from Bruker Nano Surfaces Division
Micro-mechanical tests have been used to measure mechanical properties of coatings or bulk materials. Instrumented micro-mechanical test improves on the traditional ones by providing in-situ load-displacement data and by using advanced signals like acoustic emission, ECR, friction, etc. for more... [See More]
- Form Factor: Monitor or instrument
- Technology: Scratch Tester
- Mounting / Loading: Manual loading
- Applications: Wafer; Memory drive disc or head; CVD / PVD; Optical components or lenses; Solar Cells, MEMS, Fuel Cells
from Filmetrics, Inc.
Automated Cassette-to-Cassette Thin-Film Thickness Mapping System for Production Environments. The Filmetrics F60-c family maps film thickness and index just like our F50 products, but it also includes a number of features intended specifically for production environments. These include automatic... [See More]
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); Spectral Reflectance
- Mounting / Loading: In-process, in-situ or system mounted
- Applications: Wafer; CVD / PVD
from Hiden Analytical
The Hiden Plasma Workstation, an integrated RF-ICP reactor / plasma analyser system for all you plasma process studies. [See More]
- Form Factor: Monitor or instrument; Controller
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS)
- Mounting / Loading: In-process, in-situ or system mounted
- Applications: Optical components or lenses; Etching
from MicroSense, LLC
The Polar Kerr System for MRAM utilizes the polar Magneto-Optical Kerr Effect (MOKE) to characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM. Utilizing a non-contact full-wafer measurement technique, the system creates a map of... [See More]
- Form Factor: Monitor or instrument
- Technology: Magnetometer
- Mounting / Loading: Floor
- Applications: Wafer
from Nor-Cal Products, Inc.
Nor-Cal Products Deposition Monitors are used to measure the thin film (deposition) thicknesses, rate of deposition or frequency, in conjunction with the crystal sensor. Models are available which independently monitor 2 or 6 crystals. Included Windows software allows the user to change the monitor... [See More]
- Form Factor: Monitor or instrument
- Applications: Wafer
from StellarNet, Inc.
TF Systems for Non-Contact Film Thickness Measurements. We offer a complete line of film thickness measurement systems that can measure from 5 nm to 200 µm for analysis of single layer and/or multilayer films in less than a second. StellarNet thin film reflectometry systems consist of a portable USB... [See More]
- Form Factor: Monitor or instrument
- Technology: Reflectometer
- Mounting / Loading: In-process, in-situ or system mounted
- Applications: Wafer (optional feature); Memory drive disc or head (optional feature); CVD / PVD (optional feature); Flat panel display (optional feature); Optical components or lenses (optional feature); Polishing / CMP (optional feature); Polymer or photoresist films (optional feature); Thin-Film Photovoltaics
from Corning Specialty Materials
Ideal for processes development, particularly for new, non-silicon material [See More]
- Form Factor: Monitor or instrument
- Technology: Interferometer
- Mounting / Loading: Floor
- Applications: Wafer; Optical components or lenses
from KLA-Tencor Corporation
The KLA-Tencor 300 UV Series was the first reticle inspection family using UV illumination for the inspection of DUV reticles. With the higher resolution UV wavelength and new defect detection technology, the 300UV reticle inspection systems can inspect reticles with advanced design rules, critical... [See More]
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging; UV Inspection
- Mounting / Loading: Floor
- Applications: Photolithography
from Olympus America Inc.
The Olympus MX51 industrial inspection microscope is optimized for the inspection requirements of a variety of electronic components including semiconductor wafer inspection. Its compact size, ease of operation, 6"x6" stage travel and cost effectiveness make the MX51 an ideal inspection microscope... [See More]
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging
- Mounting / Loading: In-line (optional feature); Manual loading
- Applications: Wafer
from Park Systems, Inc.
Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM
- Mounting / Loading: Floor
- Applications: Wafer
from Polytec, Inc.
For the best yields it is necessary to optimize your process. Measuring and understanding the characteristicsof your product allows continuous improvement. The AVT-1000 enables you to measure all critical parame-ters on metal or glass such as Roughness, Waviness, and Defects. The AVT can measure... [See More]
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging; Laser Doppler Vibrometry
- Mounting / Loading: Floor
- Applications: Memory drive disc or head
from TELOPS, Inc.
The laser diode bar tester picks up each laser diode bar from the tape and measures LIV, wavelength and FFP characteristics for each die. [See More]
- Form Factor: Monitor or instrument; ProbingSystem
- Technology: Optical / Imaging; IV system or SMU; Wafer sorter or prober
- Mounting / Loading: Floor
- Applications: Packaged IC or substrate; Optical components or lenses; Laser Diode Bar Tester
from ULVAC Technologies, Inc.
High resolution, high speed sampling, long life span [See More]
- Form Factor: Monitor or instrument; Controller
- Technology: Quartz crystal microbalance
- Mounting / Loading: In-process, in-situ or system mounted
- Applications: Wafer; CVD / PVD; Flat panel display; Optical components or lenses
from WDI Wise Device Inc.
This is the only commercially available microscope guaranteeing transmission of more then 80% for all four YAG laser harmonics: 266, 355, 532, and 1064nm - without compromising the review channel fidelity. The MIC4 microscope is instrumental in laser repair of TFT arrays over the wavelength ranging... [See More]
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging
- Mounting / Loading: In-process, in-situ or system mounted (optional feature); Floor (optional feature)
- Applications: CVD / PVD; Electroplate; Flat panel display; Packaged IC or substrate; Optical components or lenses; Photolithography; PV Cell, Laser Micromachining, Photomask
from Xenemetrix Ltd.
EX-6600 SDD. Secondary Target EDXRF. Xenemetrix ’s EX-6600 SDD Energy Dispersive X-ray Fluorescence (EDXRF) spectrometer offers the ultimate in sensitivity and selectivity. The Silicon Drift Detector (SDD) simultaneously delivers lower electronic noise and higher count rates which translates... [See More]
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); EDXRF
- Mounting / Loading: Manual loading; Floor
- Applications: Wafer; CVD / PVD; Electroplate
from Zygo Corporation
Simultaneously measures multiple parameters [See More]
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM; Optical / Imaging; Interferometer
- Mounting / Loading: In-line; Floor
- Applications: Wafer; CVD / PVD; Electroplate; Polishing / CMP; Photolithography; Etching; Bumping Processes
