Flexane®80 Liquid -- 15800 [15800 from ITW Devcon]
from Applied Industrial Technologies

Castable, non-shrinking, medium-viscosity (10,000 cps) urethane compound for making rugged, flexible molds, forming dies, cast parts, non-scratching holding fixtures and abrasion-and noise-resistant linings, as well as for encapsulating parts. KEY FEATURES. Two-component compound easy to mix and... [See More]

  • Form / Shape: Liquid
  • Industry: OEM or Industrial
  • Chemical System: Urethane
  • Tensile (Break): 2100
Dow Corning Toray SE 4402
from Dow Corning Automotive Solutions

One-part, grey, heat cure, good flowability, thermally conductive, controlled volatility. [See More]

  • Form / Shape: Liquid
  • Chemical System: Silicone
  • Type: Elastomer; Composite
  • Industry: Automotive
AIRSTONE™ Infusion System
from Dow Polyurethanes

The AIRSTONE ™ Infusion System consists of an epoxy resin and five amine hardeners designed for the vacuum assisted resin infusion molding process. The AIRSTONE Infusion System provides an excellent balance of properties for pot life and in-mold reactivity. For longer pot life, AIRSTONE 786H... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: Thermally cured
  • Industry: Electrical Power or High Voltage
ELAN-Cast® -- P 300S-45 Resin
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Form / Shape: Liquid
  • Chemical System: Polyester or Alkyd
  • Type: Thermally cured
  • Industry: Electronics; Electrical Power or High Voltage; Repair or Construction (optional feature); OEM or Industrial; Tooling; Sand-filled transformers
Electrical -- E3001-6
from Epoxy Technology

Product Description: EPO-TEK ® E3001-6 is a one component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for JEDEC level IC plastic packaging of semiconductors, hybrid micro-electronics, and photonic device assembly. It is a single component version of... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: Thermally cured
  • Industry: Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
Castalloy™ High Performance Casting Resin -- 7126
from Hapco, Inc.

Castalloy ™ is a high performance casting resin that is water thin, economical, and easy to use. Easy to mix with a 1:1 ratio by volume. Extremely thin with a mixed viscosity of 120 cps. Has a natural, creamy, off-white color. Can be de-molded in less than 15 minutes!. Castalloy ™ has... [See More]

  • Form / Shape: Liquid
  • Viscosity: 120
  • Industry: Tooling; Prototyping
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: Thermally cured
  • Industry: Electronics
U857
from Master Bond, Inc.

Master Bond Polymer System U857 is a newly developed modified multifunctional cyanate ester resin system for high temperature service at temperatures up to 750 °F! It is a high viscosity, 100% reactive liquid which cures to a heat stable thermosetting polymer by the application of heat. The... [See More]

  • Form / Shape: Liquid; Pellets
  • Chemical System: Cyanate Ester
  • Type: Thermoplastic
  • Use Temperature: ? to 750
Liquid Silicone Resin -- SILRES® H62 C
from Wacker Chemical Corp.

ES ® H62 C is a solvent-free, liquid silicone resin which is cured by heat. Special features. is a methylphenylvinylhydrogen polysiloxane not modified with organic components;. is of very low volatility (suitable for vacuum pressure impregnation);. is cured by heat through catalysed... [See More]

  • Form / Shape: Liquid
  • Chemical System: Silicone
  • Type: Elastomer
  • Thermal Conductivity: 0.2000
THV -- 3M™Dyneon™ THV 340C
from 3M Advanced Materials Division

3M ™ THV (a polymer of tetrafluoroethylene, hexafluoropropylene and vinylidene fluoride) provides a combination of performance advantages, such as low processing temperature, ability to bond to elastomers and hydrocarbon-based plastics, flexibility and optical clarity. These products are used... [See More]

  • Form / Shape: Liquid
  • Chemical System: Fluoropolymer; Tetrafluoroethylene, Hexafluoropropylene
  • Type: Thermoplastic
  • Industry: Automotive; Energy Conversion (Battery / Fuel Cell); Electrical Power or High Voltage; Marine; OEM or Industrial; Semiconductors or IC Packaging; Solar Energy, Chemical Processing
Flexane®94 Urethane Liquid -- 15250 [15250 from ITW Devcon]
from All-Spec Industries

" This item can not be exported outside the United States" [See More]

  • Form / Shape: Liquid
  • Industry: OEM or Industrial
  • Chemical System: Urethane
  • Use Temperature: 120 to 180
Bayflex® RIM System -- BAYFLEX 110-35 IMR
from Bayer MaterialScience LLC

The Bayflex 110-35 IMR system produces a solid. urethane elastomer which has a flexural modulus of. approximately 33,500 psi* at room temperature. This. system is used to provide multiple releases of large. reaction injection molding (RIM) parts, such as. automotive fascias. The system contains... [See More]

  • Form / Shape: Liquid
  • Chemical System: MDI & Polyether Polyol System
  • Type: Thermally cured
  • Industry: Automotive; Reaction Injection Molding
UV Curable Compound -- UV-Cure 60-7170
from Epoxies Etc...

UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. [See More]

  • Form / Shape: Liquid
  • Industry: Electronics; OEM or Industrial
  • Chemical System: Epoxy
  • Use Temperature: -58 to 392
FIBROFIX® -SECHS -- 280.08
from Fibro, Inc.

Six packs of pre-measured toolmaking resin & hardener for injection gun [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy; Bonding Grade
  • Type: Thermally cured
  • Industry: Tooling
Abrasive Adhesion Resins
from Georgia-Pacific Chemical Division

Urea-formaldehyde and phenol-formaldehyde resins are used for grit adhesion to various substrates in coated abrasives, bonded abrasives and wheels, and scrub pads. They are formulated to provide grain bonding in various substrates and high water tolerance with a light color that allows for the... [See More]

  • Form / Shape: Liquid
  • Chemical System: Phenolics or Formaldehyde Resins
  • Type: Thermally cured
  • Industry: OEM or Industrial
Circuit Board Protection -- 5071
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Form / Shape: Liquid
  • Chemical System: Silicone
  • Type: Thermally cured
  • Industry: Electronics
45 D Shore Polyether Polyurethane -- R-45D
from Real Seal Company

Premiere Polyurethane Products. Real Seal has developed a reputation for being one of the premiere urethane product suppliers in the market. Becoming the industry standrad for physical toughness, polyurethane sees active service in applications requiring resistance to abrasion, tear, and high... [See More]

  • Form / Shape: Liquid
  • Chemical System: Polyurethane
  • Type: Elastomer; Thermally cured
  • Industry: Automotive; Repair or Construction; OEM or Industrial; Tooling
Specialty Conducting Polymers -- 4001
from Rieke Metals, Inc.

Poly(3-butylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 80% and 90% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Form / Shape: Liquid
  • Industry: Electronics; Semiconductors or IC Packaging
  • Type: Thermoplastic
  • Features: Electrically Conductive Compound