Metal Thin Film Equipment Datasheets

Cluster Tool Systems -- UNIVEX C
from Leybold USA Inc.

Cluster-Tool Systems UNIVEX C. For special applications we can also supply cluster systems based on the UNIVEX concept. These clusters are equipped according to customer requirements and incorporate separate processing, load lock and transfer chambers. Frequently sputter applications are involved... [See More]

  • Materials Processed: Metal; Polymer
  • Process: Physical Vapor Deposition; Resistance Evaporation (optional feature); Electron Beam Evaporation (optional feature); DC_Sputter (optional feature); RF_Sputter (optional feature); Multiple Processes; Vacuum Etching
  • Type: Free Standing System; Cluster Tool
  • Applications: Semiconductors
Airgard - Cyclone Gas Scrubber
from EBARA Technologies, Inc.

Gas Inlet Devices. Patent gas inlet devices minimize rate of restriction and automatic gas inlet plunger removes restrictions without process interruptions. Second Scrubbing Chamber. Five fine spray, high velocity nozzles ensures effective removal of impurities. First Scrubbing Chamber. Coarse... [See More]

  • Materials Processed: Tungsten; Metal; Silicon; Polymer; Nitrides
  • Process: Chemical Vapor Deposition
  • Type: Free Standing System; Cluster Tool
  • Applications: Semiconductors
Temescal -- BCD-2800
from Edwards Vacuum

The newly designed BCD-2800 provides an upgrade and improvement option for customers processing requirements formerly filled by our VES-2550 load lock evaporation system. This mid-sized system offers tooling options that support either lift off or conformal (step coverage) processes, with lift off... [See More]

  • Materials Processed: Metal
  • Process: Physical Vapor Deposition; Electron Beam Evaporation
  • Type: Batch
  • Applications: Research / Surface Analysis
Benchtop Plasma Cleaner -- PE-100
from Plasma Etch, Inc.

The all aluminum chamber features over 240 square inches of active processing surface with the three level standard configuration. The clean design features an industrial powder coated frame to guard your processing environment from contamination. [See More]

  • Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
  • Process: Plasma Etching and Cleaning
  • Type: Laboratory or Benchtop
  • Applications: Research / Surface Analysis; Printed Circuit Boards
Complete Cathode System -- e-Cathode™
from Sputtering Components, Inc.

E-cathode can be equipped with SC, MC, SM, or MM type cathode [See More]

  • Materials Processed: Aluminum; Tungsten; Metal; Silicon; Dielectric or Ceramic; Oxides; Silicides; Nitrides; TCO
  • Process: Physical Vapor Deposition; RF_Sputter; DC Magnetron Sputtering; DC Pulsed Sputtering; MFAC Sputtering
  • Type: Laboratory or Benchtop; Complete Cathode System
  • Applications: Flat Panel Display; Optical Coatings; Photovoltaic or solar cell; Semiconductors
Nanoparticle Deposition System -- FlameBeam
from Tethis S.r.l.

FlameBeam is the Tethis' system for the deposition on nanostructured thin films assembled by nanoparticles produced with the flame spray pyrolysis process. Deposition system is structured in three main stages: the feeding/control stage, the FlameBeam Source (FBS) and the deposition chamber, with its... [See More]

  • Materials Processed: Metal; Diamond-like Carbon; Oxides; Nitrides; B, P, Sb, Ga, As or other dopants
  • Process: Physical Vapor Deposition; Flame Spray Pyrolysis
  • Type: Batch (optional feature); Laboratory or Benchtop
  • Applications: Nanomaterials; Photovoltaic or solar cell; Medical; Fuel Cell Electrodes, Sorbents
EWA Series
from ULVAC Technologies, Inc.

EW Series models are deposition systems for evaporation of metal or oxides onto continuously-wound plastic film, paper or metal foil. Models range from compact types for research, to systems for mass-production. They can be used to manufacture products such as packaging materials, capacitors and... [See More]

  • Materials Processed: Metal; Oxides
  • Applications: Optical Coatings; Research / Surface Analysis; Semiconductors; Magnetic storage
  • Process: Physical Vapor Deposition; Induction Evaporation
  • Wafer / Part Size: 3000