from BJB Enterprises, Inc.
Resists moisture absorption. Very easy to use. Cures at room temperature. Highly resilient, tough, stretchy and tack free. Quick demold time, low viscosity [See More]
- Features: Thermally Conductive
- Chemical System: Polyurethane
- Type: Elastomer
- Filler: Unfilled
from Bluestar Silicones USA Corp.
Elastomer - RTV 2 - polyaddition heat curing - Black. Solventless, Very low viscosity, Quick curing, Long potlife, Excellent dielectric performances, High thermal and Fire resistance (UL 94 V0). Properties. Viscosity 3200. Hardness Sha 48. Description. Potting and encapsulation of electronic and... [See More]
- Features: Flame Retardant; Thermally Conductive
- Chemical System: Silicone
- Type: Elastomer
- Filler: Unfilled
from Dow Corning Automotive Solutions
One-part, grey, heat cure, good flowability, thermally conductive, controlled volatility. [See More]
- Features: Thermally Conductive
- Chemical System: Silicone
- Type: Elastomer; Composite
- Form / Shape: Liquid
from Epoxy Technology
EPO-TEK ® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. [See More]
- Features: Thermally Conductive; Electrically Conductive Compound
- Chemical System: Epoxy
- Type: Thermally cured
- Filler: Metal or MIM
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Features: Flame Retardant; UL; Thermally Conductive
- Filler: Unfilled
- Type: Thermally cured
- Form / Shape: Liquid
from ITW Polymer Technologies - Insulcast Division
INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]
- Features: Flame Retardant; UL; Thermally Conductive
- Chemical System: Epoxy
- Type: Thermally cured
- Filler: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]
- Features: Thermally Conductive
- Chemical System: 100% Solids; Epoxy
- Type: Thermally cured
- Industry: Electronics; Electrical Power or High Voltage
from 3M Electronics Markets Materials Division
3M ™ Organic Electronics provides new materials to build next generation electronics and photonics devices. With a focus on organic semiconductors and dielectrics, these materials will enable the creation of products for: Organic Thin Film Transistors (TFT) – notably for radio frequency... [See More]
- Features: Thermally Conductive
- Chemical System: Bis[(triisopropylsilyl)ethynyl]pentacene
- Type: Thermoplastic
- Filler: Aramid
from PENCOM
For heat sinks/spreaders in virtually any commercially available material [See More]
- Features: Thermally Conductive
- Industry: Electronics
from PolyOne Corporation
Heat transfer and cooling capabilities of metal [See More]
- Features: Thermally Conductive
- Chemical System: Polyamide
- Type: Composite; Thermoplastic
- Industry: Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
