Research / Surface Analysis Thin Film Equipment Datasheets

Multi-purpose Vacuum Box Coating Systems -- UNIVEX 250
from Leybold USA Inc.

UNIVEX 250. The UNIVEX 250 is a cost-effective and compact entry-level coating system for the laboratory. Owing to its low height of only approximately 1.2 meters it is ideally placed on a benchtop or installed in a frame. In the vacuum chamber which is 250 mm wide, substrates up to an overall... [See More]

  • Applications: Nanomaterials; Photovoltaic or solar cell; Research / Surface Analysis; Semiconductors
  • Process: Physical Vapor Deposition; Resistance Evaporation (optional feature); Electron Beam Evaporation (optional feature); DC_Sputter (optional feature); Multiple Processes (optional feature)
  • Type: Batch; Laboratory or Benchtop
  • Materials Processed: Metal; Polymer
Temescal -- BCD-2800
from Edwards Vacuum

The newly designed BCD-2800 provides an upgrade and improvement option for customers processing requirements formerly filled by our VES-2550 load lock evaporation system. This mid-sized system offers tooling options that support either lift off or conformal (step coverage) processes, with lift off... [See More]

  • Applications: Research / Surface Analysis
  • Process: Physical Vapor Deposition; Electron Beam Evaporation
  • Type: Batch
  • Materials Processed: Metal
Benchtop Plasma Cleaner -- PE-100
from Plasma Etch, Inc.

The all aluminum chamber features over 240 square inches of active processing surface with the three level standard configuration. The clean design features an industrial powder coated frame to guard your processing environment from contamination. [See More]

  • Applications: Research / Surface Analysis; Printed Circuit Boards
  • Process: Plasma Etching and Cleaning
  • Type: Laboratory or Benchtop
  • Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
from ULVAC Technologies, Inc.

CE-300I High-Density Plasma Etching System for R &D CE-300I:ISM (Inductively Super Magnetron) is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies. [See More]

  • Applications: MEMS; Research / Surface Analysis; Optical Devices
  • Process: Plasma Etching and Cleaning
  • Type: Free Standing System
  • Wafer / Part Size: 150