Electrially Insulative Epoxy -- OD1001
from Epoxy Technology

A single component, thermally and electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, several weeks of pot life and low modulus are a few of it traits. It is particularly suitable for bonding, sealing and potting ferrite cores in power device... [See More]

  • Industry: Electronics; Optical; Photonics; Semiconductors, IC's
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type / Form: Grease, Paste
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
Gap Filler 1000 [Gap Filler 1000 from Bergquist Company (The)]
from Quist Electronics

Ultra-conforming, designed for fragile and low-stress applications [See More]

  • Industry: Automotive; Electronics; OEM or Industrial; Semiconductors, IC's; Telecommunications
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Type / Form: Liquid
Epoxy -- 115-1322
from All-Spec Industries

"The CircuitMedic 115-1322 is a high strength, high temperature epoxy kit. " [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type / Form: Liquid
Hysol® Semiconductor Encapsulant -- FP4511
from Henkel Corporation - Electronics

Meets JEDEC level testing requirements, compatible with lead free testing [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Industry: Electronics; Electric Power; Laminaes; OEM or Industrial; Semiconductors, IC's
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component