Geometry Inspection System for Silicon Ingots
from Micro-Epsilon

The “dimensionCONTROL 8260 for Ingot ” measuring system inspects the surface of the bricks using several laser line scanners and in doing so measures the side lengths, phase lengths, angles, diagonal surfaces and the planarity of the side surfaces completely automatically. The system... [See More]

  • Measurements: Defects, dimples or film residues; Flatness
  • Applications: Wafer
  • Form Factor: Sensor or sensing element
  • Wafer / Part Size: 0 to 2500
Geometry Inspection System for Silicon Ingots
from Micro-Epsilon Group

The “dimensionCONTROL 8260 for Ingot ” measuring system inspects the surface of the bricks using several laser line scanners and in doing so measures the side lengths, phase lengths, angles, diagonal surfaces and the planarity of the side surfaces completely automatically. The system... [See More]

  • Measurements: Defects, dimples or film residues; Flatness
  • Applications: Wafer
  • Form Factor: Sensor or sensing element
  • Wafer / Part Size: 0 to 2500
NEXIV FOUP CNC Video Measuring System
from Nikon Metrology

Provides all dimensional measurements required for wafer carrier fabrication including control of deformation due to aging of wafer carriers. The NEXIV VMR-C4540 - designed for use with 300mm Front Opening Unified Pod (FOUP) & Front Opening Shipping Box (FOSB) wafer carriers - detects hard to... [See More]

  • Measurements: Defects, dimples or film residues
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Technology: Optical / Imaging
IFG200 Fast Atom Bombardment Ion Gun
from Hiden Analytical

State of the art FAB / ion gun for surface and depth analysis applications [See More]

  • Measurements: Defects, dimples or film residues; Area mapping (optional feature); DepthProfiling
  • Mounting / Loading: In-process, in-situ or system mounted
  • Form Factor: Ion Beam Gun
  • Technology: FIB; Spectrometer (SIMS, XRF, FTIR, DLTS, AAS)
8900
from KLA-Tencor Corporation

Suitable for detecting a wide variety of defects in the sub-micron to five-micron range, the 8900 is the fastest of all KLA-Tencor patterned-wafer defect inspection systems. Based on the production-proven Puma platform, the 8900 enables cost-effective inspection of 200mm or 300mm wafers from initial... [See More]

  • Measurements: Defects, dimples or film residues
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Technology: Optical / Imaging
Wafer Inspection System -- MX51
from Olympus America Inc.

The Olympus MX51 industrial inspection microscope is optimized for the inspection requirements of a variety of electronic components including semiconductor wafer inspection. Its compact size, ease of operation, 6"x6" stage travel and cost effectiveness make the MX51 an ideal inspection microscope... [See More]

  • Measurements: Defects, dimples or film residues; Particle contamination
  • Mounting / Loading: In-line (optional feature); Manual loading
  • Form Factor: Monitor or instrument
  • Technology: Optical / Imaging
XE-3DM
from Park Systems, Inc.

Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]

  • Measurements: Defects, dimples or film residues; Critical dimensions or Trench geometry; Roughness / Waviness
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Technology: Profilometer or AFM
Advanced Vibrometry Tester -- AVT-1000
from Polytec, Inc.

For the best yields it is necessary to optimize your process. Measuring and understanding the characteristicsof your product allows continuous improvement. The AVT-1000 enables you to measure all critical parame-ters on metal or glass such as Roughness, Waviness, and Defects. The AVT can measure... [See More]

  • Measurements: Defects, dimples or film residues; Flatness; Roughness / Waviness; WaferThickness
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Technology: Optical / Imaging; Laser Doppler Vibrometry
IRIS DIE & Wafer Inspection Systems -- EVA Semiautomatic Align, Stepping & Inspection
from SemiProbe

SemiProbe IRIS inspection systems inspect, locate and identify defects created during wafer manufacturing, probing, bumping, dicing or general handling, providing microelectronic device manufacturers with accurate, timely quality assurance and process information. The IRIS inspection system has... [See More]

  • Measurements: Defects, dimples or film residues; Device, gate or circuit electrical testing; Particle contamination; Area mapping
  • Mounting / Loading: Manual loading
  • Form Factor: ProbingSystem
  • Technology: Optical / Imaging
Laser Diode Chip / Bar Visual Inspector
from TELOPS, Inc.

The laser diode chip/bar visual inspector visually inspects each laser diode chip or bar upper, front and back surface. No-good chips/bars are removed from the tape after inspection. [See More]

  • Measurements: Defects, dimples or film residues; Device, gate or circuit electrical testing; Particle contamination; Crack, Coating Failure, Scratch
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument; ProbingSystem
  • Technology: Optical / Imaging; Wafer sorter or prober
Texture Measurement System -- Microscan
from ULVAC Technologies, Inc.

Provides a broad range of specs suitable for various R & D applications [See More]

  • Measurements: Defects, dimples or film residues; FilmThickness; Roughness / Waviness
  • Mounting / Loading: In-process, in-situ or system mounted
  • Form Factor: Monitor or instrument; Controller
  • Technology: Reflectometer; Optical / Imaging
Laser Machining Microscope -- MIC4
from WDI Wise Device Inc.

This is the only commercially available microscope guaranteeing transmission of more then 80% for all four YAG laser harmonics: 266, 355, 532, and 1064nm - without compromising the review channel fidelity. The MIC4 microscope is instrumental in laser repair of TFT arrays over the wavelength ranging... [See More]

  • Measurements: Defects, dimples or film residues; Thin Film and TFT Array Repairs
  • Mounting / Loading: In-process, in-situ or system mounted (optional feature); Floor (optional feature)
  • Form Factor: Monitor or instrument
  • Technology: Optical / Imaging
NewView 7200 -- 3D Optical Profiling System
from Zygo Corporation

Excellent precision and accuracy [See More]

  • Measurements: Defects, dimples or film residues; Critical dimensions or Trench geometry; Flatness; Roughness / Waviness; Area mapping; DepthProfiling
  • Mounting / Loading: Manual loading
  • Form Factor: Monitor or instrument
  • Technology: Profilometer or AFM; Optical / Imaging; Interferometer