Candela CS10
from KLA-Tencor Corporation

Offers <0.08 micron particle sensitivity on polished silicon wafers. Exceptional sensitivity to microscratches for automatic wafer surface inspection, defect detection and classification on 2" - 12" transparent and opaque wafers. Dual-laser Optical X-Beam technology is well-suited for both... [See More]

  • Measurements: Defects, dimples or film residues; Particle contamination
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Technology: Optical / Imaging
Wafer Inspection System -- MX51
from Olympus America Inc.

The Olympus MX51 industrial inspection microscope is optimized for the inspection requirements of a variety of electronic components including semiconductor wafer inspection. Its compact size, ease of operation, 6"x6" stage travel and cost effectiveness make the MX51 an ideal inspection microscope... [See More]

  • Measurements: Defects, dimples or film residues; Particle contamination
  • Mounting / Loading: In-line (optional feature); Manual loading
  • Form Factor: Monitor or instrument
  • Technology: Optical / Imaging
Process XRR, XRF, and XRD Metrology FAB Tool -- MFM65
from Rigaku Corporation

The Rigaku MFM65 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks. The... [See More]

  • Measurements: Composition; Particle contamination; FilmThickness; Roughness / Waviness
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Technology: Reflectometer; X-ray Diffractometer; XRR, XRF, XRD
IRIS DIE & Wafer Inspection Systems -- EVA Semiautomatic Align, Stepping & Inspection
from SemiProbe

SemiProbe IRIS inspection systems inspect, locate and identify defects created during wafer manufacturing, probing, bumping, dicing or general handling, providing microelectronic device manufacturers with accurate, timely quality assurance and process information. The IRIS inspection system has... [See More]

  • Measurements: Defects, dimples or film residues; Device, gate or circuit electrical testing; Particle contamination; Area mapping
  • Mounting / Loading: Manual loading
  • Form Factor: ProbingSystem
  • Technology: Optical / Imaging
Laser Diode Chip / Bar Visual Inspector
from TELOPS, Inc.

The laser diode chip/bar visual inspector visually inspects each laser diode chip or bar upper, front and back surface. No-good chips/bars are removed from the tape after inspection. [See More]

  • Measurements: Defects, dimples or film residues; Device, gate or circuit electrical testing; Particle contamination; Crack, Coating Failure, Scratch
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument; ProbingSystem
  • Technology: Optical / Imaging; Wafer sorter or prober