Semiconductor Manufacturing Thin Film Equipment Datasheets

Cluster Tool Systems -- UNIVEX C
from Leybold USA Inc.

Cluster-Tool Systems UNIVEX C. For special applications we can also supply cluster systems based on the UNIVEX concept. These clusters are equipped according to customer requirements and incorporate separate processing, load lock and transfer chambers. Frequently sputter applications are involved... [See More]

  • Applications: Semiconductors
  • Process: Physical Vapor Deposition; Resistance Evaporation (optional feature); Electron Beam Evaporation (optional feature); DC_Sputter (optional feature); RF_Sputter (optional feature); Multiple Processes; Vacuum Etching
  • Type: Free Standing System; Cluster Tool
  • Materials Processed: Metal; Polymer
Airgard - Cyclone Gas Scrubber
from EBARA Technologies, Inc.

Gas Inlet Devices. Patent gas inlet devices minimize rate of restriction and automatic gas inlet plunger removes restrictions without process interruptions. Second Scrubbing Chamber. Five fine spray, high velocity nozzles ensures effective removal of impurities. First Scrubbing Chamber. Coarse... [See More]

  • Applications: Semiconductors
  • Process: Chemical Vapor Deposition
  • Type: Free Standing System; Cluster Tool
  • Materials Processed: Tungsten; Metal; Silicon; Polymer; Nitrides
Benchtop Plasma Cleaner -- PE-50 XL
from Plasma Etch, Inc.

As in all Plasma Etch systems a capacitive parallel plate design is used for the most effective plasma generation. Competitive units with glass/quartz barrel chambers cannot penetrate the vacuum containment vessel and therefore are restricted to inductive coupling using an RF coil wrapped around the... [See More]

  • Applications: MEMS; Photovoltaic or solar cell; Research / Surface Analysis; Semiconductors; Medical; Printed Circuit Boards
  • Process: Plasma Etching and Cleaning
  • Type: Laboratory or Benchtop
  • Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
Complete Cathode System -- e-Cathode™
from Sputtering Components, Inc.

E-cathode can be equipped with SC, MC, SM, or MM type cathode [See More]

  • Applications: Flat Panel Display; Optical Coatings; Photovoltaic or solar cell; Semiconductors
  • Process: Physical Vapor Deposition; RF_Sputter; DC Magnetron Sputtering; DC Pulsed Sputtering; MFAC Sputtering
  • Type: Laboratory or Benchtop; Complete Cathode System
  • Materials Processed: Aluminum; Tungsten; Metal; Silicon; Dielectric or Ceramic; Oxides; Silicides; Nitrides; TCO
EWA Series
from ULVAC Technologies, Inc.

EW Series models are deposition systems for evaporation of metal or oxides onto continuously-wound plastic film, paper or metal foil. Models range from compact types for research, to systems for mass-production. They can be used to manufacture products such as packaging materials, capacitors and... [See More]

  • Applications: Optical Coatings; Research / Surface Analysis; Semiconductors; Magnetic storage
  • Materials Processed: Metal; Oxides
  • Process: Physical Vapor Deposition; Induction Evaporation
  • Wafer / Part Size: 3000