Thermoset Silicone Resin - Polyaddition Heat Curing - Translucent -- Bluesil™ Resin 21385 A/B
from Bluestar Silicones USA Corp.

Resin - Polyaddition heat curing - Translucent. Solventless, Quick curing, Good release properties, Good bath stability. Outstanding thermal stability, High adhesion to many substrates, Engine fluids resistance (Lubricant, Cooling liquid, …). Properties. Viscosity 8500. Description. [See More]

  • Type: Thermally cured
  • Filler: Unfilled
  • Chemical System: Silicone
  • Form / Shape: Liquid
ISONATE™ -- 125M
from Dow Polyurethanes

ISONATE* 125M pure MDI is a crystalline, pure MDI mixture composed of approximately 98 percent 4,4 ’-diphenylmethane diisocyanate and 2 percent 2,4 ’-diphenylmethane diisocyanate. Characterized by high purity, low acidity and reproducible reactivity, this difunctional product is a key... [See More]

  • Type: Elastomer; Thermoplastic; Thermally cured
  • Filler: Unfilled
  • Chemical System: Methylene Diphenyl Diisocyanate (MDI)
  • Form / Shape: Liquid
Electrical -- 377H
from Epoxy Technology

EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]

  • Type: Thermally cured
  • Filler: Carbon or Graphite
  • Chemical System: Epoxy
  • Form / Shape: Liquid
EP101
from Master Bond, Inc.

Master Bond Polymer System EP101 is a two component, low viscosity semi-rigid epoxy compound for high performance bonding, sealing and casting. It features a long working life at ambient temperatures and can be readily cured at temperatures in the 250-300 °F range. Shrinkage upon cure is... [See More]

  • Type: Thermally cured
  • Filler: Unfilled
  • Chemical System: 100% Solids; Epoxy
  • Industry: Electronics; Electrical Power or High Voltage
OG Meldin® 2001
from Saint-Gobain Oil & Gas

This material is best suited for thermal and electrical insulation and radiation resistance. Meldin 2001 has the highest compressive properties of any material in the series. [See More]

  • Type: Thermally cured
  • Filler: Unfilled
  • Chemical System: Polyimide or Bismaleimide (BMI)
  • Industry: OEM or Industrial
Acclaim® Polyether -- ACCLAIM POLYOL 2200
from Bayer MaterialScience LLC

Acclaim 2200 polyol is a 2,000-molecular-weight diol. based on propylene oxide. This high-performance,. low-monol polyether is prepared with Bayer ’s proprietary. IMPACT ® technology, using a patented organo-metallic. propoxylation catalyst. The terminal end-groups are. predominantly... [See More]

  • Type: Thermally cured
  • Form / Shape: Liquid
  • Chemical System: Polyether
  • Industry: OEM or Industrial
FIBROFIX® -SECHS -- 280.08
from Fibro, Inc.

Six packs of pre-measured toolmaking resin & hardener for injection gun [See More]

  • Type: Thermally cured
  • Filler: Unfilled
  • Chemical System: Bonding Grade; Epoxy
  • Form / Shape: Liquid
Abrasive Adhesion Resins
from Georgia-Pacific Chemical Division

Urea-formaldehyde and phenol-formaldehyde resins are used for grit adhesion to various substrates in coated abrasives, bonded abrasives and wheels, and scrub pads. They are formulated to provide grain bonding in various substrates and high water tolerance with a light color that allows for the... [See More]

  • Type: Thermally cured
  • Form / Shape: Liquid
  • Chemical System: Phenolics or Formaldehyde Resins
  • Industry: OEM or Industrial
GSP 1360-2
from GS Polymers, Inc.

Two part economical casting system [See More]

  • Type: Thermally cured
  • Filler: Mineral or Inorganic
  • Chemical System: Epoxy
  • Industry: OEM or Industrial
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CR-39® Monomer -- H-911
from Homalite

Low-reflectance surface finish available, chemical, abrasion resistant [See More]

  • Type: Thermally cured; Optical
  • Filler: Unfilled
  • Chemical System: CR-39® Monomer
  • Industry: Electronics; Optoelectronics or Photonics; OEM or Industrial; Electronic Display Windows
Electrical Barrier Material -- Voltoid™ D-100 FR
from Interface Solutions, Inc.

Voltoid ® D-100 FR is a flame-resistant electrical and mechanical barrier material. It has good physical strength and electrical insulating characteristics and is intended for formed or flat parts that require resistance to flame, such as smoke detector insulation, microwave oven air duct... [See More]

  • Type: Composite; Thermally cured
  • Industry: Electrical Power or High Voltage; OEM or Industrial
  • Chemical System: Resin Bonded Fibers
  • Features: Flame Retardant; UL
MILEX™ Phenolic Resin
from Mitsui Chemicals America, Inc.

Over the last two decades MILEX ™ Phenolic Resin has grown into a complete product line of this high performing, flexible technology. Currently Mitsui Chemicals offers three different formulations of Phenolic Resin, which are being supplied to the North and South American markets by Mitsui... [See More]

  • Type: Thermally cured
  • Chemical System: Phenolics or Formaldehyde Resins
Sensors, Adhesives and Epoxies -- TC-EPOX-4525-25
from SuperLogics, Inc.

25g pre-measured 500 °F electrically resistant epoxy kit [See More]

  • Type: Thermally cured
  • Filler: Unfilled
  • Chemical System: Epoxy
  • Industry: Electrical Power or High Voltage; OEM or Industrial
Custom Elastomeric Spheres -- Vernay V-Balls®
from Vernay Laboratories, Inc.

Custom made to order with over 23,000 proprietary elastomeric formulations [See More]

  • Type: Elastomer; Thermoplastic (optional feature); Thermally cured (optional feature)
  • Filler: Unfilled
  • Chemical System: Isoprene or Polyisoprene (optional feature); Polyurethane (optional feature); Butyl (optional feature); Fluorocarbon, EPDM, Nitrile; Acrylic or Polyacrylate (optional feature); Silicone (optional feature)
  • Industry: Automotive; Sanitary; OEM or Industrial; Valves