510™ Gasket Eliminator® Flange Sealant -- 51031 [51031 from Henkel Corporation]
from Applied Industrial Technologies

50 mL Tube; Has a Temperature Range to 400 °F w/Excellent Solvent and Chemical Resistance; Makes or Dresses Gaskets in Rigid Assemblies; Elminates Gasket Compression Set [See More]

  • Features: Gap Filler, Foam in Place Gasket; UL Rating
  • Viscosity: 188000 to 500000
  • Cure / Technology: Anaerobic; Single Component
  • Gap Fill: 0.0100 to 0.0200
Arontite Anaerobic Primer -- Primer
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)

Toagosei offers a full line of Arontite brand Anaerobics for production and maintenance applications. Arontite Anaerobics are available in varying viscosities and strengths for virtually any application including exposure to extreme environments and formulated for threadlocking, retaining and... [See More]

  • Features: Gap Filler, Foam in Place Gasket; Threadlocker or Retainer
  • Type / Form: Liquid
  • Cure / Technology: Anaerobic; Single Component
  • Substrate Compatibility: Metal
COMMERCIAL TRANSPORTATION BETAFILL™
from Dow Automotive Systems

Providing One-Step Sealing and Filling Solutions. BETAFILL seam sealants fll and seal in one step, providing factory-standard seam and panel sealing, gap flling and panel bonding for a wide range of applications. These single-component, moisture-curing polyurethane sealants offer permanent... [See More]

  • Features: Gap Filler, Foam in Place Gasket
  • Industry: Automotive
Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Non-corrosive; Gap Filler, Foam in Place Gasket
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Bostik 2175FS Urethane Sealant Black 20oz -- A67721-KT
from Ellsworth Adhesives

Bostik 2175FS is a one component, moisture curing, adhesive / sealant based upon Bostik Hybrid Technology. It has easy application with manual caulk applicator. Sold as a pack (24/pk). [See More]

  • Features: Gap Filler, Foam in Place Gasket
  • Substrate Compatibility: Metal
  • Cure / Technology: Single Component; Reactive or Moisture Cured
  • Industry: Automotive
Adhesive,1lb Bottle -- 5XB50 [42261 from Henkel Corporation]
from Grainger Industrial Supply

Adhesive, General Purpose, Size 1lb Bottle, Clear, Temperature Range -65 to 180 F, Bonds To Plastic, General Purpose, Gap Filling, Application 1 Part No Mixing, Viscosity 2500cP, Specific Gravity 1.100 @25 C, Curing Time 30 Seconds to 24 Hours, Tensile Strength 3200 PSI, Agency Compliance CFIA,... [See More]

  • Features: Gap Filler, Foam in Place Gasket
  • Use Temperature: -65 to 180
  • Viscosity: 2500
  • Tensile (Break): 3200
INSULCAST RTVS 12 General Purpose RTV Silicone Potting Compound
from ITW Polymer Technologies - Insulcast Division

RTVS 12 is a multi-purpose compound designed for use as an encapsulant, sealant, potting and mold making material. RTVS 12 exhibits excellent electrical properties, low temperature flexibility and high temperature stability. A variety of catalysts are available for different cure situations. (See... [See More]

  • Features: Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
SolarBond™ Frame Sealant
from Saint-Gobain Plastic Films and Tapes

SolarBond Frame Sealant. SolarBondTM Frame Sealant is a new generation frame sealant that brings increased performance while reducing the overall production costs for PV module manufacturers. [See More]

  • Features: High Dielectric; Gap Filler, Foam in Place Gasket
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Photovoltaic Laminate
  • Cure / Technology: Thermoset; Single Component
  • Industry: Solar
ArmorSeal® Crack Filler
from Sherwin-Williams Protective & Marine Coatings

ArmorSeal ®CRACK FILLER is a two-component, fast set epoxy paste developed specifically for sealing, smoothing, and fairing applications on concrete, metals, plastics (FRP), wood, or masonry. The smooth consistency and excellent non-sagging properties allow the product to be used on vertical and... [See More]

  • Features: Flame Retardant; Leveling Filling; Gap Filler, Foam in Place Gasket
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
3M™ Scotch-Weld™ Core Splice Adhesive -- EC-3500 Part A
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. [See More]

  • Features: Leveling Filling; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type / Form: Grease, Paste
Scotch® Insulating Spray 1601
from 3M Fire Protection

Fast-drying, protects surfaces against weather, moisture, corrosion, oil [See More]

  • Features: High Dielectric; Gap Filler, Foam in Place Gasket
  • Type / Form: Liquid
  • Cure / Technology: Air Setting / Film Drying; Single Component
  • Substrate Compatibility: Metal; Rubber or Elastomer
Firestop Putty Pad -- PuttyPad
from Acoustical Solutions, Inc.

