Megum™ 3110 Solvent-Based Adhesive
from Dow Automotive Systems

Ready to use solvent-borne primer for use with various cover-coat [See More]

  • Cure / Technology: Peroxide
  • Substrate Compatibility: Rubber or Elastomer
  • Chemical System: Elastomeric
  • Features: Caulk, Grout; Solvent Based
Dow Corning® 3-8186 Thixotropic Foam
from Dow Corning Automotive Solutions

Features. Reduced flow. Low durometer. Benefits. Robotically Dispensed in place gasketing applications. Low sealing force [See More]

  • Cure / Technology: Two Component  ; Platinum Cure
  • Type / Form: Liquid
  • Chemical System: Silicone; Elastomeric
  • Industry: Automotive
ECHELON™ -- MC 400
from Dow Polyurethanes

ECHELON ™ Polyurethane Prepolymers offer a competitive edge to adhesive and sealant formulators by providing greater efficiency and enhanced performance benefits, such as: Meet a wide range of viscosity, flexibility, water resistance and storage stability requirements. Eliminate processing... [See More]

  • Cure / Technology: Two Component  ; Reactive or Moisture Cured (optional feature); Addition of a Chain Extender
  • Type / Form: Gel
  • Chemical System: Polyurethane
  • Features: Water Based 
Epoxylite® -- E 810-1 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Sets at R.T. with E 810-1 Accelerator
  • Composition: Filled
  • Chemical System: Epoxy
  • Type / Form: Liquid
Dow Corning 1-2577 Low VOC Silicone Conformal Coating 408g -- 1-2577 LOW VOC CTG 408G
from Ellsworth Adhesives

One-part, medium viscosity; ozone-safe (VOC exempt) solvent borne, elastoplastic silicone resin; excellent abrasion resistance. Other sizes available. Documentation: Dow Corning MSDS/TDS [See More]

  • Cure / Technology: Low VOC
  • Features: Encapsulant or Conformal Coating
  • Chemical System: Silicone
  • Industry: Aerospace; Automotive; Electronics; Marine; Sanitary; Military; Photonics; OEM or Industrial
Weatherban Ribbon Sealant PF5422 -- PF5422 [PF5422 from 3M]
from R. S. Hughes Company, Inc.

Makes watertight, gasket-like seal [See More]

  • Cure / Technology: Non Curing
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Chemical System: Elastomeric
  • Features: Flexible
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Cure / Technology: Two Component  ; Chemically Set
  • Composition: Unfilled
  • Chemical System: Ceramic
  • Type / Form: Liquid; Powder
RTV-2 Silicone Rubber -- ELASTOSIL® RT 772
from Wacker Chemical Corp.

ELASTOSIL ® RT 772 is a pourable, condensationcuring, two-component silicone rubber with good primerless adhesion. Special features. low viscosity. very good heat resistance. fast cure at room temperature. good primerless adhesion. UL 94HB listed, when cured with Catalyst T 77. Application. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Condensation Cured
  • Type / Form: Grease, Paste
  • Chemical System: Silicone; Elastomeric
  • Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates
Similar parts from Wacker Chemical Corp.
AST-Lock™ 09RC
from Anti-Seize Technology

Designed for augmenting the strength of press-fitted assemblies [See More]

  • Cure / Technology: Air Setting / Film Drying
  • Type / Form: Grease, Paste
  • Chemical System: Alkyd
  • Substrate Compatibility: Metal
EXPAND-A-SEAL ES0105™
from ND Industries, Inc.

Unique microencapsulated expanding thread sealing and locking compound [See More]

  • Cure / Technology: Air Setting / Film Drying; Expanding Thread Sealant
  • Type / Form: Liquid
  • Composition: Unfilled
  • Substrate Compatibility: Metal
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