Epoxy Resins and Compounds Datasheets

Epoxy and Polyurethane based Resin system -- VORAFORCE TR 500/1500 series
from Dow Polyurethanes

Epoxy and Polyurethane based systems for high pressure closed mold injection using glass and carbon fiber mat reinforcements. Key Benefits. – Fast cure for short cycle times. – Excellent wetting for highest strength and impact resistant parts. – Suitable for thin wall design [See More]

  • Chemical System: Epoxy; Polyurethane
  • Industry: Electrical Power or High Voltage; Window Liners, Electrical Encapsulation, Manhole Covers, Delivery Pallets
  • Type: Thermally cured
ELAN-Cast® -- E 023 Black Resin / C 023 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Type: Thermally cured
  • Industry: Electronics; Electrical Power or High Voltage; OEM or Industrial; Tooling
Electrically Conductive Adhesive -- EPO-TEK® E3035
from Epoxy Technology

A single component, thermally and electrically conductive, semiconductor die attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging. This is a non-military version of EPO-TEK ®... [See More]

  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Type: Thermally cured
  • Industry: Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
Hysol GR2220 (Known as Hysol GR2220) -- 8799544410113
from Henkel Corporation - Electronics

(Known as Hysol GR2220 ). GR2220 epoxy molding compound delivers outstanding performance and ease of use. Meets UL 94 V-0 Flammability at 6.35mm thickness. [See More]

  • Chemical System: Epoxy
  • CTE: 11
  • Industry: Electronics
Hysol GR15F-A
from Henkel Corporation - Industrial

Hysol ® GR15F-A ™ is a very high Tg, low stress, green semiconductor grade epoxy molding compound designed specifically for high voltage applications. [See More]

  • Chemical System: Epoxy
  • Industry: Electronics; Semiconductors or IC Packaging
Electrically Insulative, Two Component Epoxy System -- EP30M3LV
from Master Bond, Inc.

Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This... [See More]

  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Type: Thermally cured
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
Pre-Preg Product -- NP114B
from Norplex-Micarta

NP114B pre-preg is composed of an electrical grade of epoxy resin (Tg = 175 °C) combined with an aramid paper substrate. This grade of pre-preg does not use halogen flame retardants to obtain its flame retardant characteristics. This is essential since it cannot contain bromine in its primary... [See More]

  • Chemical System: Epoxy
  • Type: Thermally cured
Aluminum Filled Epoxy Resin -- 70-3810
from Epoxies Etc...

70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat resistance than most commercially... [See More]

  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Type: Thermally cured
  • Industry: OEM or Industrial; Tooling
FIBROFIX® -SECHS -- 280.08
from Fibro, Inc.

Six packs of pre-measured toolmaking resin & hardener for injection gun [See More]

  • Chemical System: Epoxy; Bonding Grade
  • Form / Shape: Liquid
  • Type: Thermally cured
  • Industry: Tooling
GP® 7565 Resin
from Georgia-Pacific Chemicals LLC

GP ® 7565 resin is used as a crosslinker for hydroxyl containing polymers such as epoxies, polyesters, vinyls and acrylics. GP 7565 resin provides outstanding chemical resistance. It can be emulsified into water-based epoxy resins. It is used where light colored coatings are required and in... [See More]

  • Chemical System: Epoxy; Phenolics or Formaldehyde Resins
  • Form / Shape: Liquid
  • Type: Thermally cured
  • Industry: OEM or Industrial
GSP 1360-2
from GS Polymers, Inc.

Two part economical casting system [See More]

  • Chemical System: Epoxy
  • Industry: OEM or Industrial
  • Type: Thermally cured
BISPHENOL A/ EPICHLOROHYDRIN DRY -- SUPRMIX® DINP
from HallStar

SUPRMIX DINP with its medium level of performance has found general use in applications that require permanence higher. SUPRMIX DINP has good efficiency properties, low volatility characteristics and good permanence in polar fluids. [See More]

  • Chemical System: Epoxy
Hapcast™ 3736 Steel Casting System -- 3736/30
from Hapco, Inc.

HAPCAST ™ 3736 is a room or elevated temperature curing, casting and tooling compound. Steel filled epoxy system. Low viscosity and high density. Good air release and good penetration of all surfaces. Very low shrinkage. Exact reproduction of the original model. Provides excellent durability,... [See More]

  • Chemical System: Epoxy
  • Industry: Tooling
  • Form / Shape: Liquid
  • Use Temperature: 360
INSULCAST 116 FR Room Temperature Cure, Equal Ratio Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Type: Thermally cured
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Military; Repair or Construction; OEM or Industrial; Electronic Encapsulants
High Temperature Saturant -- PULTREAT 2570A
from Zeon Technologies, Inc.

Non-Volatile-100% Reactive, No Styrene, Nor Styrenics, and Snap Cure [See More]

  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Type: Thermally cured
  • Industry: Pultrusion, Filament Winding, Preform