diameter, 40.00mm, Pre-drilled, Black Anodized Finish [See More]
- Device: Passive Heat Sink
from Tempco Electric Heater Corporation
Solid state relay de-rating curves are used to determine the actual current the relay is capable of carrying vs. the ambient temperature in the enclosure. It also indicates the heat sink required to dissipate the heat the relay produces at the ambient temperature. Failure to dissipate the internally... [See More]
- Device: Passive Heat Sink
- W: 1.77 to 4.75
- L: 3 to 5
- H: 2.37 to 3.74
from Advanced Digital Logic, Inc.
The two piece Heat Sink Solution was developed to offer a low cost high performance solution to customers that have the physical envelope for this implementation. [See More]
- Device: Passive Heat Sink
- Mounting: Chassis-Mounted
- Heat sink Fin Style:: Heat Spreader
from Airflow/Y.S. Tech, Inc.
YS TECH offers fabrication services for heat sinks both domestic and off shore. Our strength lies in custom heat sinks and value adding, we offer pin fins, extrusions, skived fins, high aspect ratio and fan sinks [See More]
- Device: Passive Heat Sink
- Heat sink Fin Style:: Straight
- Weight: 1506
from Broadband TelCom Power, Inc.
Longitudinal fin orientation [See More]
- Device: Passive Heat Sink
- W: 60.96
- L: 58
- H: 6.35
from Cooliance
Radial fin style provides unique cooling solutions, RoHS compliant [See More]
- Device: Passive Heat Sink
- H: 6.48
- L: 35
- Heat sink Fin Style:: Radial Fin
from Ecopower, Inc.
ThermaCool ™ Heat Sinks have been sized for each of our standard products and to accommodate a range of desired operating conditions. Proper heat sink sizing is determined by a number of factors, including those listed below: Power Dissipated (Watts) - Determined by the light engine part... [See More]
- Device: Passive Heat Sink
- H: 0.0381
- W: 0.0635
- Heat sink Fin Style:: Straight
from Farnell Europe
PYROLYT GRAPHITE INTERFACE SHEET PGS [See More]
- Device: Passive Heat Sink
- W: 12
- L: 18
- H: 0.0700
from Heat Technology, Inc.
HT011340 [See More]
- Device: Passive Heat Sink
- W: 33.78
- L: 35
- H: 10.16
from Jameco Electronics
Designed for excellent thermal management [See More]
- Device: Passive Heat Sink
- W: 140
- L: 67
- H: 121
from Parvus Corporation
5" Width accommodates most PC/104 and EBX enclosures [See More]
- Device: Passive Heat Sink
- W: 119
- L: 140
- H: 33.53
from PENCOM
7 x 8 fin pattern, increased heat transfer, black anodized [See More]
- Device: Passive Heat Sink
- W: 27.94
- L: 28
- H: 6.35
from Pixel USA
COOLER MASTER Hyper Z600 RR-600-LBU1-GP CPU Cooler [See More]
- Device: Passive Heat Sink
- W: 127
- L: 127
- H: 160
from RO Associates, Inc.
Heatsinks designed for modules, thermal pad preinstalled [See More]
- Device: Passive Heat Sink; Active Heat Sink (optional feature)
- W: 57.91
- L: 61
- H: 6.1
from Semikron, Inc.
Features. Intended for stud mounted devices. Available in various lengths. Several devices can be mounted on a single heatsink [See More]
- Device: Passive Heat Sink
- H: 60
- L: 40
- Heat sink Fin Style:: Straight
