Metrology System -- Z3D-7000 Series
from Zygo Corporation

Simultaneously measures multiple parameters [See More]

  • Mounting / Loading: In-line; Floor
  • Applications: Wafer; CVD / PVD; Electroplate; Polishing / CMP; Photolithography; Etching; Bumping Processes
  • Technology: Profilometer or AFM; Optical / Imaging; Interferometer
  • Measurements: Critical dimensions or Trench geometry; FilmThickness; Roughness / Waviness; Area mapping; DepthProfiling; 3D Surface Metrology