from Bruker Nano Surfaces Division
Micro-mechanical tests have been used to measure mechanical properties of coatings or bulk materials. Instrumented micro-mechanical test improves on the traditional ones by providing in-situ load-displacement data and by using advanced signals like acoustic emission, ECR, friction, etc. for more... [See More]
- Applications: Wafer; Memory drive disc or head; CVD / PVD; Optical components or lenses; Solar Cells, MEMS, Fuel Cells
- Mounting / Loading: Manual loading
- Form Factor: Monitor or instrument
- Technology: Scratch Tester
from Hiden Analytical
The Hiden Plasma Workstation, an integrated RF-ICP reactor / plasma analyser system for all you plasma process studies. [See More]
- Applications: Optical components or lenses; Etching
- Mounting / Loading: In-process, in-situ or system mounted
- Form Factor: Monitor or instrument; Controller
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS)
from StellarNet, Inc.
TF Systems for Non-Contact Film Thickness Measurements. We offer a complete line of film thickness measurement systems that can measure from 5 nm to 200 µm for analysis of single layer and/or multilayer films in less than a second. StellarNet thin film reflectometry systems consist of a portable USB... [See More]
- Applications: Wafer (optional feature); Memory drive disc or head (optional feature); CVD / PVD (optional feature); Flat panel display (optional feature); Optical components or lenses (optional feature); Polishing / CMP (optional feature); Polymer or photoresist films (optional feature); Thin-Film Photovoltaics
- Mounting / Loading: In-process, in-situ or system mounted
- Form Factor: Monitor or instrument
- Technology: Reflectometer
from Corning Specialty Materials
Ideal for processes development, particularly for new, non-silicon material [See More]
- Applications: Wafer; Optical components or lenses
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Interferometer
from TELOPS, Inc.
The laser diode bar tester picks up each laser diode bar from the tape and measures LIV, wavelength and FFP characteristics for each die. [See More]
- Applications: Packaged IC or substrate; Optical components or lenses; Laser Diode Bar Tester
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument; ProbingSystem
- Technology: Optical / Imaging; IV system or SMU; Wafer sorter or prober
from ULVAC Technologies, Inc.
High resolution, high speed sampling, long life span [See More]
- Applications: Wafer; CVD / PVD; Flat panel display; Optical components or lenses
- Mounting / Loading: In-process, in-situ or system mounted
- Form Factor: Monitor or instrument; Controller
- Technology: Quartz crystal microbalance
from WDI Wise Device Inc.
This is the only commercially available microscope guaranteeing transmission of more then 80% for all four YAG laser harmonics: 266, 355, 532, and 1064nm - without compromising the review channel fidelity. The MIC4 microscope is instrumental in laser repair of TFT arrays over the wavelength ranging... [See More]
- Applications: CVD / PVD; Electroplate; Flat panel display; Packaged IC or substrate; Optical components or lenses; Photolithography; PV Cell, Laser Micromachining, Photomask
- Mounting / Loading: In-process, in-situ or system mounted (optional feature); Floor (optional feature)
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging
from Zygo Corporation
Excellent precision and accuracy [See More]
- Applications: Wafer; Memory drive disc or head; Packaged IC or substrate; Optical components or lenses; Surface Topography, Micromachining
- Mounting / Loading: Manual loading
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM; Optical / Imaging; Interferometer
