Thin-Film Measuring Systems -- TF Series
from StellarNet, Inc.

TF Systems for Non-Contact Film Thickness Measurements. We offer a complete line of film thickness measurement systems that can measure from 5 nm to 200 ┬Ám for analysis of single layer and/or multilayer films in less than a second. StellarNet thin film reflectometry systems consist of a portable USB... [See More]

  • Applications: Wafer (optional feature); CVD / PVD (optional feature); Polishing / CMP (optional feature); Polymer or photoresist films (optional feature); Thin-Film Photovoltaics
  • Technology: Reflectometer
  • Form Factor: Monitor or instrument
  • Measurements: FilmThickness (optional feature); WaferThickness (optional feature)
Automated Cassette-to-Cassette Thin Film Thickness Mapping System -- F60-c Series
from Filmetrics, Inc.

Automated Cassette-to-Cassette Thin-Film Thickness Mapping System for Production Environments. The Filmetrics F60-c family maps film thickness and index just like our F50 products, but it also includes a number of features intended specifically for production environments. These include automatic... [See More]

  • Applications: Wafer; CVD / PVD
  • Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); Spectral Reflectance
  • Form Factor: Monitor or instrument
  • Measurements: Area mapping
IFG200 Fast Atom Bombardment Ion Gun
from Hiden Analytical

State of the art FAB / ion gun for surface and depth analysis applications [See More]

  • Applications: Wafer; CVD / PVD
  • Technology: FIB; Spectrometer (SIMS, XRF, FTIR, DLTS, AAS)
  • Form Factor: Ion Beam Gun
  • Measurements: Defects, dimples or film residues; Area mapping (optional feature); DepthProfiling
Focused Ion Beam System -- FB-2200
from Hitachi High Technologies America, Inc.

The FB2200 allows for rapid and precise specimen preparation for both transmission and scanning electron microscopy of semiconductors and other advanced materials. High precision and high milling rates. The use of a new low aberration ion optical system allows a maximum beam current of 60nA at an... [See More]

  • Applications: Wafer; CVD / PVD
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Technology: FIB
ASET-F5x
from KLA-Tencor Corporation

The ASET-F5x thin film metrology system can measure materials across a continuous wavelength spectrum from 190 nm to 800 nm —a critical feature for meeting the stringent thin film measurement requirements down to 0.1 micron geometries. Accurate measurements of complex multi-layer thin film... [See More]

  • Applications: Wafer; CVD / PVD; Polishing / CMP; Photolithography
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Technology: Ellipsometer
CRTM Series -- CRTM-6000
from ULVAC Technologies, Inc.

High resolution, high speed sampling, long life span [See More]

  • Applications: Wafer; CVD / PVD
  • Measurements: FilmThickness
  • Form Factor: Monitor or instrument; Controller
  • Features: Noncontact; Non-destructive
Auto Focus & Tracking System -- ATF-6CM
from WDI Wise Device Inc.

WDI's Laser Auto-Focus ATF6 sensor is an active optical device (incorporating a class II semiconductor laser) designed to provide focusing servo systems with fast feedback signals needed to quickly and accurately focus all types of infinity corrected microscopes. [See More]

  • Applications: Wafer; CVD / PVD; Photolithography
  • Technology: Optical / Imaging
  • Form Factor: Sensor or sensing element
  • Features: Noncontact; Non-destructive
EDXRF Analyzer -- EX-6600 SDD
from Xenemetrix Ltd.

EX-6600 SDD. Secondary Target EDXRF. Xenemetrix ’s EX-6600 SDD Energy Dispersive X-ray Fluorescence (EDXRF) spectrometer offers the ultimate in sensitivity and selectivity. The Silicon Drift Detector (SDD) simultaneously delivers lower electronic noise and higher count rates which translates... [See More]

  • Applications: Wafer; CVD / PVD; Electroplate
  • Mounting / Loading: Manual loading; Floor
  • Form Factor: Monitor or instrument
  • Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); EDXRF
Metrology System -- Z3D-7000 Series
from Zygo Corporation

Simultaneously measures multiple parameters [See More]

  • Applications: Wafer; CVD / PVD; Electroplate; Polishing / CMP; Photolithography; Bumping Processes
  • Mounting / Loading: In-line; Floor
  • Form Factor: Monitor or instrument
  • Technology: Profilometer or AFM; Optical / Imaging; Interferometer