from EBARA Technologies, Inc.
Gas Inlet Devices. Patent gas inlet devices minimize rate of restriction and automatic gas inlet plunger removes restrictions without process interruptions. Second Scrubbing Chamber. Five fine spray, high velocity nozzles ensures effective removal of impurities. First Scrubbing Chamber. Coarse... [See More]
- Materials Processed: Tungsten; Metal; Silicon; Polymer; Nitrides
- Applications: Semiconductors
- Process: Chemical Vapor Deposition
from ULVAC Technologies, Inc.
A CVD system for silicon oxide films and nitride films using SiH4 and TEOS. Can create high-quality films using high frequency (27.12 MHz). Supports single-substrate processing of substrates between 4 and 8 inches in diameter. [See More]
- Materials Processed: Oxides; Nitrides
- Applications: Decorative / Shielding; MEMS; Semiconductors
- Process: Chemical Vapor Deposition; Plasma Enhance CVD
- Wafer / Part Size: 203