Semiconductor Metrology Instruments - Spectral Interference Laser Displacement Meter -- SI-F01
from KEYENCE

SI-F Series Spectral Interference Displacement Meter. The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able to see even the... [See More]

  • Form Factor: Monitor or instrument; Controller; Sensor or sensing element
  • Technology: Interferometer
  • Mounting / Loading: In-process, in-situ or system mounted; In-line; Floor
  • Applications: Wafer; Memory drive disc or head; Flat panel display; Packaged IC or substrate
Polar Kerr System for MRAM
from MicroSense, LLC

The Polar Kerr System for MRAM utilizes the polar Magneto-Optical Kerr Effect (MOKE) to characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM. Utilizing a non-contact full-wafer measurement technique, the system creates a map of... [See More]

  • Form Factor: Monitor or instrument
  • Technology: Magnetometer
  • Mounting / Loading: Floor
  • Applications: Wafer
Deposition Monitor -- 2 Inputs
from Nor-Cal Products, Inc.

Nor-Cal Products Deposition Monitors are used to measure the thin film (deposition) thicknesses, rate of deposition or frequency, in conjunction with the crystal sensor. Models are available which independently monitor 2 or 6 crystals. Included Windows software allows the user to change the monitor... [See More]

  • Form Factor: Monitor or instrument
  • Applications: Wafer
Thin-Film Measuring Systems -- TF Series
from StellarNet, Inc.

TF Systems for Non-Contact Film Thickness Measurements. We offer a complete line of film thickness measurement systems that can measure from 5 nm to 200 ┬Ám for analysis of single layer and/or multilayer films in less than a second. StellarNet thin film reflectometry systems consist of a portable USB... [See More]

  • Form Factor: Monitor or instrument
  • Technology: Reflectometer
  • Mounting / Loading: In-process, in-situ or system mounted
  • Applications: Wafer (optional feature); Memory drive disc or head (optional feature); CVD / PVD (optional feature); Flat panel display (optional feature); Optical components or lenses (optional feature); Polishing / CMP (optional feature); Polymer or photoresist films (optional feature); Thin-Film Photovoltaics
Tropel® FlatMaster® -- FlatMaster® Wafer
from Corning Specialty Materials

Ideal for processes development, particularly for new, non-silicon material [See More]

  • Form Factor: Monitor or instrument
  • Technology: Interferometer
  • Mounting / Loading: Floor
  • Applications: Wafer; Optical components or lenses
ICP Plasma Workstation with EQP
from Hiden Analytical

The Hiden Plasma Workstation, an integrated RF-ICP reactor / plasma analyser system for all you plasma process studies. [See More]

  • Form Factor: Monitor or instrument; Controller
  • Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS)
  • Mounting / Loading: In-process, in-situ or system mounted
  • Applications: Optical components or lenses; Etching
300 UV Series
from KLA-Tencor Corporation

The KLA-Tencor 300 UV Series was the first reticle inspection family using UV illumination for the inspection of DUV reticles. With the higher resolution UV wavelength and new defect detection technology, the 300UV reticle inspection systems can inspect reticles with advanced design rules, critical... [See More]

  • Form Factor: Monitor or instrument
  • Technology: Optical / Imaging; UV Inspection
  • Mounting / Loading: Floor
  • Applications: Photolithography
Wafer Inspection System -- MX51
from Olympus America Inc.

The Olympus MX51 industrial inspection microscope is optimized for the inspection requirements of a variety of electronic components including semiconductor wafer inspection. Its compact size, ease of operation, 6"x6" stage travel and cost effectiveness make the MX51 an ideal inspection microscope... [See More]

  • Form Factor: Monitor or instrument
  • Technology: Optical / Imaging
  • Mounting / Loading: In-line (optional feature); Manual loading
  • Applications: Wafer
XE-3DM
from Park Systems, Inc.

Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]

  • Form Factor: Monitor or instrument
  • Technology: Profilometer or AFM
  • Mounting / Loading: Floor
  • Applications: Wafer
Advanced Vibrometry Tester -- AVT-1000
from Polytec, Inc.

For the best yields it is necessary to optimize your process. Measuring and understanding the characteristicsof your product allows continuous improvement. The AVT-1000 enables you to measure all critical parame-ters on metal or glass such as Roughness, Waviness, and Defects. The AVT can measure... [See More]

  • Form Factor: Monitor or instrument
  • Technology: Optical / Imaging; Laser Doppler Vibrometry
  • Mounting / Loading: Floor
  • Applications: Memory drive disc or head
In-line, Simultaneous WDXRF Spectrometer -- WaferX 300
from Rigaku Corporation

Rigaku's WaferX 300 represents the culmination of 25 years of experience in the X-ray fluorescence analysis of thin films on silicon wafers. Specifically developed as an in-process metrology tool, the system incorporates "bridge tool" technology — servicing 6", 8", as well as the latest 12"... [See More]

  • Form Factor: Monitor or instrument
  • Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); WDXRF
  • Mounting / Loading: Floor
  • Applications: Wafer
Laser Diode Bar Tester
from TELOPS, Inc.

The laser diode bar tester picks up each laser diode bar from the tape and measures LIV, wavelength and FFP characteristics for each die. [See More]

  • Form Factor: Monitor or instrument; ProbingSystem
  • Technology: Optical / Imaging; IV system or SMU; Wafer sorter or prober
  • Mounting / Loading: Floor
  • Applications: Packaged IC or substrate; Optical components or lenses; Laser Diode Bar Tester
CRTM Series -- CRTM-6000
from ULVAC Technologies, Inc.

High resolution, high speed sampling, long life span [See More]

  • Form Factor: Monitor or instrument; Controller
  • Technology: Quartz crystal microbalance
  • Mounting / Loading: In-process, in-situ or system mounted
  • Applications: Wafer; CVD / PVD; Flat panel display; Optical components or lenses
Laser Machining Microscope -- MIC4
from WDI Wise Device Inc.

This is the only commercially available microscope guaranteeing transmission of more then 80% for all four YAG laser harmonics: 266, 355, 532, and 1064nm - without compromising the review channel fidelity. The MIC4 microscope is instrumental in laser repair of TFT arrays over the wavelength ranging... [See More]

  • Form Factor: Monitor or instrument
  • Technology: Optical / Imaging
  • Mounting / Loading: In-process, in-situ or system mounted (optional feature); Floor (optional feature)
  • Applications: CVD / PVD; Electroplate; Flat panel display; Packaged IC or substrate; Optical components or lenses; Photolithography; PV Cell, Laser Micromachining, Photomask
EDXRF Analyzer -- EX-6600 SDD
from Xenemetrix Ltd.

EX-6600 SDD. Secondary Target EDXRF. Xenemetrix ’s EX-6600 SDD Energy Dispersive X-ray Fluorescence (EDXRF) spectrometer offers the ultimate in sensitivity and selectivity. The Silicon Drift Detector (SDD) simultaneously delivers lower electronic noise and higher count rates which translates... [See More]

  • Form Factor: Monitor or instrument
  • Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); EDXRF
  • Mounting / Loading: Manual loading; Floor
  • Applications: Wafer; CVD / PVD; Electroplate
Metrology System -- Z3D-7000 Series
from Zygo Corporation

Simultaneously measures multiple parameters [See More]

  • Form Factor: Monitor or instrument
  • Technology: Profilometer or AFM; Optical / Imaging; Interferometer
  • Mounting / Loading: In-line; Floor
  • Applications: Wafer; CVD / PVD; Electroplate; Polishing / CMP; Photolithography; Etching; Bumping Processes