AIRSTONE™ Adhesive System
from Dow Polyurethanes

The AIRSTONE ™ Adhesive System consists of an epoxy resin and two epoxy hardeners with different pot lives. This solvent free, highly thixotropic adhesive has been optimized to meet the stringent requirements of composite wind turbine manufacturing. This AIRSTONE Adhesive System is useful for... [See More]

  • Chemical System: Thixotropic; Epoxy
  • Industry: Electrical Power or High Voltage; Wind Turbine / Rotor Blades Industry
  • Type: Thermally cured
Cartridge, 50ML 1:1 -- EP1282 BLACK 50ML
from Ellsworth Adhesives

Resinlab ™ EP 1282 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. [See More]

  • Chemical System: Epoxy; Epoxy
Electrical -- E3001-6
from Epoxy Technology

Product Description: EPO-TEK ® E3001-6 is a one component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for JEDEC level IC plastic packaging of semiconductors, hybrid micro-electronics, and photonic device assembly. It is a single component version of... [See More]

  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Type: Thermally cured
  • Industry: Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
Hapcast™ 3738 Iron Type Casting System -- 3738/30
from Hapco, Inc.

HAPCAST ™ 3738 features: Black, high density, machinable, rigid epoxy system. Compatible with a variety of Hapcure curing agents, allowing the system to be customized to the application. High specific gravity for heavier castings. [See More]

  • Chemical System: Epoxy
  • Industry: Tooling
  • Form / Shape: Liquid
  • Use Temperature: 325
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Type: Thermally cured
  • Industry: Electronics
EP101
from Master Bond, Inc.

Master Bond Polymer System EP101 is a two component, low viscosity semi-rigid epoxy compound for high performance bonding, sealing and casting. It features a long working life at ambient temperatures and can be readily cured at temperatures in the 250-300 °F range. Shrinkage upon cure is... [See More]

  • Chemical System: 100% Solids; Epoxy
  • Industry: Electronics; Electrical Power or High Voltage
  • Type: Thermally cured
  • Tensile (Break): 7100
UV Curable Compound -- UV-Cure 60-7170
from Epoxies Etc...

UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. [See More]

  • Chemical System: Epoxy
  • Industry: Electronics; OEM or Industrial
  • Form / Shape: Liquid
  • Use Temperature: -58 to 392
FIBROFIX® -SECHS -- 280.08
from Fibro, Inc.

Six packs of pre-measured toolmaking resin & hardener for injection gun [See More]

  • Chemical System: Bonding Grade; Epoxy
  • Form / Shape: Liquid
  • Type: Thermally cured
  • Industry: Tooling
CK-2103 Resin
from Georgia-Pacific Chemical Division

Modifier for alkyd and epoxy air dry coatings is designed to improve resistance, hardness and gloss adhesion. Varnishes made with CK-2103 dry faster than those made with CK-2432 and darken on drying. [See More]

  • Chemical System: Phenolics or Formaldehyde Resins; Epoxy
  • Form / Shape: Liquid
  • Type: Thermally cured
  • Industry: Marine; OEM or Industrial