FireStop Putty Pads provide acoustical protection for wall penetrations in the form of a release lined pad for easy application to electrical boxes or other penetrates. The pad is conveniently sized to fit a typical 1 ½" deep 4S box with no cutting or piercing required. Faced on both sides with a... [See More]

  • Features: Flexible; Flame Retardant; Gap Filler, Foam in Place Gasket; UL Rating
  • Type / Form: Grease, Paste
  • Cure / Technology: Single Component
  • Substrate Compatibility: Metal; Plastic; Rubber or Elastomer
High Performance Adhesive Sealant -- 80050 [80050 from Permatex, an ITW Company]
from All-Spec Industries

" This item can not be exported outside the United States" [See More]

  • Features: Flexible; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Type / Form: Grease, Paste
S'MOOTH™Thread Sealant with PTFE
from Anti-Seize Technology

Fast drying, non-toxic, non-corrosive, suitable for uses in potable water [See More]

  • Features: Gap Filler, Foam in Place Gasket
  • Type / Form: Grease, Paste
  • Cure / Technology: Air Setting / Film Drying
  • Substrate Compatibility: Metal
Aremco-Seal™ -- 4030
from Aremco Products, Inc.

Hi-temp, prevents dusting of fibrous insulation materials [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset
Low Density Silicone Aerospace Sealant -- Bluesil™ V-622
from Bluestar Silicones USA Corp.

black, two component, low density Silicone Aerospace Sealant. Properties. Viscosity 190000. Hardness Sha 56. Description. Bluesil V-622 is a black, two component addition cure, flowable silicone aerospace sealant. It is specifically designed for, and qualified to, Pratt & Whitney Specification... [See More]

  • Features: Gap Filler, Foam in Place Gasket
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Substrate Compatibility: Metal; Plastic
Epoxy Adhesive -- 10-3022
from Epoxies Etc...

10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3022 is widely used as a stencil and screen adhesive due to its bonding strength and toughness. It has been used extensively to bond polyester mesh to aluminum frames and... [See More]

  • Features: High Dielectric; Gap Filler, Foam in Place Gasket
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Non-corrosive; Gap Filler, Foam in Place Gasket; UL Rating
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Air Setting / Film Drying; Two Component  
H2O Splice Control Gel Compound -- H2OSCGC
from H2O Control Products, Inc.

Splice Filling Gel - available in a range of sizes & formats [See More]

  • Features: Gap Filler, Foam in Place Gasket
  • Type / Form: Gel
  • Cure / Technology: Single Component
  • Industry: Automotive; Electronics; Marine; Construction; OEM or Industrial
Circuit Board Protection -- 5084
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Features: Gap Filler, Foam in Place Gasket; Thermal Insulation
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
Cylinlock® -- 822
from Hernon Manufacturing, Inc.

Cylinlock ® Retaining Compounds are highly engineered, 100% active, high strength anaerobic liquids that cure to a. tough plastic when air is excluded. The plastic shim formed when Cylinlock ® cures fills the voids present in even the. best shrink or press fits. These compounds also find... [See More]

  • Features: High Dielectric; Non-corrosive; Phase Change; Gap Filler, Foam in Place Gasket; Thermal Insulation; Threadlocker or Retainer
  • Composition: Unfilled
  • Chemical System: Acrylic
  • Cure / Technology: Anaerobic; Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Instantbond™ -- Grade 110
from Hi-Tech Seals, Inc.

Classic cyanoacrylates are represented by the ethyl and methyl chemistries. Generally, the methyls offer better bond strengths on metals, the ethyls providing better strengths on everything else. Substrate selection and bond line configuration directly influence adhesive performance. [See More]

  • Features: Gap Filler, Foam in Place Gasket
  • Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Cyanoacrylate
  • Type / Form: Liquid
Silicone Compound -- RTV 400-900
from Novagard Solutions

Non-corrosive, single component silicone compound, non-flowable [See More]

  • Features: High Dielectric; Non-corrosive; Gap Filler, Foam in Place Gasket; UL Rating
  • Composition: Unfilled
  • Chemical System: Silicone; Elastomeric
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Features: Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component