Semiconductors / IC Packaging Industrial Sealants Datasheets

Clear, UV Curable Adhesive -- EPO-TEK® UJ1190
from Epoxy Technology

Clear, UV curable adhesive. [See More]

  • Industry: Optical; Photonics; Semiconductors, IC's
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
Acid Resistant, Two Component Epoxy -- EP21AR
from Master Bond, Inc.

Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Construction; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
Epoxy -- 115-1322
from All-Spec Industries

"The CircuitMedic 115-1322 is a high strength, high temperature epoxy kit. " [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type / Form: Liquid
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Industry: Electronics; Electric Power; Laminaes; OEM or Industrial; Semiconductors, IC's
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component