Semi-Automated Wafer Measurement System -- Proforma™ 200SA
from MTI Instruments Inc.

The Proforma 200SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 75 to 200 mm. wafers, the 200SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around... [See More]

  • Technology: Capacitance or electromagnetic gage
  • Mounting / Loading: Manual loading
  • Form Factor: ProbingSystem; Sensor or sensing element
  • Applications: Wafer
Ultra Gage -- 9500
from KLA-Tencor Corporation

Multi-tool functionality including thickness, shape stress, global and site flatness measurements. Measures 8,700 data points in under 60 seconds. Thin film stress on patterned or monitor wafers. Wide range of options including wafer typing. The 9500 UltraGage is a versatile, multifunctional... [See More]

  • Technology: Capacitance or electromagnetic gage
  • Mounting / Loading: Manual loading
  • Form Factor: ProbingSystem
  • Applications: Wafer; Polishing / CMP; Photolithography
MESEC
from ULVAC Technologies, Inc.

Provides a broad range of specs suitable for various R & D applications [See More]

  • Technology: Capacitance or electromagnetic gage
  • Mounting / Loading: In-process, in-situ or system mounted
  • Form Factor: Monitor or instrument
  • Applications: Wafer; CVD / PVD