Semiconductor Metrology Instruments - Spectral Interference Laser Displacement Meter -- SI-F01
from KEYENCE

SI-F Series Spectral Interference Displacement Meter. The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able to see even the... [See More]

  • Mounting / Loading: In-process, in-situ or system mounted; In-line; Floor
  • Technology: Interferometer
  • Form Factor: Monitor or instrument; Controller; Sensor or sensing element
  • Applications: Wafer; Memory drive disc or head; Flat panel display; Packaged IC or substrate
Polar Kerr System for MRAM
from MicroSense, LLC

The Polar Kerr System for MRAM utilizes the polar Magneto-Optical Kerr Effect (MOKE) to characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM. Utilizing a non-contact full-wafer measurement technique, the system creates a map of... [See More]

  • Mounting / Loading: Floor
  • Technology: Magnetometer
  • Form Factor: Monitor or instrument
  • Applications: Wafer
Thin Film Monitors -- PV-1000
from MTI Instruments Inc.

Using MTII ’s exclusive Push/Pull capacitance probe technology, each PV-1000 module provides up to three pairs of probes for measurement of maximum, minimum and average thickness, as well as total thickness variation (TTV) and wafer bow. For applications requiring additional thickness... [See More]

  • Mounting / Loading: In-line; Manual loading; Floor
  • Technology: Capacitance or electromagnetic gage
  • Form Factor: Controller; Sensor or sensing element
  • Applications: Etching
NEXIV FOUP CNC Video Measuring System
from Nikon Metrology

Provides all dimensional measurements required for wafer carrier fabrication including control of deformation due to aging of wafer carriers. The NEXIV VMR-C4540 - designed for use with 300mm Front Opening Unified Pod (FOUP) & Front Opening Shipping Box (FOSB) wafer carriers - detects hard to... [See More]

  • Mounting / Loading: Floor
  • Technology: Optical / Imaging
  • Form Factor: ProbingSystem
  • Applications: Wafer
Ion Beam Etch & Deposition System -- Ionfab 300Plus
from Oxford Instruments Industrial Analysis

The Ionfab ®300Plus offers the flexibility to perform etch and/or deposition and maximising system utilisation. System specifications can be closely tuned to applications, enabling faster and repeatable process results. The systems are scalable from R &D to batch production in one tool. [See More]

  • Mounting / Loading: Floor
  • Technology: FIB
  • Form Factor: Ion Beam System
300mm Probing System -- S300-10x
from Cascade Microtech, Inc.

Built-in anti-vibration support [See More]

  • Mounting / Loading: Floor
  • Technology: Optical / Imaging
  • Form Factor: ProbingSystem
  • Applications: Wafer
Tropel® FlatMaster® -- FlatMaster® Wafer
from Corning Specialty Materials

Ideal for processes development, particularly for new, non-silicon material [See More]

  • Mounting / Loading: Floor
  • Technology: Interferometer
  • Form Factor: Monitor or instrument
  • Applications: Wafer; Optical components or lenses
Focused Ion Beam System -- FB-2200
from Hitachi High Technologies America, Inc.

The FB2200 allows for rapid and precise specimen preparation for both transmission and scanning electron microscopy of semiconductors and other advanced materials. High precision and high milling rates. The use of a new low aberration ion optical system allows a maximum beam current of 60nA at an... [See More]

  • Mounting / Loading: Floor
  • Technology: FIB
  • Form Factor: ProbingSystem
  • Applications: Wafer; CVD / PVD
MerMaid
from Imego

MERMAID is a unique measurement instrument for analysis of liquid and thin film properties using magnetoelastic resonance (MER) sensors. Dynamic events such as viscosity change, phase transitions or bio film growth can be analyzed. The MER sensor can measure properties of either a coating on top of... [See More]

  • Mounting / Loading: In-process, in-situ or system mounted; Floor
  • Technology: Quartz crystal microbalance; Magnetoelastic Resonance Sensors (MER)
  • Form Factor: ProbingSystem; Sensor or sensing element
  • Applications: CVD / PVD; Polymer or photoresist films; BioFilms
8900
from KLA-Tencor Corporation

Suitable for detecting a wide variety of defects in the sub-micron to five-micron range, the 8900 is the fastest of all KLA-Tencor patterned-wafer defect inspection systems. Based on the production-proven Puma platform, the 8900 enables cost-effective inspection of 200mm or 300mm wafers from initial... [See More]

  • Mounting / Loading: Floor
  • Technology: Optical / Imaging
  • Form Factor: ProbingSystem
  • Applications: Photolithography
XE-3DM
from Park Systems, Inc.

Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]

  • Mounting / Loading: Floor
  • Technology: Profilometer or AFM
  • Form Factor: Monitor or instrument
  • Applications: Wafer
Advanced Vibrometry Tester -- AVT-1000
from Polytec, Inc.

For the best yields it is necessary to optimize your process. Measuring and understanding the characteristicsof your product allows continuous improvement. The AVT-1000 enables you to measure all critical parame-ters on metal or glass such as Roughness, Waviness, and Defects. The AVT can measure... [See More]

  • Mounting / Loading: Floor
  • Technology: Optical / Imaging; Laser Doppler Vibrometry
  • Form Factor: Monitor or instrument
  • Applications: Memory drive disc or head
In-line, Simultaneous WDXRF Spectrometer -- WaferX 300
from Rigaku Corporation

Rigaku's WaferX 300 represents the culmination of 25 years of experience in the X-ray fluorescence analysis of thin films on silicon wafers. Specifically developed as an in-process metrology tool, the system incorporates "bridge tool" technology — servicing 6", 8", as well as the latest 12"... [See More]

  • Mounting / Loading: Floor
  • Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); WDXRF
  • Form Factor: Monitor or instrument
  • Applications: Wafer
Laser Diode Bar Tester
from TELOPS, Inc.

The laser diode bar tester picks up each laser diode bar from the tape and measures LIV, wavelength and FFP characteristics for each die. [See More]

  • Mounting / Loading: Floor
  • Technology: Optical / Imaging; IV system or SMU; Wafer sorter or prober
  • Form Factor: Monitor or instrument; ProbingSystem
  • Applications: Packaged IC or substrate; Optical components or lenses; Laser Diode Bar Tester
MS Series -- E1S
from ULVAC Technologies, Inc.

High temperature heating imaging system, radiant heating generates no dust [See More]

  • Mounting / Loading: Floor
  • Technology: Optical / Imaging
  • Form Factor: Monitor or instrument
  • Applications: Wafer; CVD / PVD
Laser Machining Microscope -- MIC4
from WDI Wise Device Inc.

This is the only commercially available microscope guaranteeing transmission of more then 80% for all four YAG laser harmonics: 266, 355, 532, and 1064nm - without compromising the review channel fidelity. The MIC4 microscope is instrumental in laser repair of TFT arrays over the wavelength ranging... [See More]

  • Mounting / Loading: In-process, in-situ or system mounted (optional feature); Floor (optional feature)
  • Technology: Optical / Imaging
  • Form Factor: Monitor or instrument
  • Applications: CVD / PVD; Electroplate; Flat panel display; Packaged IC or substrate; Optical components or lenses; Photolithography; PV Cell, Laser Micromachining, Photomask
EDXRF Analyzer -- EX-6600 SDD
from Xenemetrix Ltd.

EX-6600 SDD. Secondary Target EDXRF. Xenemetrix ’s EX-6600 SDD Energy Dispersive X-ray Fluorescence (EDXRF) spectrometer offers the ultimate in sensitivity and selectivity. The Silicon Drift Detector (SDD) simultaneously delivers lower electronic noise and higher count rates which translates... [See More]

  • Mounting / Loading: Manual loading; Floor
  • Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); EDXRF
  • Form Factor: Monitor or instrument
  • Applications: Wafer; CVD / PVD; Electroplate
Metrology System -- Z3D-7000 Series
from Zygo Corporation

Simultaneously measures multiple parameters [See More]

  • Mounting / Loading: In-line; Floor
  • Technology: Profilometer or AFM; Optical / Imaging; Interferometer
  • Form Factor: Monitor or instrument
  • Applications: Wafer; CVD / PVD; Electroplate; Polishing / CMP; Photolithography; Etching; Bumping Processes