Conap™ Filtration Adhesives & Sealants -- CONATHANE® FP-1303
from ACCRAbond, Inc.

CONATHANE ® FP-1303 White or Amber is a two-component, unfilled, fast setting polyurethane sealant designed for use in HEPA and other air filtration devices. CONATHANE ® FP-1303 is also used for potting, casting, embedding, and encapsulating of electronic circuits, components, and power... [See More]

  • Features: Encapsulant, Potting Compound
  • Cure / Technology: Two Component  
  • Chemical System: Polyurethane
734 Flowable Sealant -- 734CL300ML CRT [734CL300ML CRT from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

10.1 oz Cartridge; Clear; One Part RTV Liquid; Cures At Room Temperature; Not For Use on Vertical Or Overhead Surfaces [See More]

  • Features: Encapsulant, Potting Compound; UL Rating
  • Type / Form: Liquid
  • Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing; Cure By Acetic Acid
  • Substrate Compatibility: Metal
VORANOL™ -- 220-260
from Dow Polyurethanes

Dow provides a wide variety of VORANOL* polyether polyols. with an extensive selection of performance and processing attrib-. utes. Designed to meet your needs, this large family of polyols. is sure to provide the balance of properties needed within rigid. and molded foam and isocyanate product... [See More]

  • Features: Encapsulant, Potting Compound; Water Based 
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Polyurethane
  • Type / Form: Gel
Electrially Insulative Epoxy -- OD1001
from Epoxy Technology

A single component, thermally and electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, several weeks of pot life and low modulus are a few of it traits. It is particularly suitable for bonding, sealing and potting ferrite cores in power device... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type / Form: Grease, Paste
Filter-bond™ Elastomeric Casting and Potting Compound -- E-3264
from Hapco, Inc.

Filter-bond ™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond ™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval. Filter-bond... [See More]

  • Features: Encapsulant, Potting Compound; Flexible
  • Cure / Technology: Two Component  
  • Chemical System: Elastomeric; Polyurethane
  • Type / Form: Liquid
INSULCAST RTVS 12 General Purpose RTV Silicone Potting Compound
from ITW Polymer Technologies - Insulcast Division

RTVS 12 is a multi-purpose compound designed for use as an encapsulant, sealant, potting and mold making material. RTVS 12 exhibits excellent electrical properties, low temperature flexibility and high temperature stability. A variety of catalysts are available for different cure situations. (See... [See More]

  • Features: Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Fast Curing, One Component Silicone -- MS711
from Master Bond, Inc.

Master Sil 711 is a ready-to use, exceptionally fast curing, one component high performance silicone elastomer compound for bonding, sealing, protective coatings and formed-in-place gaskets. This compound is self leveling and can be readily applied to various surfaces. It cures at ambient... [See More]

  • Features: Encapsulant, Potting Compound; Encapsulant or Conformal Coating
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Thermally Conductive
  • Cure / Technology: Air Setting / Film Drying; Two Component   (optional feature); Single Component (optional feature)
  • Chemical System: Ceramic
  • Type / Form: Liquid (optional feature); Powder (optional feature)
RTV-1 Silicone Rubber / Adehesive -- ELASTOSIL® N 2010
from Wacker Chemical Corp.

ELASTOSIL ® N2010 is a self-leveling, one-component silicone sealant, which cures at room temperature under the influence of moisture. Special features. neutral curing system (alkoxy). translucent. sprayable. flowable. primerless adhesion to many substrates. solvent free. Application. [See More]

  • Features: Encapsulant, Potting Compound; Leveling Filling
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone; Elastomeric
  • Type / Form: Liquid
Aremco-Seal™ -- 4030
from Aremco Products, Inc.

Hi-temp, prevents dusting of fibrous insulation materials [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset
Adhesive and encapsulating resin -- 60-7170R
from Epoxies Etc...

UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good choice for potting... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Non-corrosive; Gap Filler, Foam in Place Gasket; UL Rating
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Air Setting / Film Drying; Two Component  
GSP 1552-2
from GS Polymers, Inc.

Two part, 1:1, optically clear soft, water and UV resistant [See More]

  • Features: Encapsulant, Potting Compound
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Circuit Board Protection -- 5088
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Features: Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
Tuffbond™ -- 305
from Hernon Manufacturing, Inc.

Tuffbond „ ¢ epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Phase Change; Gap Filler, Foam in Place Gasket
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Epoxy Potting Compound -- E112
from Koford Engineering, LLC

E-112 is a high performance, light weight, hollow glass microsphere filled single component pottingmaterial. It is especially suited for applications which involve potting assemblies which have small openingsaround terminals or switches. The microspheres are of sufficient size that the epoxy will... [See More]

  • Features: Encapsulant, Potting Compound
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Single Component
  • Use Temperature: 320 to 392
Silicone Coating -- RTV 200-250
from Novagard Solutions

Non-corrosive, single component silicone coating & encapsulating compound [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Non-corrosive
  • Composition: Unfilled
  • Chemical System: Silicone; Elastomeric
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Features: Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component