HRP-250
from KLA-Tencor Corporation

The HRP-250 is an automated, advanced surface topography metrology tool, featuring high resolution/high-aspect ratio, stylus-based surface profiling for leading edge 200mm applications. This surface topography metrology tool's ultra-fine 20nm stylus tip option enables down to 45nm-generation surface... [See More]

  • Technology: Profilometer or AFM
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Applications: Wafer
XE-3DM
from Park Systems, Inc.

Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]

  • Technology: Profilometer or AFM
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Applications: Wafer
Metrology System -- Z3D-7000 Series
from Zygo Corporation

Simultaneously measures multiple parameters [See More]

  • Technology: Profilometer or AFM; Optical / Imaging; Interferometer
  • Mounting / Loading: In-line; Floor
  • Form Factor: Monitor or instrument
  • Applications: Wafer; CVD / PVD; Electroplate; Polishing / CMP; Photolithography; Etching; Bumping Processes