Electrically Insulative and Thermally Conductive Epoxy -- TD1001
from Epoxy Technology

Product Description: EPO-TEK ® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK ® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and low modulus are a few... [See More]

  • Industry: Electronics; Photonics; Semiconductors, IC's
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type / Form: Grease, Paste
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
Epoxy -- 115-1322
from All-Spec Industries

"The CircuitMedic 115-1322 is a high strength, high temperature epoxy kit. " [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type / Form: Liquid
Hysol® Semiconductor Encapsulant -- FP4511
from Henkel Corporation - Electronics

Meets JEDEC level testing requirements, compatible with lead free testing [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Industry: Electronics; Electric Power; Laminaes; OEM or Industrial; Semiconductors, IC's
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component