Critical Dimension / Trench Geometry Wafer and Thin Film Instrumentation Datasheets

Packaging Metrology System -- APM650™
from Zygo Corporation

The APM650 ™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral... [See More]

  • Measurements: Critical dimensions or Trench geometry; Flatness; Roughness / Waviness; Area mapping; DepthProfiling
  • Mounting / Loading: Manual loading
  • Form Factor: Monitor or instrument
  • Technology: Interferometer
Focused Ion Beam System -- FB-2200
from Hitachi High Technologies America, Inc.

The FB2200 allows for rapid and precise specimen preparation for both transmission and scanning electron microscopy of semiconductors and other advanced materials. High precision and high milling rates. The use of a new low aberration ion optical system allows a maximum beam current of 60nA at an... [See More]

  • Measurements: Critical dimensions or Trench geometry; Flatness; FilmThickness
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Technology: FIB
SpectraCD 100
from KLA-Tencor Corporation

Provides process control information beyond one-dimensional CD. Offers real-time site-by-site CD, height or depth, sidewall angle and profile information with each measurement for maximum productivity. Performs thin film and CD metrology using Spectroscopic Ellipsometry (SE) technology system,... [See More]

  • Measurements: Critical dimensions or Trench geometry; Roughness / Waviness
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Technology: Ellipsometer; Profilometer or AFM; Spectrometer (SIMS, XRF, FTIR, DLTS, AAS)
SigmaTech Wafer Metrology Systems -- UltraMap-TSV
from MicroSense, LLC

The SigmaTech UltraMap-TSV system is the world ’s first fully automated TSV and deep trench metrology system capable of characterizing TSV and deep trench features from both the front and back sides of the wafer —up to 300mm in diameter. The UltraMap-TSV system can be offered in class-1... [See More]

  • Measurements: Critical dimensions or Trench geometry; TSV
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Applications: Wafer
XE-3DM
from Park Systems, Inc.

Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]

  • Measurements: Defects, dimples or film residues; Critical dimensions or Trench geometry; Roughness / Waviness
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Technology: Profilometer or AFM
Desktop Scanning Electron Microscope -- Phenom Pro
from Phenom-World BV

The Phenom Pro desktop SEM is one of the most advanced imaging models in the Phenom series. With its long-life high-brightness CeB6 electron source, the Phenom Pro creates state-of-the-art images with a minimum of user maintenance intervention. The backscattered-electron detector (BSED) and... [See More]

  • Measurements: Composition; Defects, dimples or film residues; Critical dimensions or Trench geometry; Particle contamination; Roughness / Waviness; Area mapping
  • Mounting / Loading: Manual loading
  • Form Factor: Monitor or instrument
  • Technology: FIB