Factory / Free Standing  Thin Film Equipment Datasheets

Cluster Tool Systems -- UNIVEX C
from Leybold USA Inc.

Cluster-Tool Systems UNIVEX C. For special applications we can also supply cluster systems based on the UNIVEX concept. These clusters are equipped according to customer requirements and incorporate separate processing, load lock and transfer chambers. Frequently sputter applications are involved... [See More]

  • Type: Free Standing System; Cluster Tool
  • Applications: Semiconductors
  • Process: Physical Vapor Deposition; Resistance Evaporation (optional feature); Electron Beam Evaporation (optional feature); DC_Sputter (optional feature); RF_Sputter (optional feature); Multiple Processes; Vacuum Etching
  • Materials Processed: Metal; Polymer
Airgard - Cyclone Gas Scrubber
from EBARA Technologies, Inc.

Gas Inlet Devices. Patent gas inlet devices minimize rate of restriction and automatic gas inlet plunger removes restrictions without process interruptions. Second Scrubbing Chamber. Five fine spray, high velocity nozzles ensures effective removal of impurities. First Scrubbing Chamber. Coarse... [See More]

  • Type: Free Standing System; Cluster Tool
  • Applications: Semiconductors
  • Process: Chemical Vapor Deposition
  • Materials Processed: Tungsten; Metal; Silicon; Polymer; Nitrides
Industrial Plasma Etching System -- MK-II
from Plasma Etch, Inc.

The generous aluminum chamber accommodates a properly sized active processing surface with our standard configurations having as few as 6 or as many as 24 plasma processing levels, each 24 ” by 18. ”. Our oxygen service vacuum pump and booster is equipped with a two point purge system to... [See More]

  • Type: Free Standing System
  • Applications: Research / Surface Analysis; Printed Circuit Boards
  • Process: Plasma Etching and Cleaning
  • Materials Processed: Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals
Nanoparticle Deposition System -- SCBD PMCS
from Tethis S.r.l.

The Pulsed Microplasma Cluster Source (PMCS) is a high-intensity nanoparticle source, for vacuum thin film deposition. Two vacuum chambers compose the deposition system: the expansion chamber for the supersonic beam generation and the deposition chamber for the collection of the nanoparticles over... [See More]

  • Type: Free Standing System; Cluster Tool
  • Applications: Nanomaterials
  • Process: Physical Vapor Deposition; Electron Beam Evaporation
  • Materials Processed: Aluminum; Tungsten; Metal; Diamond-like Carbon; Oxides; Nitrides
from ULVAC Technologies, Inc.

CE-300I High-Density Plasma Etching System for R &D CE-300I:ISM (Inductively Super Magnetron) is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies. [See More]

  • Type: Free Standing System
  • Applications: MEMS; Research / Surface Analysis; Optical Devices
  • Process: Plasma Etching and Cleaning
  • Wafer / Part Size: 150