SigmaTech Wafer Metrology Systems -- UltraMap-TSV
from MicroSense, LLC

The SigmaTech UltraMap-TSV system is the world ’s first fully automated TSV and deep trench metrology system capable of characterizing TSV and deep trench features from both the front and back sides of the wafer —up to 300mm in diameter. The UltraMap-TSV system can be offered in class-1... [See More]

  • Measurements: Critical dimensions or Trench geometry; TSV
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Applications: Wafer
MerMaid
from Imego

MERMAID is a unique measurement instrument for analysis of liquid and thin film properties using magnetoelastic resonance (MER) sensors. Dynamic events such as viscosity change, phase transitions or bio film growth can be analyzed. The MER sensor can measure properties of either a coating on top of... [See More]

  • Measurements: Deposition rate; CMP, etching, process gas or plasma diagnostics; FilmThickness; Curing Rate
  • Mounting / Loading: In-process, in-situ or system mounted; Floor
  • Form Factor: ProbingSystem; Sensor or sensing element
  • Technology: Quartz crystal microbalance; Magnetoelastic Resonance Sensors (MER)
Advanced Reticle Pattern Placement Metrology -- LMS IPRO4
from KLA-Tencor Corporation

The LMS IPRO4 is a fully-automated mask metrology system capable of measuring pattern placements on masks to support mask metrology requirements for the 45nm node production and 32nm node development. This mask metrology system monitors and maintains mask makers ’ lithography tool performance... [See More]

  • Measurements: Reticle Pattern Placement Measurement
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Technology: Optical / Imaging
Micro System Analyzer -- MSA-500
from Polytec, Inc.

The MSA-500 Micro System Analyzer is the premier measurement technology for the analysis and visualization of structural vibrations and surface topography in micro structures such as MEMS (Micro-Electro-Mechanical Systems) devices. By fully integrating a microscope with Scanning Laser-Doppler... [See More]

  • Measurements: Flatness; Roughness / Waviness; Structural Vibrations & Topography
  • Mounting / Loading: Manual loading
  • Form Factor: Sensor or sensing element
  • Technology: Optical / Imaging; Laser Doppler Vibrometry
Laser Diode Bar Tester
from TELOPS, Inc.

The laser diode bar tester picks up each laser diode bar from the tape and measures LIV, wavelength and FFP characteristics for each die. [See More]

  • Measurements: Device, gate or circuit electrical testing; LIV, wavelength, & FFP Characteristics
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument; ProbingSystem
  • Technology: Optical / Imaging; IV system or SMU; Wafer sorter or prober
LaserPIT
from ULVAC Technologies, Inc.

The principle of the measurement method is shown below. A portion of a rectangular film specimen is heated by a modulated laser beam, which is a line heat source, made by scanning the laser spot rapidly with constant speed in the width direction of the specimen. Temperature waves, which propagate... [See More]

  • Measurements: Thermal Diffusivity/Conductivity
  • Mounting / Loading: Manual loading
  • Form Factor: Monitor or instrument
  • Technology: Modulated Laser Beam
Laser Machining Microscope -- MIC4
from WDI Wise Device Inc.

This is the only commercially available microscope guaranteeing transmission of more then 80% for all four YAG laser harmonics: 266, 355, 532, and 1064nm - without compromising the review channel fidelity. The MIC4 microscope is instrumental in laser repair of TFT arrays over the wavelength ranging... [See More]

  • Measurements: Defects, dimples or film residues; Thin Film and TFT Array Repairs
  • Mounting / Loading: In-process, in-situ or system mounted (optional feature); Floor (optional feature)
  • Form Factor: Monitor or instrument
  • Technology: Optical / Imaging
Metrology System -- Z3D-7000 Series
from Zygo Corporation

Simultaneously measures multiple parameters [See More]

  • Measurements: Critical dimensions or Trench geometry; FilmThickness; Roughness / Waviness; Area mapping; DepthProfiling; 3D Surface Metrology
  • Mounting / Loading: In-line; Floor
  • Form Factor: Monitor or instrument
  • Technology: Profilometer or AFM; Optical / Imaging; Interferometer